XC2V3000-4BF957I

IC FPGA 684 I/O 957FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 684 1769472 957-BBGA, FCBGA

Quantity 389 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package957-FCBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case957-BBGA, FCBGANumber of I/O684Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs3584Number of Logic Elements/Cells32256
Number of Gates3000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1769472

Overview of XC2V3000-4BF957I – Virtex®-II Field Programmable Gate Array (FPGA) IC 684 I/O, 957-FCBGA

The XC2V3000-4BF957I is a Virtex®-II platform FPGA from AMD, designed for high-density programmable logic and system integration. It combines a large logic fabric with embedded memory and a broad I/O complement to address demanding digital designs such as memory interfaces, signal processing, and high‑I/O protocol bridging.

Built on the Virtex‑II architecture, this device leverages platform-level capabilities—like SelectRAM memory hierarchy and clock management—while providing the specific device attributes of approximately 32,256 logic elements, 1.77 Mbits of embedded RAM, and 684 user I/Os in a 957‑FBGA surface‑mount package.

Key Features

  • Logic Capacity  Approximately 32,256 logic elements (32256 logic element cells) supporting designs up to roughly 3,000,000 system gates.
  • Embedded Memory  Approximately 1.77 Mbits of on‑chip RAM (1,769,472 total RAM bits) for buffers, FIFOs, and local storage.
  • I/O Density  684 user I/Os provide broad external connectivity for high‑pin‑count interfaces and multi‑lane protocols.
  • Arithmetic and DSP Resources  Virtex‑II platform includes dedicated 18‑bit × 18‑bit multiplier blocks and fast carry logic for arithmetic and signal‑processing tasks.
  • Memory Interface Support  Platform features include high‑performance DRAM and SRAM interface support, including SDR/DDR SDRAM and various SRAM types for external memory connectivity.
  • Clock and Timing  Digital Clock Manager (DCM) functionality on the Virtex‑II platform provides de‑skew, frequency synthesis, and phase shifting to support complex clocking schemes.
  • Package & Mounting  957‑BBGA (957‑FCBGA, 40×40) surface‑mount package; supplier device package listed as 957‑FCBGA (40×40).
  • Power and Supply  Specified core voltage supply range: 1.425 V to 1.575 V.
  • Operating Range & Grade  Industrial grade with operating temperature range −40°C to 100°C.
  • Standards & I/O Technology  Virtex‑II SelectIO technology and differential signaling support (family features) for a variety of single‑ended and differential standards.
  • RoHS Compliant  Device is listed as RoHS compliant.

Typical Applications

  • High‑Performance DSP and Accelerator Cards  Use the device’s embedded RAM and dedicated multipliers to implement filters, FFTs, and other arithmetic‑intensive blocks.
  • Memory Controllers and Interface Bridges  Leverage platform memory interface features to implement SDR/DDR memory controllers and high‑bandwidth buffering.
  • Communications and Networking  High I/O count and SelectIO‑capable signaling make the part suitable for protocol bridging, packet processing, and interface aggregation.
  • Industrial Control and Instrumentation  Industrial temperature rating (−40°C to 100°C) and a high pin count allow the device to serve as a central programmable controller in industrial systems.

Unique Advantages

  • High Logic Density: Approximately 32,256 logic elements enable integration of large finite‑state machines, datapaths, and control logic into a single device, reducing component count.
  • Substantial On‑Chip Memory: Approximately 1.77 Mbits of embedded RAM supports deep buffering and low‑latency local storage without relying solely on external memory.
  • Broad I/O Connectivity: 684 user I/Os provide flexibility for multi‑lane interfaces, large connector systems, and mixed signal standards at the board level.
  • Industrial Temperature Range: Specified −40°C to 100°C operation supports deployment in industrial environments requiring extended temperature tolerance.
  • Platform Feature Set: Virtex‑II platform capabilities—such as SelectRAM, DCMs, and dedicated multipliers—help accelerate development of memory interfaces, timing‑sensitive designs, and DSP functions.
  • Regulatory and Environmental Compliance: RoHS compliance supports environmental requirements for modern electronics manufacturing.

Why Choose XC2V3000-4BF957I?

The XC2V3000-4BF957I combines a high logic count, substantial embedded memory, and a large I/O count in a single industrial‑grade FCBGA package, making it well suited for designs that require integration of complex logic, high‑bandwidth interfaces, and on‑chip storage. Its Virtex‑II platform capabilities—clock management, dedicated multipliers, and SelectRAM hierarchy—provide a solid foundation for memory controllers, DSP accelerators, and communications subsystems.

This device is aimed at engineers and system designers who need a scalable, reliable FPGA solution with comprehensive platform features and datasheet support. The combination of performance‑oriented architecture, industrial operating range, and RoHS compliance offers long‑term usability across production and industrial deployments.

If you would like pricing or availability, request a quote or submit an inquiry to receive a formal quotation and lead‑time information for the XC2V3000-4BF957I.

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