XC2V4000-6FFG1517C

The XC2V4000-6FFG1517C is a Virtex®-II field programmable gate array in a 1517-ball flip-chip BGA (1517-FCBGA) package designed for high-density, high-I/O FPGA applications. Built on the Virtex-II platform architecture, this commercial-grade device combines a large logic resource pool with substantial on-chip memory and flexible I/O to support complex digital designs.

This device is suited to designs requiring significant logic capacity, abundant embedded RAM, and broad I/O capability while operating within standard commercial temperature and supply ranges.

Key Features

• Logic Capacity Approximately 51,840 logic elements and around 5,760 configurable logic blocks (CLBs) to implement large, complex logic functions.
• Embedded Memory Approximately 2.21 Mbits of on-chip RAM (SelectRAM architecture) to support data buffering, FIFOs, and distributed memory structures.
• Gate Equivalent Approximately 4,000,000 system gates for mapping large HDL designs and IP.
• High I/O Count 912 user I/O pins provided in the 1517-FCBGA package, enabling extensive interfacing to external devices and subsystems.
• Arithmetic and DSP Primitives Includes dedicated multiplier resources (18-bit × 18-bit multiplier blocks) suitable for arithmetic and DSP functions as defined by the Virtex-II platform.
• Clock Management Virtex-II platform features include Digital Clock Manager (DCM) capabilities for clock de-skew and frequency synthesis.
• Package and Mounting 1517-BBGA / 1517-FCBGA (40 × 40) flip-chip BGA package, designed for surface-mount assembly.
• Power and Temperature Device supply voltage range 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C (commercial grade).
• Environmental Compliance RoHS compliant.

Typical Applications

• High-density logic systems — Implement complex control, state machines, and glue logic where large numbers of logic elements are required.
• Memory-intensive designs — Use the approximately 2.21 Mbits of embedded RAM for packet buffering, FIFOs, or on-chip data storage.
• High-I/O interfaces — Leverage 912 I/Os for board-level aggregation, peripheral connectivity, and multi-channel I/O implementations.
• Arithmetic and signal processing — Employ the on-chip multiplier blocks and FPGA fabric for custom DSP pipelines and fixed-point arithmetic acceleration.

Unique Advantages

• Substantial logic density: Approximately 51,840 logic elements enable consolidation of large designs into a single FPGA, reducing part count and board complexity.
• Significant embedded memory: Approximately 2.21 Mbits of SelectRAM-style on-chip memory supports data buffering and local storage without external RAM for many use cases.
• Extensive I/O capability: 912 user I/Os in the 1517-FCBGA package provide broad connectivity options for sensors, memories, and high-pin-count peripherals.
• Commercial-grade operation: Designed for standard commercial environments with a 0 °C to 85 °C operating range and RoHS compliance for regulatory alignment.
• Flip-chip BGA package: 1517-FCBGA (40 × 40) offers a high pin density and a compact footprint for space-constrained boards.

Why Choose XC2V4000-6FFG1517C?

The XC2V4000-6FFG1517C delivers a balance of high logic capacity, ample embedded memory, and extensive I/O in a commercial-grade Virtex-II FPGA. Its combination of approximately 51,840 logic elements, ~2.21 Mbits of on-chip RAM, and 912 I/Os makes it well suited for complex digital systems that require significant on-chip resources without moving to multiple devices.

Engineers and procurement teams targeting scalable logic integration, dense I/O routing, and on-chip memory for buffering or DSP tasks will find this device appropriate for a wide range of board- and system-level designs backed by the Virtex-II platform features.

Request a quote or submit an inquiry to receive pricing, availability, and additional procurement details for the XC2V4000-6FFG1517C.