XC2V4000-5FFG1152C

The XC2V4000-5FFG1152C is a Virtex®-II field programmable gate array (FPGA) in a 1152‑ball FCBGA package designed for commercial applications. It integrates a high-density logic fabric with extensive on-chip memory and a large I/O complement to support complex digital functions and high-bandwidth interfaces.

With approximately 51,840 logic elements, roughly 2.21 Mbits of embedded memory, and 824 user I/Os, this device is targeted at designs that require significant logic capacity, flexible memory resources, and broad connectivity while operating within a 1.425 V–1.575 V supply range and a 0 °C to 85 °C commercial temperature range.

Key Features

• Logic Density — Approximately 51,840 logic elements and a system gate count of 4,000,000 provide substantial programmable logic capacity for complex designs.
• Embedded Memory — Approximately 2.21 Mbits of on-chip RAM across the device’s SelectRAM resources for local storage and buffering.
• I/O Capacity and Flexibility — 824 user I/Os support broad external interface options and high pin-count connectivity in a single package.
• Arithmetic and DSP Support — Architecture-level support for dedicated multiplier resources and fast arithmetic functions (series-level feature) to accelerate signal-processing tasks.
• Clocking and Timing — Digital Clock Manager (DCM) functionality in the Virtex‑II platform (series-level) enables precise clock control and phase/frequency management for synchronous systems.
• Package and Mounting — 1152‑BBGA (1152‑FCBGA, 35×35 mm) surface-mount package for compact board integration and high I/O density.
• Power and Voltage — Single-core supply operation between 1.425 V and 1.575 V for the FPGA core.
• Commercial Grade and Compliance — Commercial temperature rating (0 °C to 85 °C) and RoHS compliance for regulatory and production needs.

Typical Applications

• Memory Interface Controllers — Large I/O count and on-chip SelectRAM memory make the device suitable for implementing SDR/DDR memory controllers and high-performance external-memory interfaces.
• Signal Processing and DSP — Embedded memory and architecture-level multiplier support enable implementation of filtering, transforms, and other arithmetic-heavy functions.
• High-Bandwidth I/O Systems — Extensive I/O capacity supports applications requiring broad parallel connectivity or multiple serial interfaces.
• System Integration and Prototyping — High logic capacity and broad I/O simplify consolidation of multiple functions into a single FPGA for platform development and system prototyping.

Unique Advantages

• High Logic Capacity: Approximately 51,840 logic elements and a 4,000,000-gate equivalent enable complex designs without excessive partitioning across devices.
• Substantial On-Chip RAM: Approximately 2.21 Mbits of embedded memory supports local buffering, FIFOs, and memory-centric architectures to reduce external memory dependence.
• Extensive I/O: 824 available I/Os in a single package provide flexibility for multi-channel interfaces and dense connectivity requirements.
• Compact, High‑Density Package: 1152‑ball FCBGA (35×35) package delivers high pin count in a compact footprint for space-constrained boards.
• Commercial Readiness: RoHS compliance and a 0 °C to 85 °C operating range align with mainstream commercial production and deployment requirements.
• Platform Ecosystem: The Virtex‑II platform includes architecture features such as SelectRAM, dedicated multipliers, and digital clock management that support development of memory interfaces and arithmetic-intensive functions.

Why Choose XC2V4000-5FFG1152C?

The XC2V4000-5FFG1152C balances high programmable logic density, substantial embedded memory, and a large I/O count in a single commercial-grade FCBGA package. It is well suited to engineers consolidating complex logic, memory controllers, and high-bandwidth interfaces into a single FPGA-based solution.

Designed on the Virtex‑II platform, the device benefits from platform-level features such as SelectRAM resources, dedicated arithmetic support, and clock management capabilities that accelerate development of compute- and I/O-intensive systems while maintaining a compact board footprint.

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