XC2V250-5FG256I

The XC2V250-5FG256I is a Virtex®-II FPGA offered in a 256-ball fine-pitch BGA package, designed for industrial applications requiring programmable logic, embedded memory and flexible I/O. Built on the Virtex-II platform, the device provides a balance of gate capacity, on-chip RAM and I/O count for custom digital designs that operate across a wide temperature and supply range.

Key on-device specifications include approximately 442,368 bits of embedded memory, 3,456 logic elements organized in 384 CLBs, up to 172 user I/Os, and a 1.425 V to 1.575 V supply range, all in a surface-mount 256-FBGA (17×17) package rated for –40°C to 100°C operation.

Key Features

• Core Logic  384 CLBs (equivalent to 3,456 logic elements) and a device gate count of 250,000 provide programmable logic capacity for medium-complexity digital designs.
• Embedded Memory  Approximately 0.44 Mbits of on-chip RAM (442,368 bits) for data buffering, FIFOs and small memory structures.
• I/O and Interfaces  Up to 172 user I/O pins to support external interfaces and peripheral connectivity in a single-package solution.
• Arithmetic and DSP Support (Virtex-II platform)  Virtex-II platform features include dedicated 18-bit × 18-bit multiplier blocks and fast carry logic to support arithmetic and DSP functions.
• Clock Management (Virtex-II platform)  Platform-level clock-management features such as Digital Clock Manager (DCM) modules and global clock buffers enable flexible clocking and de-skewing strategies.
• Package and Mounting  Surface-mount 256-FBGA (17×17) package (256-BGA case) for high-density board integration and reliable solder attachment.
• Power  Nominal core supply range from 1.425 V to 1.575 V to match system power-rail requirements.
• Industrial Temperature Rating  Rated for operation from –40°C to 100°C for use in temperature-challenging environments.
• Regulatory  RoHS compliant for adherence to lead-free manufacturing and material restrictions.

Typical Applications

• Embedded Controls  Implement custom control logic, state machines and protocol handlers using the device’s logic capacity and embedded memory.
• Memory Interface and Buffering  Use the on-chip RAM and ample I/O to implement DRAM/SRAM interface logic, buffering and data-path arbitration.
• Signal Processing / DSP  Leverage dedicated multiplier resources and fast logic for arithmetic-heavy blocks such as filtering, transforms and aggregation.
• Prototyping and Custom Hardware  Middle-density gate count and flexible I/O make the device suitable for hardware prototyping and custom digital accelerators.

Unique Advantages

• Balanced Logic and Memory:  3,456 logic elements combined with approximately 0.44 Mbits of embedded RAM supports mixed compute and buffering requirements without external memory for small data sets.
• Flexible I/O Count:  172 user I/Os allow consolidation of multiple peripheral interfaces on a single device, simplifying board-level design.
• Industrial Temperature Range:  Qualified for –40°C to 100°C operation, suitable for industrial deployments where extended temperature tolerance is required.
• Compact BGA Packaging:  256-FBGA (17×17) package delivers high pin density in a compact surface-mount footprint for space-constrained boards.
• Platform Capabilities:  As part of the Virtex-II family, the device benefits from platform-level features such as dedicated multipliers and clock management blocks for common FPGA design needs.
• RoHS Compliant:  Meets lead-free material requirements to support modern manufacturing processes.

Why Choose XC2V250-5FG256I?

The XC2V250-5FG256I provides a pragmatic combination of logic density, embedded RAM and I/O resources in an industrial-temperature, surface-mount 256-FBGA package. It is positioned for engineers who need a Virtex-II platform FPGA with medium gate count and integrated memory to implement custom logic, interface controllers and DSP tasks within a constrained board footprint.

With a defined core supply range and RoHS compliance, this device delivers predictable electrical and environmental characteristics for production designs that require stability, platform-level features and a compact assembly option.

Request a quote or submit an inquiry to receive availability and pricing information for the XC2V250-5FG256I. Our team can provide lead-time details and volume options to help you move from evaluation to production.