XC2V3000-4FGG676I

The XC2V3000-4FGG676I is a Virtex®-II platform FPGA supplied by AMD. It combines programmable logic, on-chip memory, and high-density I/O in a 676-ball fine-pitch BGA to support complex digital designs in industrial environments.

Designed for applications requiring substantial logic capacity and embedded memory, this device offers 32,256 logic elements, approximately 1.77 Mbits of embedded RAM, and 484 user I/Os, delivering integration and flexibility for communications, industrial control, and high-performance interfacing tasks.

Key Features

• Logic Capacity  32,256 logic elements and 3,000,000 equivalent system gates provide significant programmable logic for large designs.
• Embedded Memory  Approximately 1.77 Mbits of on-chip RAM (1,769,472 total bits) for high-bandwidth data buffering and state storage.
• I/O Density  484 user I/Os in a 676-FBGA (27 × 27 mm) package enable wide external connectivity and interface flexibility.
• Arithmetic Resources  Dedicated 18-bit × 18-bit multiplier blocks (Virtex-II series feature) for efficient DSP and signal-processing implementations.
• Clock Management  Digital Clock Manager (DCM) functionality in the Virtex-II platform supports precise clock de-skew and phase/frequency control for synchronous designs.
• Packaging and Mounting  676-BGA surface-mount package (676-FBGA) suited for compact board layouts and high-density assemblies.
• Power  Core supply voltage range of 1.425 V to 1.575 V for device operation.
• Industrial Grade  Rated for an operating temperature range of −40 °C to 100 °C and marked as industrial grade for temperature-critical applications.
• Regulatory  RoHS compliant for reduced hazardous substances in manufacturing.

Typical Applications

• Industrial Control  Used for motor control, real-time logic and sensor interfacing where robust temperature operation and high I/O count are required.
• Communications & Networking  Implements protocol logic, high-speed interfaces and packet processing leveraging dedicated multipliers and abundant logic resources.
• Data Acquisition & Instrumentation  On-chip RAM and extensive I/O support buffering, preprocessing and custom interfacing for measurement systems.
• Embedded Processing & Acceleration  Combines programmable logic and embedded arithmetic blocks to offload compute-intensive tasks in custom accelerators.

Unique Advantages

• High Logic Density: 32,256 logic elements provide headroom for complex state machines, datapaths and control logic without external ASICs.
• Integrated On-Chip Memory: Approximately 1.77 Mbits of embedded RAM reduces dependence on external memory for many buffering and scratchpad needs.
• Substantial I/O Count: 484 I/Os in a 676-FBGA package enable broad external connectivity and multi-protocol interfacing on a single device.
• Industry-Grade Temperature Range: −40 °C to 100 °C rating supports deployment in harsh or industrial environments.
• Platform-Level Resources: Virtex-II platform features such as 18×18 multipliers and DCM-based clock management simplify implementation of DSP and timing-critical functions.
• Compliance and Assembly: RoHS compliance and a standard surface-mount BGA package facilitate modern manufacturing and environmental requirements.

Why Choose XC2V3000-4FGG676I?

The XC2V3000-4FGG676I positions itself as a versatile Virtex-II FPGA option for engineers who need substantial programmable logic, embedded memory and a high I/O count in an industrial temperature-rated package. Its combination of logic elements, on-chip RAM and platform-level features supports complex control, communication and signal-processing designs while simplifying board-level integration.

Suitable for teams designing industrial and communications equipment that require a documented platform architecture and established FPGA capabilities, this device provides a balance of integration, configurability and long-term availability backed by AMD.

Request a quote or submit your design requirements to receive pricing and availability information for the XC2V3000-4FGG676I.