XC2V3000-5FGG676C
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 484 1769472 676-BGA |
|---|---|
| Quantity | 393 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 484 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3584 | Number of Logic Elements/Cells | 32256 | ||
| Number of Gates | 3000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1769472 |
Overview of XC2V3000-5FGG676C – Virtex®-II Field Programmable Gate Array (FPGA) IC 484 1769472 676-BGA
The XC2V3000-5FGG676C is a commercial-grade Virtex®-II platform FPGA supplied by AMD. It delivers a high-capacity, configurable logic fabric with 32,256 logic elements and 3,584 configurable logic blocks (CLBs), making it suitable for complex logic integration and custom digital designs.
Built around the Virtex-II architecture, this device combines a SelectRAM memory hierarchy, dedicated arithmetic resources and flexible I/O to support high-performance interfaces, arithmetic-heavy processing and dense system integration in commercial embedded applications.
Key Features
- Logic Capacity 32,256 logic elements and 3,584 CLBs provide substantial programmable logic for medium-to-large designs; the device is rated at approximately 3,000,000 system gates.
- Embedded Memory Approximately 1.77 Mbits of on-chip RAM (1,769,472 total RAM bits) using the SelectRAM memory hierarchy for dual-port and distributed RAM resources.
- Arithmetic Resources Dedicated multiplier blocks for 18-bit × 18-bit multiplication accelerate DSP and arithmetic-intensive functions.
- I/O and Interface Flexibility 484 user I/O pins in a 676-BGA package support a wide range of external interfaces and system-level connectivity.
- Clock Management Includes support for Digital Clock Manager (DCM) modules and global clock buffers for precise clocking and deskew (series feature).
- Package and Mounting Available in a 676-ball fine-pitch BGA (676-FBGA, 27×27) package, surface-mount compatible for modern PCB assembly.
- Power and Operating Range Core voltage supply range: 1.425 V to 1.575 V. Operating temperature range: 0 °C to 85 °C (commercial grade).
- Standards and Compliance RoHS compliant for environmental regulatory requirements.
Typical Applications
- High‑performance memory interfaces Use the device's SelectRAM architecture and abundant logic to implement SDR/DDR memory controllers and custom DRAM/SRAM interfaces.
- Signal processing and DSP Dedicated multiplier blocks and substantial on-chip RAM support DSP functions such as filtering, transforms and arithmetic pipelines.
- Custom I/O and protocol bridging High I/O count and flexible I/O standards enable protocol conversion, bus bridging and custom peripheral interfaces in embedded systems.
- System prototyping and integration The Virtex‑II series feature set supports integration of multiple system functions—control logic, interface controllers and data-paths—into a single programmable device.
Unique Advantages
- High integration density: Consolidate complex logic functions and reduce board-level BOM by implementing controllers, interfaces and processing blocks in a single FPGA.
- Balanced memory and logic resources: Approximately 1.77 Mbits of embedded RAM combined with 32,256 logic elements enable efficient on-chip buffering and state-machine implementation.
- Dedicated arithmetic blocks: 18-bit × 18-bit multipliers accelerate math-intensive workloads without consuming general-purpose logic.
- Flexible packaging: The 676-FBGA (27×27) package provides a high-pin-count surface-mount solution for dense board designs requiring many I/Os.
- Commercial temperature suitability: Rated for 0 °C to 85 °C, matching many embedded and commercial applications.
- Regulatory readiness: RoHS compliance simplifies selection for environmentally conscious designs.
Why Choose XC2V3000-5FGG676C?
The XC2V3000-5FGG676C combines substantial logic capacity, embedded memory and dedicated arithmetic resources within a high-pin-count BGA package—offering a balanced platform for designers tackling complex control, interface and signal-processing tasks in commercial products. Its voltage and temperature ratings make it suitable for standard embedded environments where commercial-grade components are specified.
As part of the Virtex‑II platform, this FPGA brings architecture-level features such as SelectRAM memory hierarchy and on-chip clock management that help streamline implementation of high-performance interfaces and DSP functions while maintaining a compact system footprint.
Request a quote or submit an inquiry to get pricing, availability and technical support details for the XC2V3000-5FGG676C. Our team can help evaluate fit for your design and provide ordering information.

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Certifications and Memberships: ISO9001:2015, RoHS, REACH








