XC2V3000-4FF1152I

The XC2V3000-4FF1152I is a Virtex®-II field programmable gate array (FPGA) in a 1152-ball flip-chip BGA package. It combines a large logic resource count with significant embedded memory and a high I/O count to address demanding embedded, communications and system-integration tasks where density, I/O bandwidth and industrial temperature operation are required.

Based on the Virtex-II platform architecture, this device offers a comprehensive set of programmable logic, embedded memory and platform-level timing resources for designers requiring high integration and flexibility in industrial applications.

Key Features

• Logic Capacity  Approximately 32,256 logic elements (32256 logic element cells) for implementing complex digital functions and state machines.
• Embedded Memory  Approximately 1.77 Mbits of embedded memory (1,769,472 total RAM bits) suitable for FIFOs, buffers and on-chip storage.
• I/O Resources  720 user I/O pins allow dense external interfacing and a wide range of system connections.
• Arithmetic and DSP  Virtex-II platform includes dedicated 18-bit × 18-bit multiplier blocks for arithmetic and signal-processing functions (platform-level feature).
• Clocking and Timing  Platform-level Digital Clock Manager (DCM) capabilities and multiple global clock resources provide flexible clocking and deskew options for synchronous designs.
• Package & Mounting  1152-BBGA (1152-FCBGA, 35 × 35) surface-mount package for compact board implementation.
• Power and Supply  Operates from a core supply range of 1.425 V to 1.575 V.
• Temperature Grade  Industrial operating range from −40 °C to 100 °C for temperature-demanding environments.
• System Density  Approximately 3,000,000 gates of logic capacity for high-density system integration.
• Compliance  RoHS compliant.

Typical Applications

• High‑performance communications  Use the device’s large I/O count and embedded memory for protocol bridging, interface aggregation and packet processing in communications equipment.
• Memory interface and controller designs  Leverage platform SelectRAM and dedicated arithmetic blocks to implement DRAM/SRAM interface logic and data-path acceleration.
• Embedded and industrial systems  Industrial temperature rating and high logic/memory density make this FPGA suited for rugged embedded control, signal processing and automation tasks.
• Prototyping and system integration  High gate count and extensive I/O support rapid prototyping of complex SoC functions and board-level integration tasks.

Unique Advantages

• High logic density:  Over 32k logic elements provide the capacity to consolidate multiple functions into a single device, reducing BOM and board complexity.
• Substantial on‑chip memory:  Approximately 1.77 Mbits of embedded RAM supports large buffers and data-paths without external memory for many functions.
• Extensive I/O connectivity:  720 I/Os enable dense external interfacing for multi-channel systems and high-pin-count connectors.
• Industrial‑grade operation:  Rated for −40 °C to 100 °C operation to meet demanding environmental and industrial application needs.
• Platform-level timing and DSP features:  Virtex-II platform includes DCMs, global clock resources and dedicated multiplier blocks to simplify clock management and accelerate arithmetic tasks.
• Compact, surface-mount packaging:  1152-FCBGA package concentrates capability into a small footprint for space-constrained designs.

Why Choose XC2V3000-4FF1152I?

The XC2V3000-4FF1152I positions itself where significant programmable logic, embedded memory and extensive I/O must coexist in an industrial-temperature FPGA. Its mix of approximately 32k logic elements, 1.77 Mbits of on-chip RAM and 720 I/Os supports integration of complex control, data-path and interface functions onto a single device, helping reduce board-level component count and simplify system architecture.

This device is suitable for design teams building high-density embedded systems, communications interfaces and industrial controllers who need proven platform-level features such as SelectRAM memory hierarchy, dedicated multipliers and flexible clock management. The RoHS compliance and surface-mount FCBGA package make it appropriate for commercial manufacturing flows that require compact, lead-free components.

If you would like pricing, availability or a custom quote for XC2V3000-4FF1152I, request a quote or submit an inquiry and our team will respond with details tailored to your project requirements.