XC2V250-5FGG456C

IC FPGA 200 I/O 456FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 200 442368 456-BBGA

Quantity 653 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package456-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case456-BBGANumber of I/O200Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3456
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of XC2V250-5FGG456C – Virtex®-II FPGA, 200 I/O, approximately 0.44 Mbits RAM, 456-BBGA

The XC2V250-5FGG456C is a Virtex®-II Field Programmable Gate Array (FPGA) in a 456-ball BGA package designed for commercial applications. It provides a mid-range FPGA fabric with 3,456 logic elements (cells), roughly 250,000 system gates and approximately 0.44 Mbits of embedded RAM, making it suitable for designs that require moderate logic capacity, on-chip memory and flexible I/O.

Built on the Virtex-II platform, the device supports high-performance I/O and memory-centric functions and is intended for applications that need configurable logic, dedicated arithmetic blocks and configurable clock management within a surface-mount 456-BBGA footprint.

Key Features

  • Logic Capacity – 3,456 logic elements (cells) and an estimated 250,000 system gates provide a balanced resource set for mid-range FPGA designs.
  • Embedded Memory – Total on-chip RAM of 442,368 bits (approximately 0.44 Mbits) for distributed and block-based storage in application logic.
  • I/O Resources – 200 user I/Os to support a variety of parallel and high-speed interface needs in board-level systems.
  • Dedicated Arithmetic Resources – Series-level Virtex-II features include 18-bit × 18-bit multiplier blocks useful for DSP and arithmetic-intensive functions.
  • Clock Management – Virtex-II platform clocking features such as Digital Clock Manager (DCM) elements for deskew and frequency synthesis are supported at the series level.
  • Package & Mounting – Surface-mount 456-BBGA package; supplier device package listed as 456-FBGA (23×23) for compact board integration.
  • Electrical & Thermal – Core supply range of 1.425 V to 1.575 V and commercial operating temperature range of 0 °C to 85 °C.
  • Compliance – RoHS compliant.

Typical Applications

  • Memory Interface Controllers – Use on-chip logic and I/O to implement SDR/DDR or other memory interface logic and bridging functions, leveraging the series’ memory-interface capabilities.
  • Signal Processing / DSP – Local multipliers and embedded RAM make this device suitable for mid-range DSP tasks such as filtering, transforms and data aggregation.
  • High-Density I/O Glue Logic – 200 I/Os enable complex interface glue and protocol adaptation between ASICs, processors and peripherals on custom boards.
  • Prototyping and Custom Control – Reconfigurable fabric and moderate logic density support hardware prototyping, control logic and custom acceleration blocks for commercial systems.

Unique Advantages

  • Balanced Logic and Memory: 3,456 logic elements paired with approximately 0.44 Mbits of on-chip RAM provide a useful combination for mixed-logic and memory-heavy functions without requiring larger footprint devices.
  • Ample I/O Count: 200 user I/Os support complex board-level interfacing and multiple parallel buses, reducing the need for external I/O expanders.
  • Dedicated DSP Primitives: Series-level 18×18 multipliers and carry logic simplify implementation of arithmetic-intensive algorithms and accelerate DSP tasks in hardware.
  • Compact Surface-Mount Package: The 456-ball BGA (456-FBGA 23×23 supplier footprint) offers a compact, high-pin-count solution for space-constrained PCB designs.
  • Commercial Temperature Range: Rated for 0 °C to 85 °C, suitable for standard commercial electronic products and environments.
  • RoHS Compliant: Meets regulatory requirements for lead-free manufacturing processes.

Why Choose XC2V250-5FGG456C?

The XC2V250-5FGG456C positions itself as a mid-range Virtex®-II FPGA offering a practical mix of logic, embedded memory and I/O density in a compact BGA package. It is well-suited for designers who need configurable hardware for memory interfaces, DSP acceleration and board-level glue logic within commercial temperature environments.

Backed by the Virtex-II platform features and development ecosystem documented in the series datasheet, this device provides a scalable option for projects that require reprogrammable logic, dedicated arithmetic resources and flexible clocking within a commercially qualified FPGA package.

Request a quote or submit a procurement inquiry to obtain pricing, availability and ordering information for the XC2V250-5FGG456C.

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