XC2V250-5FG456I

The XC2V250-5FG456I is a Virtex®-II series field programmable gate array supplied in a 456-ball BGA package. It delivers a mid-range FPGA resource set with 3,456 logic elements and approximately 0.44 Mbits of embedded RAM, designed for embedded processing, interface bridging and industrial control applications.

This device combines a high I/O count with robust packaging and industrial temperature grading to support designs that require dense logic, on-chip memory and a compact board footprint while operating across a wide temperature range.

Key Features

• Logic Capacity  3,456 logic elements provide a balanced resource set for mid-density FPGA designs.
• Embedded Memory  Approximately 0.44 Mbits of on-chip RAM (442,368 bits) for local data storage and buffering without requiring external memory for many control and buffering tasks.
• Gate Count  Specifies 250,000 system gates to help characterize overall integration potential for logic and glue functions.
• I/O Resources  200 user I/Os support diverse interface requirements and enable connectivity to multiple peripherals and external devices.
• Power Supply  Core voltage range specified at 1.425 V to 1.575 V for predictable power design and supply planning.
• Package & Mounting  456-ball ball-grid array (456-BBGA / 456-FBGA 23×23) in a surface-mount form factor for compact board integration.
• Operating Range  Industrial-grade operation from −40 °C to 100 °C for reliability in harsher environments.
• Standards & Compliance  RoHS compliant to meet environmental and materials requirements.
• Virtex-II Platform Features  Series-level architecture provides SelectRAM block memory resources, dedicated 18-bit × 18-bit multiplier support, digital clock management (DCM) and high-performance I/O capabilities as documented for the Virtex®-II family.

Typical Applications

• Industrial Control  Embedded control, sensor aggregation and machine interface functions that benefit from industrial temperature grading and on-chip memory.
• Interface Bridging  Protocol conversion and I/O aggregation using the device’s 200 user I/Os to connect diverse subsystems.
• Embedded Prototyping  Development platforms and proof-of-concept designs that require a mid-range logic fabric and local RAM for iterative development.
• Communications Glue Logic  Custom data path logic, buffering and timing control between high-speed peripherals and system logic.

Unique Advantages

• Balanced Logic and Memory: The combination of 3,456 logic elements and approximately 0.44 Mbits of embedded RAM supports mid-density functions without immediate need for external memory.
• High I/O Density: 200 user I/Os enable flexible interfacing to multiple peripherals and system buses, reducing the need for external multiplexing components.
• Industrial Temperature Rating: −40 °C to 100 °C operation provides robustness for industrial and ruggedized systems.
• Compact BGA Package: 456-ball FBGA (23×23) surface-mount package helps conserve PCB area while delivering a high pin-count footprint.
• Controlled Core Supply Range: A defined voltage window (1.425 V–1.575 V) simplifies power-supply design and sequencing for system integration.
• RoHS Compliance: Conformance to RoHS simplifies design-in for regulated markets and environments.

Why Choose XC2V250-5FG456I?

The XC2V250-5FG456I positions itself as a practical choice for engineers seeking a mid-range Virtex®-II FPGA with a balanced mix of logic, embedded RAM and a high I/O count in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for production systems deployed in challenging environments.

This device is well suited to teams developing control systems, interface bridging solutions and embedded prototypes that require predictable power characteristics, a moderate gate count and local memory resources—delivering a scalable FPGA option within the Virtex®-II platform.

Request a quote or submit an RFQ to receive pricing and availability for the XC2V250-5FG456I and to discuss volume options or lead-time requirements.