XC2V3000-4FFG1152C

The XC2V3000-4FFG1152C is a Virtex®-II field programmable gate array (FPGA) in a 1152-ball FCBGA package manufactured by AMD. It provides a large logic fabric with 3,584 configurable logic blocks (CLBs) and 32,256 logic elements, plus substantial embedded memory and I/O resources for complex digital designs.

Designed for commercial-grade applications, this device targets systems that require high-density logic, on-chip memory and extensive I/O — delivering integration that supports memory interfaces, DSP functions and high-bandwidth I/O architectures within a 35 × 35 1152-FCBGA footprint.

Key Features

• Logic Capacity  3,584 CLBs and 32,256 logic elements provide broad programmable logic resources for complex implementations.
• Embedded Memory  Approximately 1.77 Mbits of on-chip RAM (1,769,472 bits) available across block SelectRAM resources for data buffering and state storage.
• Arithmetic Resources  Dedicated 18-bit × 18-bit multiplier blocks (series-level feature) suitable for arithmetic and DSP-oriented functions.
• I/O Density  720 user I/O pins accommodate wide external interfaces and parallel buses from the 1152-FCBGA package.
• Clock Management  Series-level Digital Clock Manager (DCM) and global clock buffering capabilities support precise clock distribution and synthesis in clocked systems.
• Packaging & Mounting  1152-FCBGA (35 × 35) package, surface-mount mounting; compact form factor for board-level integration.
• Power Supply  Operates from a core supply in the range 1.425 V to 1.575 V, enabling defined power planning for system design.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant, supporting lead-free assembly and environmental requirements.

Typical Applications

• High‑performance memory interfaces  Use the device’s logic and on-chip memory to implement SDR/DDR or SRAM interface controllers and memory bridges.
• Digital signal processing  Leverage dedicated multipliers and abundant logic elements for filtering, transforms and other DSP workloads.
• High-density I/O systems  720 I/Os support wide parallel buses, custom I/O protocols and board-level I/O aggregation in communication and data-acquisition systems.
• Complex glue-logic and protocol conversion  Large logic capacity and embedded RAM enable protocol bridging, packet processing and custom control logic in system designs.

Unique Advantages

• High integration density: 3,584 CLBs and 32,256 logic elements reduce the need for multiple discrete devices by consolidating complex logic into a single FPGA.
• Substantial on-chip memory: Approximately 1.77 Mbits of embedded RAM supports buffering and local storage, simplifying external memory requirements.
• Extensive I/O capability: 720 user I/Os in a 1152-FCBGA package provide flexibility for broad interface support without large package footprints.
• Design stability and planning: Defined supply voltage range (1.425 V–1.575 V) and commercial temperature rating facilitate predictable power and thermal design.
• RoHS compliance: Supports lead-free assembly workflows and regulatory compliance for commercial products.

Why Choose XC2V3000-4FFG1152C?

The XC2V3000-4FFG1152C positions itself as a high-capacity Virtex®-II FPGA option for commercial applications that require a balance of logic density, embedded memory and broad I/O. Its combination of CLBs, dedicated arithmetic blocks and substantial on-chip RAM makes it suitable for designs spanning memory interface controllers, DSP processing and complex protocol logic within a compact FCBGA package.

For engineering teams and procurement seeking a commercial-grade FPGA with clear electrical and packaging parameters — including supply voltage, operating temperature and RoHS status — the XC2V3000-4FFG1152C offers a verifiable platform backed by the Virtex-II family’s documented architecture and resources.

Request a quote or submit a procurement inquiry to receive pricing and availability details for the XC2V3000-4FFG1152C. Include your target quantities and any required delivery timelines to expedite a response.