XC2V3000-4FG676I

The XC2V3000-4FG676I is a Virtex®-II platform FPGA supplied by AMD, designed for high-density programmable logic, memory integration and extensive I/O. It combines thousands of configurable logic resources with substantial on-chip memory and a large I/O count to address complex embedded, communications and industrial control designs.

With 3,584 configurable logic blocks, approximately 32,256 logic elements and roughly 1.77 Mbits of embedded memory, this device supports designs that require significant logic capacity, multi-megabit on-chip RAM and dense external interfacing.

Key Features

• Logic Capacity  3,584 configurable logic blocks (CLBs) and 32,256 logic elements provide substantial programmable logic resources for complex algorithms and custom datapaths.
• On-chip Memory  Approximately 1.77 Mbits of total on-chip RAM (1,769,472 bits) for embedded buffering, FIFOs and state storage.
• Gate Count  3,000,000 system gates enabling higher integration of functions within a single device.
• I/O Density  484 user I/O pins support wide external interfacing and high-pin-count system integration.
• Package and Mounting  676-BGA package (supplier package: 676-FBGA, 27×27) with surface-mount mounting type for compact board-level integration.
• Power Supply  Core voltage range 1.425 V to 1.575 V for targeted power rail design and supply planning.
• Operating Range  Industrial-grade operating temperature from −40°C to 100°C for robust operation in demanding environments.
• Standards & Compliance  RoHS compliant to meet contemporary environmental and assembly requirements.
• Virtex-II Platform Features (series-level)  Series documentation describes SelectRAM block resources, dedicated multiplier blocks and digital clock management features common to the Virtex-II family for advanced clocking and arithmetic functions.

Typical Applications

• Embedded Systems  Use the device to implement custom control logic, protocol processing and hardware acceleration where large logic capacity and on-chip RAM reduce external component count.
• Communications Equipment  High I/O density and substantial logic resources enable multi-channel interfacing, packet processing and protocol bridging in network and telecom systems.
• Memory Interface Controllers  On-chip RAM and Virtex-II family memory features make it suitable for building SDR/DDR interface logic, buffering and memory controllers.
• Industrial Control  Industrial temperature rating and robust integration of logic, memory and I/O support motor control, sensor aggregation and factory automation subsystems.

Unique Advantages

• High integration density: Consolidate logic, memory and I/O into a single 676-BGA FPGA to reduce board-level BOM and interconnect complexity.
• Substantial on-chip RAM: Approximately 1.77 Mbits of embedded memory supports large internal buffers and state machines without external RAM.
• Extensive I/O capability: 484 user I/Os enable wide parallel interfaces and numerous peripheral connections directly to the FPGA.
• Industrial temperature support: Rated from −40°C to 100°C for use in temperature-challenging industrial applications.
• RoHS compliance: Meets environmental assembly requirements for modern manufacturing processes.

Why Choose XC2V3000-4FG676I?

The XC2V3000-4FG676I positions itself as a high-density, industrial-grade Virtex-II FPGA that balances large logic capacity, multi-megabit embedded memory and substantial I/O in a compact BGA package. It is suitable for designers who need to integrate complex digital functions, memory-heavy architectures and high-pin-count interfaces while maintaining qualification for industrial temperature ranges.

For projects requiring robust programmable logic with on-chip RAM and extensive external connectivity, this device offers a verifiable specification set that supports scalable system designs and dependable long-term deployment.

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