XC2V250-6CSG144C

The XC2V250-6CSG144C is a Virtex®-II FPGA offering a mix of programmable logic, embedded memory, and flexible I/O in a 144-TFBGA chip-scale BGA package. With 3,456 logic elements, approximately 0.44 Mbits of embedded RAM and 92 user I/Os, it is designed for applications that require on-chip logic, memory resources and high-performance interfacing within standard commercial temperature and power envelopes.

Its architecture supports a range of functions including on-chip SelectRAM memory resources, dedicated multiplier blocks and advanced clock-management features, making it suitable for designs that integrate digital signal processing, memory interfaces and custom logic in a compact surface-mount package.

Key Features

• Logic Capacity  3,456 logic elements across 384 configurable logic blocks (CLBs) and an estimated 250,000 system gates to implement complex custom logic.
• Embedded Memory  Approximately 0.44 Mbits of on-chip RAM (442,368 total RAM bits) for data buffering, FIFOs and local storage.
• Dedicated Arithmetic  Built-in 18-bit × 18-bit multiplier resources to accelerate multiply-accumulate operations and DSP algorithms.
• Clock Management  Advanced clocking capabilities including Digital Clock Manager (DCM) modules for precise clock de-skew, frequency synthesis and phase shifting.
• Flexible I/O  92 user I/Os with support for multiple signaling standards and programmable sink current; includes Digitally Controlled Impedance (DCI) for on-chip termination.
• High-Performance Interfaces  Architectural support for high-performance external memory interfaces such as SDR/DDR SDRAM and SRAM families, enabling efficient host and memory connectivity.
• Package & Mounting  144-TFBGA, CSPBGA package (supplier device package: 144-LCSBGA 12×12) in a surface-mount form factor suitable for dense board layouts.
• Power & Temperature  Core supply voltage range of 1.425 V to 1.575 V and commercial operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Memory Interface and Bridge Designs  Use the device's memory-interface capabilities to implement SDR/DDR SDRAM and SRAM controllers, bridging and buffering functions.
• Signal Processing and DSP Acceleration  Leverage the 18×18 multipliers and distributed RAM for multiply-accumulate workloads, filtering and real-time data processing.
• Custom Logic and Prototyping  Implement control logic, protocol processing and custom finite-state machines using the device's CLBs and embedded RAM.
• High-Speed I/O Interfacing  Deploy the device where flexible I/O standards and on-chip termination are needed for LVDS, bus interfaces or card-edge protocols.

Unique Advantages

• Balanced Logic and Memory Mix:  Combines 3,456 logic elements with approximately 0.44 Mbits of embedded RAM to accommodate both control logic and local data storage on a single device.
• Built-in DSP Primitives:  Dedicated multiplier blocks reduce external component count and simplify implementation of arithmetic-heavy functions.
• Advanced Clocking:  Integrated DCM modules provide precise clock control for timing-critical designs and multi-domain clock management.
• Flexible I/O with On-Chip Termination:  92 user I/Os, programmable sink current and DCI support make signal integrity tuning and multiple interface standards easier to implement.
• Compact, Surface-Mount Package:  The 144-TFBGA (12×12 LCSBGA) package enables dense PCB layouts while maintaining a commercial-grade temperature range.
• Standards and Compliance:  RoHS compliance supports modern assembly and regulatory expectations for commercial products.

Why Choose XC2V250-6CSG144C?

The XC2V250-6CSG144C positions itself as a compact Virtex®-II FPGA option for designs that need a practical balance of logic density, embedded memory and dedicated arithmetic resources. Its combination of configurable logic blocks, on-chip SelectRAM resources and multiplier primitives helps simplify system architecture by consolidating multiple functions into a single device.

This part is well suited for engineers and teams implementing memory interfaces, DSP blocks, custom protocol processing and high-speed I/O in commercial-temperature applications. It delivers long-term value through integration of clock management, flexible I/O and on-chip memory, enabling scalable designs within a compact BGA footprint.

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