XC2V3000-5BF957I

IC FPGA 684 I/O 957FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 684 1769472 957-BBGA, FCBGA

Quantity 618 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package957-FCBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case957-BBGA, FCBGANumber of I/O684Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs3584Number of Logic Elements/Cells32256
Number of Gates3000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1769472

Overview of XC2V3000-5BF957I – Virtex®-II FPGA, 957-BBGA (FCBGA)

The XC2V3000-5BF957I is a Virtex®-II field programmable gate array (FPGA) in a 957-ball flip-chip BGA (FCBGA) package. It delivers substantial reconfigurable logic capacity, on-chip embedded memory, and a high I/O count for complex, high-density designs.

Designed for industrial-grade applications, this surface-mount FPGA combines large logic capacity and extensive I/O with industry platform features such as SelectRAM memory resources, dedicated arithmetic blocks, and digital clock management to support demanding embedded and system-level implementations.

Key Features

  • Logic Capacity — 32,256 logic elements providing significant programmable logic for control, processing, and glue logic functions; approximately 3,000,000 system gates.
  • Embedded Memory — Approximately 1.77 Mbits of on-chip RAM (1,769,472 total bits) distributed across 18-Kb SelectRAM block resources for dual-port and distributed memory architectures.
  • I/O — 684 user I/Os to support wide external interfacing and parallel bus implementations.
  • Arithmetic and DSP — Virtex-II platform includes dedicated 18-bit × 18-bit multiplier blocks for efficient arithmetic and DSP operations.
  • Clock Management — Includes Digital Clock Manager (DCM) functionality from the Virtex-II platform for clock de-skew, frequency synthesis, and phase shifting.
  • Package & Mounting — 957-ball FCBGA (40 × 40 mm) package, surface-mountable for standard PCB assembly processes.
  • Power Supply — Core supply range of 1.425 V to 1.575 V, supporting stable operation within the specified voltage window.
  • Operating Temperature — Industrial temperature grade: –40 °C to 100 °C for reliable performance across a wide thermal range.
  • Standards & I/O Flexibility (Platform) — Virtex-II SelectIO features and I/O standards (described in the platform datasheet) support multiple single-ended and differential signaling options and on-chip termination options.
  • Compliance — RoHS compliant.

Typical Applications

  • Memory interface controllers — Implement DRAM/DDR and SRAM interface logic using the device’s embedded memory resources and platform memory-interface features.
  • High-density glue logic — Replace large discrete logic stacks with reconfigurable logic for board-level control, protocol bridging, and timing adaptation.
  • DSP and arithmetic engines — Use dedicated 18-bit × 18-bit multipliers and embedded RAM to accelerate arithmetic-heavy functions and signal processing kernels.
  • Multi-I/O system integration — Leverage 684 user I/Os to consolidate multiple peripheral interfaces and parallel buses into a single programmable device.

Unique Advantages

  • High integration density: 32,256 logic elements and approximately 1.77 Mbits of embedded RAM reduce external component count and simplify system design.
  • Broad I/O capacity: 684 user I/Os enable consolidation of multiple interfaces and complex board-level connectivity without additional I/O expanders.
  • Industrial temperature rating: –40 °C to 100 °C operating range supports deployment in environments requiring extended temperature tolerance.
  • Platform-level feature set: Virtex-II architecture provides SelectRAM resources, dedicated multipliers, and clock management capabilities for flexible system architectures.
  • Standards-compliant packaging and assembly: 957-ball FCBGA surface-mount package facilitates standard manufacturing and PCB assembly workflows.
  • Regulatory readiness: RoHS compliance simplifies environmental and regulatory considerations for product design.

Why Choose XC2V3000-5BF957I?

The XC2V3000-5BF957I positions itself as a high-density, industrial-grade Virtex®-II FPGA option for engineers requiring large reconfigurable logic capacity, generous embedded memory, and extensive I/O in a single surface-mount package. Its core voltage range, industrial temperature rating, and platform features make it suitable for demanding embedded and system-level designs that need stable, reprogrammable hardware resources.

For teams designing scalable, long-lived systems, this FPGA offers a combination of logic density, memory resources, and platform-level capabilities that support complex interfacing, signal processing, and control tasks while simplifying board-level integration and reducing overall BOM complexity.

Request a quote or submit an availability inquiry for the XC2V3000-5BF957I to receive pricing and lead-time information tailored to your project requirements.

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