XC2V3000-5FG676I

The XC2V3000-5FG676I is a Virtex®-II field programmable gate array (FPGA) in a 676-ball fine-pitch BGA package. It combines a high-density logic fabric with substantial on-chip RAM and a broad set of I/O to address complex, embedded logic and system-integration tasks.

With 3,584 CLBs and 32,256 logic elements, approximately 1.77 Mbits of embedded memory and 484 user I/Os, this device is aimed at industrial applications that require dense logic, flexible interfacing and extended operating temperature capability.

Key Features

• Core Logic 3,584 CLBs and 32,256 logic elements provide large-scale programmable logic capacity for complex designs.
• Embedded Memory Approximately 1.77 Mbits of on-chip RAM (1,769,472 total RAM bits) for data buffering, FIFOs and distributed memory needs.
• System Gates 3,000,000 system gates of integration capacity for combining control, DSP and glue-logic functions in a single device.
• I/O and Interfaces 484 user I/Os in a 676-FBGA (27×27) package enable broad connectivity to peripherals and external memory or devices.
• Arithmetic & DSP Support Virtex‑II series architecture includes dedicated 18-bit × 18-bit multiplier blocks (series-level feature) for high-throughput arithmetic operations.
• Clocking and Timing Series-level Digital Clock Manager (DCM) and global clock resources support flexible clocking strategies for synchronized system designs.
• Power and Supply Primary core supply range: 1.425 V to 1.575 V, enabling predictable core power interfacing.
• Package & Mounting 676-ball fine-pitch BGA (676-FBGA, 27×27) package; surface-mount mounting for PCB assembly.
• Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C.
• Compliance RoHS compliant.

Typical Applications

• Industrial Control High logic density and industrial temperature rating make the device suitable for complex control algorithms, sequencing and machine interfaces.
• Data Acquisition and Signal Aggregation Large embedded RAM and abundant I/O support buffering, pre-processing and aggregation of sensor and field data.
• Communications and Interface Bridging Extensive I/O and on-chip resources enable protocol bridging, interface aggregation and custom transceivers between system domains.
• Digital Signal Processing Dedicated multiplier blocks (series-level) and large logic resources support arithmetic-heavy functions such as filtering and transform engines.

Unique Advantages

• High integration density: 32,256 logic elements and roughly 1.77 Mbits of embedded memory reduce external component count and simplify board-level design.
• Flexible I/O capacity: 484 user I/Os in a compact 676-FBGA package provide broad connectivity while conserving board area.
• Industrial robustness: Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
• Predictable power interface: Defined core supply range (1.425 V–1.575 V) eases power-supply design and validation.
• Platform-level features: Virtex‑II series architecture delivers embedded multipliers, clock management and a SelectRAM memory hierarchy for diversified system functions.
• Standards-friendly packaging: 676-FBGA (27×27) surface-mount package supports high-density PCB layouts and reliable assembly.

Why Choose XC2V3000-5FG676I?

The XC2V3000-5FG676I positions itself as a high-density, industrial-grade FPGA option within the Virtex‑II family. Its combination of CLB count, sizable embedded RAM and hundreds of I/Os supports integration of complex control, DSP and interface functions into a single programmable device. The device’s temperature rating and RoHS compliance make it suitable for industrial deployments that require extended temperature range and regulatory adherence.

Engineers designing systems that need significant on-chip logic and memory, broad interfacing capability, and platform-level clocking and arithmetic resources will find the XC2V3000-5FG676I appropriate for reducing BOM, consolidating functions and accelerating development within the Virtex‑II ecosystem.

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