XC2V3000-5FFG1152C
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 720 1769472 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,204 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 720 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 3584 | Number of Logic Elements/Cells | 32256 | ||
| Number of Gates | 3000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1769472 |
Overview of XC2V3000-5FFG1152C – Virtex®-II FPGA, 720 I/O, approximately 1.77 Mbit RAM, 1152-FCBGA
The XC2V3000-5FFG1152C is a Virtex®-II field programmable gate array packaged in a 1152‑ball flip‑chip FCBGA (35×35 mm) for surface-mount applications. The device integrates approximately 32,256 logic elements, roughly 1.77 Mbits of embedded RAM, and 720 user I/O lines, delivering a flexible platform for complex digital designs.
Built for commercial-grade applications, this FPGA supports a broad set of on‑chip resources and platform-level capabilities—memory hierarchy, dedicated arithmetic blocks, and clock management circuitry—making it suitable for high‑performance interfacing, signal processing, and system integration tasks.
Key Features
- Logic Capacity Approximately 32,256 logic elements and 3,000,000 system gates for implementing complex digital functions and control logic.
- Embedded Memory Total on-chip RAM of 1,769,472 bits (approximately 1.77 Mbits) for packet buffers, FIFOs, and distributed data storage.
- I/O and Package 720 user I/O pins in a 1152‑BBGA FCBGA (1152‑FCBGA, 35×35) surface‑mount package for high‑density board designs.
- Arithmetic and DSP Support Platform includes dedicated 18‑bit × 18‑bit multiplier resources enabling efficient implementation of multiply‑accumulate and DSP functions.
- Clock Management Supports Digital Clock Manager (DCM) modules and global clock multiplexer buffers for precise clock control and deskewing (platform capability).
- Routing and Interconnect Active interconnect and segmented routing architecture (platform capability) for predictable routing delays and scalable timing.
- Power and Supply Nominal core supply range of 1.425 V to 1.575 V to match target board power rails and design constraints.
- Operating Range Commercial grade operation from 0 °C to 85 °C.
- Compliance RoHS compliant.
Typical Applications
- High‑speed memory interfaces Implement controllers and bridges for SDR/DDR memory types using on‑chip resources and platform memory‑interface features.
- Signal processing and DSP Leverage the embedded multipliers and sizable logic capacity for filtering, transforms, and other real‑time processing blocks.
- Custom I/O and protocol bridging Use the 720 I/O pins and programmable I/O standards to implement protocol converters, card interfaces, and high‑pin‑count glue logic.
- Embedded system integration Consolidate glue logic, control state machines, and local buffering into a single programmable device to reduce board complexity.
Unique Advantages
- High integration density: Combines tens of thousands of logic elements with approximately 1.77 Mbits of embedded RAM to minimize external component count and PCB area.
- Flexible I/O footprint: 720 user I/Os in a 1152‑ball FCBGA package enable dense connectivity for multi‑lane interfaces and wide buses.
- Dedicated arithmetic blocks: On‑chip 18×18 multipliers accelerate DSP and numeric operations, reducing the need for external accelerators.
- Platform clocking features: Built‑in clock management resources (DCM and global clock buffers at the platform level) support precise timing and frequency synthesis for complex systems.
- Commercial‑grade reliability: Specified 0 °C to 85 °C operating range and RoHS compliance for standard commercial applications.
Why Choose XC2V3000-5FFG1152C?
The XC2V3000-5FFG1152C offers a balanced combination of logic capacity, embedded memory, and a large I/O count in a compact FCBGA package—well suited for designers who need to consolidate digital logic, memory buffering, and I/O interfacing on a single FPGA. Its platform capabilities for arithmetic acceleration and clock management enable efficient implementation of DSP, memory controller, and protocol conversion designs.
For commercial applications requiring a programmable, high‑density FPGA with verified platform features and RoHS compliance, the XC2V3000-5FFG1152C provides a reliable, scalable foundation that integrates core resources and proven architectural elements to support development and deployment.
Request a quote or submit an inquiry today to discuss availability, pricing, and delivery for the XC2V3000-5FFG1152C. Our team can provide technical details and support to help integrate this FPGA into your design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








