XC2V3000-4BF957I
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 684 1769472 957-BBGA, FCBGA |
|---|---|
| Quantity | 389 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 957-FCBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 957-BBGA, FCBGA | Number of I/O | 684 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 3584 | Number of Logic Elements/Cells | 32256 | ||
| Number of Gates | 3000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1769472 |
Overview of XC2V3000-4BF957I – Virtex®-II Field Programmable Gate Array (FPGA) IC 684 I/O, 957-FCBGA
The XC2V3000-4BF957I is a Virtex®-II platform FPGA from AMD, designed for high-density programmable logic and system integration. It combines a large logic fabric with embedded memory and a broad I/O complement to address demanding digital designs such as memory interfaces, signal processing, and high‑I/O protocol bridging.
Built on the Virtex‑II architecture, this device leverages platform-level capabilities—like SelectRAM memory hierarchy and clock management—while providing the specific device attributes of approximately 32,256 logic elements, 1.77 Mbits of embedded RAM, and 684 user I/Os in a 957‑FBGA surface‑mount package.
Key Features
- Logic Capacity Approximately 32,256 logic elements (32256 logic element cells) supporting designs up to roughly 3,000,000 system gates.
- Embedded Memory Approximately 1.77 Mbits of on‑chip RAM (1,769,472 total RAM bits) for buffers, FIFOs, and local storage.
- I/O Density 684 user I/Os provide broad external connectivity for high‑pin‑count interfaces and multi‑lane protocols.
- Arithmetic and DSP Resources Virtex‑II platform includes dedicated 18‑bit × 18‑bit multiplier blocks and fast carry logic for arithmetic and signal‑processing tasks.
- Memory Interface Support Platform features include high‑performance DRAM and SRAM interface support, including SDR/DDR SDRAM and various SRAM types for external memory connectivity.
- Clock and Timing Digital Clock Manager (DCM) functionality on the Virtex‑II platform provides de‑skew, frequency synthesis, and phase shifting to support complex clocking schemes.
- Package & Mounting 957‑BBGA (957‑FCBGA, 40×40) surface‑mount package; supplier device package listed as 957‑FCBGA (40×40).
- Power and Supply Specified core voltage supply range: 1.425 V to 1.575 V.
- Operating Range & Grade Industrial grade with operating temperature range −40°C to 100°C.
- Standards & I/O Technology Virtex‑II SelectIO technology and differential signaling support (family features) for a variety of single‑ended and differential standards.
- RoHS Compliant Device is listed as RoHS compliant.
Typical Applications
- High‑Performance DSP and Accelerator Cards Use the device’s embedded RAM and dedicated multipliers to implement filters, FFTs, and other arithmetic‑intensive blocks.
- Memory Controllers and Interface Bridges Leverage platform memory interface features to implement SDR/DDR memory controllers and high‑bandwidth buffering.
- Communications and Networking High I/O count and SelectIO‑capable signaling make the part suitable for protocol bridging, packet processing, and interface aggregation.
- Industrial Control and Instrumentation Industrial temperature rating (−40°C to 100°C) and a high pin count allow the device to serve as a central programmable controller in industrial systems.
Unique Advantages
- High Logic Density: Approximately 32,256 logic elements enable integration of large finite‑state machines, datapaths, and control logic into a single device, reducing component count.
- Substantial On‑Chip Memory: Approximately 1.77 Mbits of embedded RAM supports deep buffering and low‑latency local storage without relying solely on external memory.
- Broad I/O Connectivity: 684 user I/Os provide flexibility for multi‑lane interfaces, large connector systems, and mixed signal standards at the board level.
- Industrial Temperature Range: Specified −40°C to 100°C operation supports deployment in industrial environments requiring extended temperature tolerance.
- Platform Feature Set: Virtex‑II platform capabilities—such as SelectRAM, DCMs, and dedicated multipliers—help accelerate development of memory interfaces, timing‑sensitive designs, and DSP functions.
- Regulatory and Environmental Compliance: RoHS compliance supports environmental requirements for modern electronics manufacturing.
Why Choose XC2V3000-4BF957I?
The XC2V3000-4BF957I combines a high logic count, substantial embedded memory, and a large I/O count in a single industrial‑grade FCBGA package, making it well suited for designs that require integration of complex logic, high‑bandwidth interfaces, and on‑chip storage. Its Virtex‑II platform capabilities—clock management, dedicated multipliers, and SelectRAM hierarchy—provide a solid foundation for memory controllers, DSP accelerators, and communications subsystems.
This device is aimed at engineers and system designers who need a scalable, reliable FPGA solution with comprehensive platform features and datasheet support. The combination of performance‑oriented architecture, industrial operating range, and RoHS compliance offers long‑term usability across production and industrial deployments.
If you would like pricing or availability, request a quote or submit an inquiry to receive a formal quotation and lead‑time information for the XC2V3000-4BF957I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








