XC2V250-6FGG456C

The XC2V250-6FGG456C is a Virtex‑II platform Field Programmable Gate Array (FPGA) supplied in a 456‑ball BGA package. It combines reconfigurable logic, embedded RAM, and flexible I/O to address applications requiring mid-range logic capacity and on‑chip memory integration.

Built on the Virtex‑II architecture, this device provides 384 CLBs (3,456 logic elements), approximately 0.44 Mbits of embedded memory, and 200 user I/Os, delivering a balance of logic, memory and interfacing resources for communications, embedded processing and system integration tasks.

Key Features

• Logic Capacity — 384 CLBs corresponding to 3,456 logic elements and an estimated 250,000 system gates, suitable for mid-density FPGA designs.
• Embedded Memory — Total on‑chip RAM of 442,368 bits (approximately 0.44 Mbits) for local buffering, state storage and small on‑chip data structures.
• I/O Resources — 200 user I/Os to support parallel interfaces, external memory connections and board-level signaling.
• Virtex‑II Platform Capabilities — Features associated with the Virtex‑II family such as the SelectRAM memory hierarchy, dedicated multiplier blocks and Digital Clock Manager (DCM) circuitry as described in the platform datasheet.
• Power and Supply — Core voltage supply range 1.425 V to 1.575 V, enabling integration in designs with this core rail requirement.
• Package and Mounting — 456‑BBGA package (supplier device package: 456‑FBGA, 23×23) with surface‑mount mounting type for compact board-level implementation.
• Operating Range — Commercial grade operation from 0 °C to 85 °C for standard temperature environments.
• Standards and Compliance — RoHS compliant.

Typical Applications

• Communications and Networking — Use the device’s logic and embedded memory to implement protocol processing, interface bridging or packet buffering in mid‑density network equipment.
• Embedded Processing — Implement custom control logic, offload functions from a microcontroller or create tightly coupled data paths using on‑chip RAM and logic cells.
• Memory Interface Design — Leverage the Virtex‑II platform’s memory interface capabilities for SDR/DDR and SRAM front‑ends where on‑FPGA logic and I/O density are required.
• Prototyping and System Integration — Ideal for board‑level prototyping of mid‑complexity digital systems requiring reprogrammability and a compact BGA package.

Unique Advantages

• Balanced Logic and Memory: 3,456 logic elements with approximately 0.44 Mbits of embedded RAM provide a practical balance for designs needing both combinational/sequential logic and local storage.
• Generous I/O Count: 200 user I/Os allow direct interfacing to multiple peripherals and parallel buses, reducing the need for external interface glue logic.
• Virtex‑II Platform Feature Set: Access to platform capabilities such as SelectRAM and DCM functionality supports advanced clocking and efficient on‑chip memory usage.
• Compact BGA Package: The 456‑ball BGA (456‑FBGA, 23×23) enables high pin‑count in a compact footprint for space‑constrained PCBs.
• Commercial Temperature Grade: Rated for 0 °C to 85 °C operation for standard commercial applications and environments.
• RoHS Compliant: Conforms to RoHS requirements for lead‑free assembly processes.

Why Choose XC2V250-6FGG456C?

The XC2V250-6FGG456C positions itself as a mid‑density Virtex‑II FPGA option that combines a practical logic element count, modest embedded RAM, and a substantial I/O complement in a compact BGA package. It is well suited to engineering teams developing communications, memory interface, or embedded processing solutions that require reconfigurable logic and local on‑chip memory without the complexity or cost of higher‑density devices.

Backed by the Virtex‑II platform documentation and development flows referenced in the series datasheet, this device offers a predictable integration path and scalability within the platform family for evolving project requirements.

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