XC2V3000-5FF1152I

The XC2V3000-5FF1152I is a Virtex®-II FPGA by AMD provided in a 1152-FCBGA (35×35) surface-mount package. It combines a high-density logic fabric with on-chip embedded memory and a large I/O count, aimed at industrial designs requiring flexible, reconfigurable logic.

This device integrates 3,584 CLBs (32,256 logic elements), approximately 1.77 Mbits of embedded memory (1,769,472 bits), and 720 user I/Os. It operates from a core supply of 1.425 V to 1.575 V and is rated for industrial temperature operation from −40 °C to 100 °C.

Key Features

• Core Logic — 3,584 CLBs delivering 32,256 logic elements for implementing complex digital functions and state machines.
• Embedded Memory — Approximately 1.77 Mbits of on-chip RAM suitable for buffering, FIFOs, and small local memory structures.
• High I/O Density — 720 user I/Os to support wide buses, multiple interfaces, and high pin-count system connections.
• Arithmetic & DSP Support — Series-level architecture includes dedicated multiplier resources for efficient arithmetic operations.
• Clocking and Timing — Architecture-level clock management features support precise clock distribution and timing control for system-level synchronization.
• Power and Voltage — Core voltage supply range of 1.425 V to 1.575 V for consistent operation within defined supply margins.
• Package & Mounting — 1152-BBGA, FCBGA (1152-FCBGA, 35×35) surface-mount package for compact board-level integration.
• Industrial Temperature Grade — Rated for −40 °C to 100 °C operation to meet a wide range of environmental requirements.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free processing and compliance.

Typical Applications

• Industrial Control — Implement motor-control logic, deterministic I/O handling, and custom control algorithms using the device’s logic density and I/O resources.
• Communications Infrastructure — Buffering, framing, and protocol adaptation for network equipment using embedded RAM and abundant I/O lines.
• High-Performance Embedded Systems — Custom datapath and signal-processing blocks leveraging dedicated multipliers and on-chip memory for low-latency processing.
• Prototyping and System Integration — Use as a flexible platform for validating custom logic, interfaces, and memory subsystems in complex electronic systems.

Unique Advantages

• High Logic Integration: 3,584 CLBs and 32,256 logic elements enable complex digital designs without external glue logic.
• Substantial On-Chip Memory: Approximately 1.77 Mbits of embedded RAM reduces dependency on external memory for mid-sized buffering and storage.
• Large I/O Count: 720 user I/Os support multiple parallel interfaces and wide data buses, simplifying board-level routing for I/O-heavy applications.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in demanding environmental conditions.
• Compact, Surface-Mount Packaging: The 1152-FCBGA package provides a high-density, manufacturable solution for space-constrained boards.
• Standards-Conscious Manufacturing: RoHS compliance aligns the device with modern lead-free assembly processes.

Why Choose XC2V3000-5FF1152I?

The XC2V3000-5FF1152I delivers a balanced combination of logic capacity, embedded memory, and a high I/O count in a single industrial-grade FCBGA package. Its specifications make it a practical choice for engineers building industrial control systems, communications equipment, and high-performance embedded platforms that require reconfigurability and moderate on-chip resources.

Designed on the Virtex®-II platform, this device benefits from architecture features suited to complex digital designs while providing the thermal and voltage specifications needed for robust, long-term deployment.

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