XC2V3000-6FGG676C

IC FPGA 484 I/O 676FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 484 1769472 676-BGA

Quantity 1,388 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BGANumber of I/O484Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3584Number of Logic Elements/Cells32256
Number of Gates3000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1769472

Overview of XC2V3000-6FGG676C – Virtex®-II FPGA IC, 484 I/O, 676-BGA

The XC2V3000-6FGG676C is a Virtex®-II field programmable gate array (FPGA) in a 676-ball fine-pitch BGA package. It provides a high-density, reconfigurable logic fabric with 32,256 logic elements and approximately 1.77 Mbits of embedded memory suitable for demanding digital designs.

Architected for applications that require flexible logic, high-performance arithmetic and memory interfaces, and advanced clock management, this commercial-grade device delivers a balance of integration and performance while operating from a core supply of 1.425 V to 1.575 V and an ambient range of 0 °C to 85 °C.

Key Features

  • Logic Resources  32,256 logic elements (cells) and 3,000,000 system gates provide substantial on-chip logic capacity for complex designs.
  • Embedded Memory  Approximately 1.77 Mbits of total on-chip RAM, supplied via 18-Kb block SelectRAM resources and distributed SelectRAM, enabling large buffering and on-chip storage.
  • High I/O Count & Package  484 user I/Os in a 676-BGA (676-FBGA, 27×27) package for dense board-level integration and broad interfacing options.
  • Clocking & Timing  Virtex-II platform clock-management features including Digital Clock Manager (DCM) modules and global clock multiplexer buffers for precise de-skew and flexible clocking.
  • Arithmetic & DSP Blocks  Dedicated 18-bit × 18-bit multiplier blocks and fast carry chains support high-throughput arithmetic and DSP functions.
  • Advanced I/O Capabilities  Platform features such as Digitally Controlled Impedance (DCI) and multi-standard I/O support enable robust signal integrity and a variety of signaling standards.
  • Power & Supply  Core voltage supply range of 1.425 V to 1.575 V to match system power rails and design requirements.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial applications.
  • RoHS Compliant  Device meets RoHS requirements.

Typical Applications

  • High-performance memory interfaces  Use the device's embedded RAM and high-speed I/O to implement SDR/DDR memory controllers and custom memory subsystems.
  • DSP and signal processing  Leverage dedicated 18×18 multipliers and abundant logic elements for arithmetic-heavy signal processing pipelines.
  • Custom protocol and interface bridging  Implement protocol conversion, bus bridging, and bespoke I/O handling using the device’s flexible I/O and routing resources.
  • System prototyping and integration  Employ the reconfigurable fabric for hardware acceleration, system integration tasks, and rapid design iteration.

Unique Advantages

  • Highly integrated logic and memory: Combines 32,256 logic elements with approximately 1.77 Mbits of embedded RAM to reduce external memory needs and simplify board design.
  • Rich clock management: Multiple DCM and global clock buffer resources enable precise clocking architectures and low-skew distribution for synchronous systems.
  • Dedicated arithmetic hardware: On-chip 18×18 multipliers and fast carry chains accelerate DSP and calculation-intensive functions without consuming general-purpose logic.
  • Flexible, high-density I/O: 484 I/Os in a 676-BGA package allow dense interfacing options for multi-channel systems and complex board layouts.
  • Commercial temperature and RoHS compliance: Suited for commercial deployments with environmental compliance for streamlined procurement.

Why Choose XC2V3000-6FGG676C?

The XC2V3000-6FGG676C positions itself as a versatile Virtex-II FPGA that balances on-chip logic, embedded memory, and dedicated arithmetic resources for applications requiring substantial programmable capacity. Its comprehensive platform features—clock management, SelectRAM memory hierarchy, and advanced I/O capabilities—support complex interface, signal processing, and integration tasks within a commercial temperature range.

This device is appropriate for engineers and teams designing mid-to-high complexity digital systems who need reconfigurable hardware with robust development toolchain support and a proven FPGA architecture for scalable system implementation.

Request a quote or submit an inquiry to obtain pricing, availability, and technical assistance for the XC2V3000-6FGG676C.

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