XC2V250-5FGG456C
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 200 442368 456-BBGA |
|---|---|
| Quantity | 653 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 456-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 456-BBGA | Number of I/O | 200 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3456 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 442368 |
Overview of XC2V250-5FGG456C – Virtex®-II FPGA, 200 I/O, approximately 0.44 Mbits RAM, 456-BBGA
The XC2V250-5FGG456C is a Virtex®-II Field Programmable Gate Array (FPGA) in a 456-ball BGA package designed for commercial applications. It provides a mid-range FPGA fabric with 3,456 logic elements (cells), roughly 250,000 system gates and approximately 0.44 Mbits of embedded RAM, making it suitable for designs that require moderate logic capacity, on-chip memory and flexible I/O.
Built on the Virtex-II platform, the device supports high-performance I/O and memory-centric functions and is intended for applications that need configurable logic, dedicated arithmetic blocks and configurable clock management within a surface-mount 456-BBGA footprint.
Key Features
- Logic Capacity – 3,456 logic elements (cells) and an estimated 250,000 system gates provide a balanced resource set for mid-range FPGA designs.
- Embedded Memory – Total on-chip RAM of 442,368 bits (approximately 0.44 Mbits) for distributed and block-based storage in application logic.
- I/O Resources – 200 user I/Os to support a variety of parallel and high-speed interface needs in board-level systems.
- Dedicated Arithmetic Resources – Series-level Virtex-II features include 18-bit × 18-bit multiplier blocks useful for DSP and arithmetic-intensive functions.
- Clock Management – Virtex-II platform clocking features such as Digital Clock Manager (DCM) elements for deskew and frequency synthesis are supported at the series level.
- Package & Mounting – Surface-mount 456-BBGA package; supplier device package listed as 456-FBGA (23×23) for compact board integration.
- Electrical & Thermal – Core supply range of 1.425 V to 1.575 V and commercial operating temperature range of 0 °C to 85 °C.
- Compliance – RoHS compliant.
Typical Applications
- Memory Interface Controllers – Use on-chip logic and I/O to implement SDR/DDR or other memory interface logic and bridging functions, leveraging the series’ memory-interface capabilities.
- Signal Processing / DSP – Local multipliers and embedded RAM make this device suitable for mid-range DSP tasks such as filtering, transforms and data aggregation.
- High-Density I/O Glue Logic – 200 I/Os enable complex interface glue and protocol adaptation between ASICs, processors and peripherals on custom boards.
- Prototyping and Custom Control – Reconfigurable fabric and moderate logic density support hardware prototyping, control logic and custom acceleration blocks for commercial systems.
Unique Advantages
- Balanced Logic and Memory: 3,456 logic elements paired with approximately 0.44 Mbits of on-chip RAM provide a useful combination for mixed-logic and memory-heavy functions without requiring larger footprint devices.
- Ample I/O Count: 200 user I/Os support complex board-level interfacing and multiple parallel buses, reducing the need for external I/O expanders.
- Dedicated DSP Primitives: Series-level 18×18 multipliers and carry logic simplify implementation of arithmetic-intensive algorithms and accelerate DSP tasks in hardware.
- Compact Surface-Mount Package: The 456-ball BGA (456-FBGA 23×23 supplier footprint) offers a compact, high-pin-count solution for space-constrained PCB designs.
- Commercial Temperature Range: Rated for 0 °C to 85 °C, suitable for standard commercial electronic products and environments.
- RoHS Compliant: Meets regulatory requirements for lead-free manufacturing processes.
Why Choose XC2V250-5FGG456C?
The XC2V250-5FGG456C positions itself as a mid-range Virtex®-II FPGA offering a practical mix of logic, embedded memory and I/O density in a compact BGA package. It is well-suited for designers who need configurable hardware for memory interfaces, DSP acceleration and board-level glue logic within commercial temperature environments.
Backed by the Virtex-II platform features and development ecosystem documented in the series datasheet, this device provides a scalable option for projects that require reprogrammable logic, dedicated arithmetic resources and flexible clocking within a commercially qualified FPGA package.
Request a quote or submit a procurement inquiry to obtain pricing, availability and ordering information for the XC2V250-5FGG456C.

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