XC2V3000-4BF957C

The XC2V3000-4BF957C is a Virtex®-II Field Programmable Gate Array (FPGA) IC from AMD supplied in a 957-ball flip-chip BGA (957-FCBGA, 40×40). It provides a high-density, programmable logic fabric suited for designs requiring substantial logic resources, embedded memory, and a large number of I/O.

Built on the Virtex-II platform architecture, the device targets applications that need on-chip memory, arithmetic resources and flexible I/O while operating within a commercial temperature range and nominal core supply voltage.

Key Features

• Core Logic 32,256 logic elements providing substantial programmable logic capacity for complex designs.
• Configurable Logic Blocks (CLBs) 3,584 CLBs for structured implementation of combinational and sequential logic.
• Embedded Memory Approximately 1.77 Mbits of on-chip RAM (1,769,472 bits) for buffering, FIFOs and local data storage.
• Gate Count 3,000,000 gates of logic equivalent to support medium-to-high complexity system integration.
• High I/O Density 684 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Arithmetic Resources Dedicated multiplier and arithmetic structures are supported by the Virtex-II platform for DSP and signal-processing functions.
• Clock Management Digital Clock Manager (DCM) resources on the Virtex-II platform enable precise clock de-skew, phase shifting and frequency synthesis for synchronous designs.
• Package & Mounting Supplied in a 957-ball flip-chip BGA (957-FCBGA, 40×40), surface-mount package for compact board-level integration.
• Power and Temperature Core supply range 1.425 V to 1.575 V; commercial operating temperature range 0 °C to 85 °C.
• Regulatory RoHS compliant.

Typical Applications

• Memory Interface and Bridge Logic — Use the high I/O count and Virtex-II platform memory interfaces for SDR/DDR memory controllers and DRAM/SRAM bridging.
• Signal Processing / DSP — Leverage the device’s embedded memory and arithmetic resources for medium-complexity DSP tasks and algorithms.
• High‑Density I/O Systems — Ideal for boards requiring numerous parallel connections, protocol conversion, or wide I/O buses.
• Prototyping and System Integration — Suitable for development platforms and systems that need reprogrammable logic with significant on-chip resources.

Unique Advantages

• Substantial Logic Capacity: 32,256 logic elements enable implementation of complex state machines, custom processors, and large glue-logic blocks.
• Significant Embedded Memory: Approximately 1.77 Mbits of on-chip RAM reduces external memory dependence and simplifies board design.
• High I/O Count: 684 user I/Os accommodate broad interface requirements without external I/O expanders.
• Dedicated Arithmetic Support: Platform-level multiplier and arithmetic resources accelerate DSP workloads and fixed-point computation.
• Commercial Temperature & Defined Power: Clear operating range (0 °C to 85 °C) and core voltage window (1.425 V–1.575 V) simplify thermal and power budgeting.
• RoHS Compliance: Meets environmental compliance requirements for lead-free assembly.

Why Choose XC2V3000-4BF957C?

The XC2V3000-4BF957C positions itself as a versatile, commercial-grade Virtex-II FPGA suitable for designs that require a balance of logic density, embedded memory and broad I/O capability. Its on-chip resources and platform features support a variety of system-level functions including memory interfacing, signal processing and complex I/O handling.

Choose this device when you need a field-programmable solution with defined electrical and thermal parameters, substantial logic and RAM resources, and a compact flip-chip BGA package for streamlined board integration.

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