XC2V3000-5FGG676C

IC FPGA 484 I/O 676FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 484 1769472 676-BGA

Quantity 393 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BGANumber of I/O484Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3584Number of Logic Elements/Cells32256
Number of Gates3000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1769472

Overview of XC2V3000-5FGG676C – Virtex®-II Field Programmable Gate Array (FPGA) IC 484 1769472 676-BGA

The XC2V3000-5FGG676C is a commercial-grade Virtex®-II platform FPGA supplied by AMD. It delivers a high-capacity, configurable logic fabric with 32,256 logic elements and 3,584 configurable logic blocks (CLBs), making it suitable for complex logic integration and custom digital designs.

Built around the Virtex-II architecture, this device combines a SelectRAM memory hierarchy, dedicated arithmetic resources and flexible I/O to support high-performance interfaces, arithmetic-heavy processing and dense system integration in commercial embedded applications.

Key Features

  • Logic Capacity  32,256 logic elements and 3,584 CLBs provide substantial programmable logic for medium-to-large designs; the device is rated at approximately 3,000,000 system gates.
  • Embedded Memory  Approximately 1.77 Mbits of on-chip RAM (1,769,472 total RAM bits) using the SelectRAM memory hierarchy for dual-port and distributed RAM resources.
  • Arithmetic Resources  Dedicated multiplier blocks for 18-bit × 18-bit multiplication accelerate DSP and arithmetic-intensive functions.
  • I/O and Interface Flexibility  484 user I/O pins in a 676-BGA package support a wide range of external interfaces and system-level connectivity.
  • Clock Management  Includes support for Digital Clock Manager (DCM) modules and global clock buffers for precise clocking and deskew (series feature).
  • Package and Mounting  Available in a 676-ball fine-pitch BGA (676-FBGA, 27×27) package, surface-mount compatible for modern PCB assembly.
  • Power and Operating Range  Core voltage supply range: 1.425 V to 1.575 V. Operating temperature range: 0 °C to 85 °C (commercial grade).
  • Standards and Compliance  RoHS compliant for environmental regulatory requirements.

Typical Applications

  • High‑performance memory interfaces  Use the device's SelectRAM architecture and abundant logic to implement SDR/DDR memory controllers and custom DRAM/SRAM interfaces.
  • Signal processing and DSP  Dedicated multiplier blocks and substantial on-chip RAM support DSP functions such as filtering, transforms and arithmetic pipelines.
  • Custom I/O and protocol bridging  High I/O count and flexible I/O standards enable protocol conversion, bus bridging and custom peripheral interfaces in embedded systems.
  • System prototyping and integration  The Virtex‑II series feature set supports integration of multiple system functions—control logic, interface controllers and data-paths—into a single programmable device.

Unique Advantages

  • High integration density: Consolidate complex logic functions and reduce board-level BOM by implementing controllers, interfaces and processing blocks in a single FPGA.
  • Balanced memory and logic resources: Approximately 1.77 Mbits of embedded RAM combined with 32,256 logic elements enable efficient on-chip buffering and state-machine implementation.
  • Dedicated arithmetic blocks: 18-bit × 18-bit multipliers accelerate math-intensive workloads without consuming general-purpose logic.
  • Flexible packaging: The 676-FBGA (27×27) package provides a high-pin-count surface-mount solution for dense board designs requiring many I/Os.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C, matching many embedded and commercial applications.
  • Regulatory readiness: RoHS compliance simplifies selection for environmentally conscious designs.

Why Choose XC2V3000-5FGG676C?

The XC2V3000-5FGG676C combines substantial logic capacity, embedded memory and dedicated arithmetic resources within a high-pin-count BGA package—offering a balanced platform for designers tackling complex control, interface and signal-processing tasks in commercial products. Its voltage and temperature ratings make it suitable for standard embedded environments where commercial-grade components are specified.

As part of the Virtex‑II platform, this FPGA brings architecture-level features such as SelectRAM memory hierarchy and on-chip clock management that help streamline implementation of high-performance interfaces and DSP functions while maintaining a compact system footprint.

Request a quote or submit an inquiry to get pricing, availability and technical support details for the XC2V3000-5FGG676C. Our team can help evaluate fit for your design and provide ordering information.

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