XC2V3000-6FGG676C
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 484 1769472 676-BGA |
|---|---|
| Quantity | 1,388 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 484 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3584 | Number of Logic Elements/Cells | 32256 | ||
| Number of Gates | 3000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1769472 |
Overview of XC2V3000-6FGG676C – Virtex®-II FPGA IC, 484 I/O, 676-BGA
The XC2V3000-6FGG676C is a Virtex®-II field programmable gate array (FPGA) in a 676-ball fine-pitch BGA package. It provides a high-density, reconfigurable logic fabric with 32,256 logic elements and approximately 1.77 Mbits of embedded memory suitable for demanding digital designs.
Architected for applications that require flexible logic, high-performance arithmetic and memory interfaces, and advanced clock management, this commercial-grade device delivers a balance of integration and performance while operating from a core supply of 1.425 V to 1.575 V and an ambient range of 0 °C to 85 °C.
Key Features
- Logic Resources 32,256 logic elements (cells) and 3,000,000 system gates provide substantial on-chip logic capacity for complex designs.
- Embedded Memory Approximately 1.77 Mbits of total on-chip RAM, supplied via 18-Kb block SelectRAM resources and distributed SelectRAM, enabling large buffering and on-chip storage.
- High I/O Count & Package 484 user I/Os in a 676-BGA (676-FBGA, 27×27) package for dense board-level integration and broad interfacing options.
- Clocking & Timing Virtex-II platform clock-management features including Digital Clock Manager (DCM) modules and global clock multiplexer buffers for precise de-skew and flexible clocking.
- Arithmetic & DSP Blocks Dedicated 18-bit × 18-bit multiplier blocks and fast carry chains support high-throughput arithmetic and DSP functions.
- Advanced I/O Capabilities Platform features such as Digitally Controlled Impedance (DCI) and multi-standard I/O support enable robust signal integrity and a variety of signaling standards.
- Power & Supply Core voltage supply range of 1.425 V to 1.575 V to match system power rails and design requirements.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for commercial applications.
- RoHS Compliant Device meets RoHS requirements.
Typical Applications
- High-performance memory interfaces Use the device's embedded RAM and high-speed I/O to implement SDR/DDR memory controllers and custom memory subsystems.
- DSP and signal processing Leverage dedicated 18×18 multipliers and abundant logic elements for arithmetic-heavy signal processing pipelines.
- Custom protocol and interface bridging Implement protocol conversion, bus bridging, and bespoke I/O handling using the device’s flexible I/O and routing resources.
- System prototyping and integration Employ the reconfigurable fabric for hardware acceleration, system integration tasks, and rapid design iteration.
Unique Advantages
- Highly integrated logic and memory: Combines 32,256 logic elements with approximately 1.77 Mbits of embedded RAM to reduce external memory needs and simplify board design.
- Rich clock management: Multiple DCM and global clock buffer resources enable precise clocking architectures and low-skew distribution for synchronous systems.
- Dedicated arithmetic hardware: On-chip 18×18 multipliers and fast carry chains accelerate DSP and calculation-intensive functions without consuming general-purpose logic.
- Flexible, high-density I/O: 484 I/Os in a 676-BGA package allow dense interfacing options for multi-channel systems and complex board layouts.
- Commercial temperature and RoHS compliance: Suited for commercial deployments with environmental compliance for streamlined procurement.
Why Choose XC2V3000-6FGG676C?
The XC2V3000-6FGG676C positions itself as a versatile Virtex-II FPGA that balances on-chip logic, embedded memory, and dedicated arithmetic resources for applications requiring substantial programmable capacity. Its comprehensive platform features—clock management, SelectRAM memory hierarchy, and advanced I/O capabilities—support complex interface, signal processing, and integration tasks within a commercial temperature range.
This device is appropriate for engineers and teams designing mid-to-high complexity digital systems who need reconfigurable hardware with robust development toolchain support and a proven FPGA architecture for scalable system implementation.
Request a quote or submit an inquiry to obtain pricing, availability, and technical assistance for the XC2V3000-6FGG676C.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








