XC2V3000-4FFG1152I

The XC2V3000-4FFG1152I is a Virtex®-II platform FPGA manufactured by AMD. It delivers a high-density programmable fabric with 32,256 logic elements, approximately 1.77 Mbits of embedded RAM, and up to 720 user I/Os for complex system integration.

Designed for industrial-grade applications, this surface-mount FCBGA device operates from 1.425 V to 1.575 V and across an operating temperature range of −40 °C to 100 °C, offering the electrical and environmental characteristics needed for demanding designs that require substantial I/O, memory, and compute resources.

Key Features

• Logic Capacity 32,256 logic elements (equivalent cells) and approximately 3,000,000 system gates provide the resources to implement large custom digital functions and glue logic.
• Embedded Memory Approximately 1.77 Mbits of on-chip RAM (Total Ram Bits: 1,769,472) for high-throughput buffering, on-chip data storage, and state machines.
• High I/O Count Up to 720 user I/Os support wide parallel interfaces, multi-channel connectivity, and complex board-level integration.
• Arithmetic and DSP Support The Virtex-II platform includes dedicated multiplier resources (18‑bit × 18‑bit multiplier blocks) and fast carry logic for arithmetic-intensive functions.
• Clock Management Platform architecture provides advanced clock management capabilities, including Digital Clock Manager (DCM) resources for precise de-skewing and flexible frequency control as documented in the product datasheet.
• Package and Mounting 1152-ball FCBGA package (1152-FCBGA, 35×35) in a 1152-BBGA footprint with surface-mount mounting for compact board designs.
• Power and Voltage Nominal core supply voltage range of 1.425 V to 1.575 V to match standard FPGA power domains.
• Industrial Grade and RoHS Compliant Rated for −40 °C to 100 °C operation and compliant with RoHS requirements.
• Comprehensive Documentation The Virtex-II complete data sheet covers architecture, I/O, timing, and configuration details to support design and verification activities.

Typical Applications

• Memory Interface Controllers High I/O count and on-chip RAM make the device suitable for implementing SDR/DDR interface logic and other external memory controllers.
• High‑Speed Data Processing Dedicated multipliers and abundant logic elements support DSP blocks, packet processing, and real-time data manipulation.
• Communications and Networking Large I/O capability and clock management resources enable multi-channel protocol handling and timing-sensitive interfaces.
• Industrial Control and Automation Industrial-grade temperature range and robust packaging allow deployment in factory automation, motor control, and process control systems.

Unique Advantages

• High integration density: 32,256 logic elements and approximately 1.77 Mbits of embedded RAM reduce external component count and simplify system design.
• Extensive I/O resources: Up to 720 user I/Os enable broad interfacing options for parallel buses, sensors, and high-channel-count systems.
• Engineered for arithmetic workloads: On-chip 18×18 multipliers and fast carry chains accelerate DSP and signal-processing tasks without offloading to external hardware.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in temperature-challenging environments.
• Robust package choice: 1152-FCBGA (35×35) delivers a compact, high-pin-count solution for dense board layouts.
• Standards-conscious design: RoHS compliance aligns the device with common environmental and regulatory requirements.

Why Choose XC2V3000-4FFG1152I?

The XC2V3000-4FFG1152I is positioned for designs that require a balance of high logic capacity, substantial on-chip memory, and a large number of I/Os within an industrial temperature envelope. Its Virtex‑II platform architecture, documented clock management and arithmetic resources, and FCBGA packaging make it suitable for systems that demand compact, high-functionality programmable logic.

This device is a solid fit for engineers building memory interfaces, high-throughput data paths, and industrial control logic where predictable electrical characteristics, significant embedded RAM, and extensive I/O are required. The comprehensive datasheet and platform documentation support design, verification, and integration activities for professional development workflows.

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