XC2V250-5FGG256I
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 172 442368 256-BGA |
|---|---|
| Quantity | 1,305 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 172 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3456 | ||
| Number of Gates | 250000 | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 442368 |
Overview of XC2V250-5FGG256I – Virtex‑II FPGA, 256‑BGA, 172 I/O
The XC2V250-5FGG256I is an AMD Virtex®-II field programmable gate array supplied in a 256‑ball fine-pitch BGA (256-FBGA, 17×17) surface-mount package. It integrates a balanced combination of reprogrammable logic, embedded memory and I/O to address complex digital functions in industrial systems.
With 3,456 logic elements, approximately 0.44 Mbits of embedded RAM, 172 user I/Os and an operating range of -40 °C to 100 °C, this device targets industrial applications that require configurable logic, on-chip memory and flexible interfacing while adhering to RoHS requirements.
Key Features
- Reprogrammable Logic 3,456 logic elements providing a foundation for custom logic implementation and system-level integration.
- Embedded Memory Approximately 0.44 Mbits (442,368 bits) of on-chip RAM for local buffering, state storage and data processing.
- I/O and Package 172 user I/Os in a 256‑ball fine-pitch BGA (256-FBGA, 17×17) surface-mount package suitable for dense PCB layouts.
- Logic Density Roughly 250,000 gates of logic capacity to support medium-complexity programmable designs.
- Power Supply Core voltage range: 1.425 V to 1.575 V, enabling controlled power delivery and integration with standard FPGA power rails.
- Industrial Temperature Grade Rated for operation from -40 °C to 100 °C, appropriate for industrial environments and extended-temperature deployments.
- Surface Mount Assembly 256‑FBGA package optimized for surface-mount assembly and high-density board integration.
- Standards and Compliance RoHS compliant for environmental and regulatory alignment in modern manufacturing.
- Virtex‑II Series Capabilities Series-level architecture includes features such as 18‑Kb block SelectRAM resources, dedicated 18×18 multipliers, Digital Clock Manager (DCM) circuitry and Digitally Controlled Impedance (DCI) I/O support for advanced clocking, arithmetic and I/O termination options.
Typical Applications
- Industrial Control & Automation Implement custom control logic, protocol bridging and local data buffering for factory and process control systems within an industrial temperature range.
- Embedded Computing and Prototyping Use as a configurable logic fabric for custom accelerators, glue logic or platform prototyping where reprogrammability and embedded RAM are required.
- Memory Interface and Custom Peripherals Integrate on-chip RAM and programmable logic to build tailored memory interfaces, buffering stages and peripheral controllers.
- Signal Processing and Arithmetic Blocks Leverage the device’s embedded multipliers and RAM resources for mid-range DSP tasks and algorithm acceleration.
Unique Advantages
- Balanced Logic and Memory Combination of 3,456 logic elements and approximately 0.44 Mbits of embedded RAM supports a wide range of mid-complexity designs without external memory for many functions.
- Industrial Temperature Capability -40 °C to 100 °C rating enables deployment in harsh industrial environments where extended temperature ranges are required.
- Flexible I/O in a Compact Package 172 user I/Os in a 256‑FBGA (17×17) footprint simplifies routing and board-level density for compact, high-functionality systems.
- Established Virtex‑II Architecture Series-level features such as SelectRAM, 18×18 multipliers and DCMs offer proven building blocks for clock management, arithmetic operations and embedded memory organization.
- Regulatory and Assembly Ready RoHS compliance and surface-mount 256‑FBGA packaging align with modern manufacturing and environmental requirements.
Why Choose XC2V250-5FGG256I?
The XC2V250-5FGG256I positions itself as a versatile industrial-grade FPGA that combines a practical logic element count, embedded memory and a substantial I/O complement in a compact 256‑FBGA package. It is suited to designers who need reprogrammable logic and on-chip RAM for mid-range digital functions while maintaining industrial temperature capability and RoHS compliance.
This device is appropriate for projects requiring scalable, field-configurable logic blocks, integrated arithmetic resources and flexible clocking options drawn from the Virtex‑II architecture, providing a reliable platform for evolving embedded systems and industrial designs.
Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for the XC2V250-5FGG256I. Our team can provide the details you need to move your design forward.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








