XC2V3000-5FFG1152I

IC FPGA 720 I/O 1152FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 720 1769472 1152-BBGA, FCBGA

Quantity 1,651 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O720Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs3584Number of Logic Elements/Cells32256
Number of Gates3000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1769472

Overview of XC2V3000-5FFG1152I – Virtex®-II Field Programmable Gate Array (FPGA)

The XC2V3000-5FFG1152I is a Virtex®-II platform FPGA from AMD designed for high-density, configurable logic implementations. Built around the Virtex-II architecture, it combines a large complement of configurable logic blocks, embedded memory, and high-performance I/O to address demanding embedded and signal-processing applications.

With industrial-grade temperature range and a 1152‑FCPBGA package, this device targets system designs that require substantial logic capacity, extensive I/O, and flexible memory and arithmetic resources while maintaining supply and thermal margins suitable for industrial environments.

Key Features

  • Configurable Logic — 3,584 configurable logic blocks (CLBs) providing 32,256 logic cells and approximately 3,000,000 system gates for complex logic realization.
  • Embedded Memory — Approximately 1.769 Mbits of on-chip RAM (total RAM bits: 1,769,472) for local data storage, buffering, and high-throughput designs.
  • High-Density I/O — 720 user I/O pins to support broad external interfacing and parallel data paths; SelectIO and I/O standard flexibility are part of the Virtex-II feature set.
  • Arithmetic Blocks — Dedicated 18-bit × 18-bit multiplier resources for efficient implementation of DSP and arithmetic-heavy functions.
  • Clock Management — Virtex-II platform includes Digital Clock Manager (DCM) support and global clock routing options to simplify clocking and timing distribution.
  • Package & Mounting — 1152‑FBGA (1152‑FCBGA, 35 × 35) flip‑chip BGA package, surface-mountable for compact board-level integration.
  • Power and Voltage — Core supply voltage specified at 1.425 V to 1.575 V for predictable power budgeting.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial applications.
  • Standards & Reliability — RoHS compliant and built on the Virtex-II platform with established architecture and development ecosystem.

Typical Applications

  • High‑performance embedded systems — Implement complex control logic, accelerators, or glue logic requiring dense configurable logic and substantial on-chip RAM.
  • Signal processing and DSP — Use the dedicated 18×18 multipliers and local RAM to implement filters, transforms, and custom data-paths.
  • Memory interface bridging — Leverage abundant I/O and on-chip memory to build SDR/DDR or SRAM interface controllers and buffering schemes.
  • Custom hardware acceleration — Offload compute-critical functions to hardware implementations using the large CLB and logic cell count.

Unique Advantages

  • Large configurable capacity: 3,584 CLBs and 32,256 logic cells provide the headroom to implement complex, multi-function designs on a single device.
  • Built‑in memory resources: Approximately 1.769 Mbits of embedded RAM reduce external memory dependency and improve data locality for higher throughput.
  • Extensive external connectivity: 720 user I/Os enable broad external device support and high-bandwidth parallel interfaces.
  • Integrated arithmetic support: Dedicated multiplier blocks accelerate DSP workloads and reduce usage of fabric resources for arithmetic-heavy logic.
  • Industrial readiness: Rated for −40 °C to 100 °C operation and RoHS compliant for deployment in industrial environments.
  • Controlled supply requirements: Narrow core voltage range (1.425 V–1.575 V) simplifies power-supply planning and margin analysis.

Why Choose XC2V3000-5FFG1152I?

The XC2V3000-5FFG1152I combines the Virtex‑II platform’s configurable logic, embedded memory, and arithmetic resources in a package designed for dense, high‑I/O system designs. Its balance of logic capacity, on-chip RAM, and dedicated DSP resources makes it well suited for applications that need on‑device acceleration, complex protocol handling, or high‑throughput data paths.

For engineering teams targeting industrial deployments that require predictable supply and thermal ranges, this device offers a proven architecture and the integration needed to reduce board-level complexity and speed time to prototype and production.

Request a quote or submit an inquiry for pricing and availability of the XC2V3000-5FFG1152I to evaluate fit for your next design.

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