XC2V3000-5FFG1152C

IC FPGA 720 I/O 1152FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 720 1769472 1152-BBGA, FCBGA

Quantity 1,204 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O720Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs3584Number of Logic Elements/Cells32256
Number of Gates3000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1769472

Overview of XC2V3000-5FFG1152C – Virtex®-II FPGA, 720 I/O, approximately 1.77 Mbit RAM, 1152-FCBGA

The XC2V3000-5FFG1152C is a Virtex®-II field programmable gate array packaged in a 1152‑ball flip‑chip FCBGA (35×35 mm) for surface-mount applications. The device integrates approximately 32,256 logic elements, roughly 1.77 Mbits of embedded RAM, and 720 user I/O lines, delivering a flexible platform for complex digital designs.

Built for commercial-grade applications, this FPGA supports a broad set of on‑chip resources and platform-level capabilities—memory hierarchy, dedicated arithmetic blocks, and clock management circuitry—making it suitable for high‑performance interfacing, signal processing, and system integration tasks.

Key Features

  • Logic Capacity  Approximately 32,256 logic elements and 3,000,000 system gates for implementing complex digital functions and control logic.
  • Embedded Memory  Total on-chip RAM of 1,769,472 bits (approximately 1.77 Mbits) for packet buffers, FIFOs, and distributed data storage.
  • I/O and Package  720 user I/O pins in a 1152‑BBGA FCBGA (1152‑FCBGA, 35×35) surface‑mount package for high‑density board designs.
  • Arithmetic and DSP Support  Platform includes dedicated 18‑bit × 18‑bit multiplier resources enabling efficient implementation of multiply‑accumulate and DSP functions.
  • Clock Management  Supports Digital Clock Manager (DCM) modules and global clock multiplexer buffers for precise clock control and deskewing (platform capability).
  • Routing and Interconnect  Active interconnect and segmented routing architecture (platform capability) for predictable routing delays and scalable timing.
  • Power and Supply  Nominal core supply range of 1.425 V to 1.575 V to match target board power rails and design constraints.
  • Operating Range  Commercial grade operation from 0 °C to 85 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • High‑speed memory interfaces  Implement controllers and bridges for SDR/DDR memory types using on‑chip resources and platform memory‑interface features.
  • Signal processing and DSP  Leverage the embedded multipliers and sizable logic capacity for filtering, transforms, and other real‑time processing blocks.
  • Custom I/O and protocol bridging  Use the 720 I/O pins and programmable I/O standards to implement protocol converters, card interfaces, and high‑pin‑count glue logic.
  • Embedded system integration  Consolidate glue logic, control state machines, and local buffering into a single programmable device to reduce board complexity.

Unique Advantages

  • High integration density: Combines tens of thousands of logic elements with approximately 1.77 Mbits of embedded RAM to minimize external component count and PCB area.
  • Flexible I/O footprint: 720 user I/Os in a 1152‑ball FCBGA package enable dense connectivity for multi‑lane interfaces and wide buses.
  • Dedicated arithmetic blocks: On‑chip 18×18 multipliers accelerate DSP and numeric operations, reducing the need for external accelerators.
  • Platform clocking features: Built‑in clock management resources (DCM and global clock buffers at the platform level) support precise timing and frequency synthesis for complex systems.
  • Commercial‑grade reliability: Specified 0 °C to 85 °C operating range and RoHS compliance for standard commercial applications.

Why Choose XC2V3000-5FFG1152C?

The XC2V3000-5FFG1152C offers a balanced combination of logic capacity, embedded memory, and a large I/O count in a compact FCBGA package—well suited for designers who need to consolidate digital logic, memory buffering, and I/O interfacing on a single FPGA. Its platform capabilities for arithmetic acceleration and clock management enable efficient implementation of DSP, memory controller, and protocol conversion designs.

For commercial applications requiring a programmable, high‑density FPGA with verified platform features and RoHS compliance, the XC2V3000-5FFG1152C provides a reliable, scalable foundation that integrates core resources and proven architectural elements to support development and deployment.

Request a quote or submit an inquiry today to discuss availability, pricing, and delivery for the XC2V3000-5FFG1152C. Our team can provide technical details and support to help integrate this FPGA into your design.

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