XC2V250-6FG256C

IC FPGA 172 I/O 256FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 172 442368 256-BGA

Quantity 608 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O172Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3456
Number of Gates250000ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of XC2V250-6FG256C – Virtex®-II Field Programmable Gate Array (FPGA) IC 172 442368 256-BGA

The XC2V250-6FG256C is a Virtex®-II platform field programmable gate array supplied by AMD. It delivers a balanced combination of configurable logic, embedded memory, and flexible I/O in a 256-ball BGA package suitable for commercial-grade designs.

Designed for applications that require on-chip RAM, dedicated arithmetic resources and a high density of I/O, this device supports implementation of custom logic, memory interfaces and signal-processing functions while operating within a 1.425 V to 1.575 V supply range and a 0 °C to 85 °C commercial temperature window.

Key Features

  • Virtex®-II platform architecture Series-level IP-Immersion architecture providing the established feature set of Virtex-II devices, including configurable logic, clock management and SelectRAM memory hierarchy.
  • Logic capacity Approximately 3,456 logic elements and 250,000 system gates allow implementation of moderate-complexity custom logic functions.
  • Embedded memory Approximately 0.44 Mbits (442,368 bits) of on-chip RAM to support data buffering, state storage and memory-intensive logic without immediate external RAM.
  • I/O resources 172 user I/O pins in a fine-pitch 256-ball BGA footprint provide flexible external interfacing for peripherals, memories and transceivers; the Virtex-II series supports a broad set of I/O standards.
  • Arithmetic and DSP support Series features include dedicated 18-bit × 18-bit multiplier blocks and fast carry chains for hardware-accelerated multiply and arithmetic operations.
  • Clock management Virtex-II devices include Digital Clock Manager (DCM) functionality and global clock routing to help meet timing and synchronization needs in complex designs.
  • Package and mounting 256‑FBGA (17 × 17) surface-mount package (256-BGA) for compact board integration and reliable solder mounting.
  • Electrical and environmental Specified supply voltage range: 1.425 V to 1.575 V. Commercial-grade operating temperature range: 0 °C to 85 °C. RoHS compliant.

Typical Applications

  • Memory interface controllers On-chip RAM and flexible I/O make this device suitable for building SDR/DDR memory interfaces and buffering logic in embedded systems.
  • Signal processing and DSP blocks Dedicated multiplier resources and look-ahead carry chains support hardware acceleration of arithmetic and filtering algorithms.
  • Communications and protocol bridging High I/O count and Virtex-II series SelectIO capabilities enable protocol conversion, bus bridging and front-end interface logic.
  • Custom logic and prototyping The combination of logic elements and embedded RAM is well suited for implementing custom control logic, state machines and medium-complexity prototypes.

Unique Advantages

  • Balanced integration: Combines thousands of logic elements with approximately 0.44 Mbits of embedded RAM to reduce dependency on external memory for many mid-range designs.
  • Flexible external interfacing: 172 user I/Os in a 256‑FBGA footprint provide broad connectivity options for sensors, memories and peripheral devices.
  • Hardware arithmetic acceleration: Series-level dedicated multiplier blocks enable efficient implementation of multiply-intensive functions without consuming general-purpose logic.
  • Commercial-grade robustness: Specified operating range of 0 °C to 85 °C and RoHS compliance align with typical commercial product requirements.
  • Compact board integration: Surface-mount 256‑FBGA (17 × 17) package supports dense PCB layouts while maintaining reliable solder mounting.

Why Choose XC2V250-6FG256C?

The XC2V250-6FG256C offers a practical balance of logic capacity, embedded memory and I/O resources in a compact BGA package, making it a capable choice for commercial embedded designs that need moderate logic density combined with on-chip RAM and dedicated arithmetic support. Its Virtex-II platform heritage provides a familiar architecture for teams implementing clock management, memory interfacing and signal-processing functions.

Choose this device when you need a commercially graded FPGA solution with defined supply and temperature ranges, RoHS compliance, and the series-level feature set of the Virtex-II family to accelerate development of custom digital logic and interfacing solutions.

Request a quote or submit a quote to check availability and pricing for XC2V250-6FG256C.

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