XC2V3000-5FGG676I

IC FPGA 484 I/O 676FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 484 1769472 676-BGA

Quantity 303 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BGANumber of I/O484Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3584Number of Logic Elements/Cells32256
Number of Gates3000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1769472

Overview of XC2V3000-5FGG676I – Virtex®-II Field Programmable Gate Array (FPGA) IC 484 1769472 676-BGA

The XC2V3000-5FGG676I is a Virtex®-II platform Field Programmable Gate Array designed for applications requiring high logic density, significant embedded memory, and a large I/O count. Built on the Virtex-II architecture, it combines programmable logic, dedicated arithmetic resources and flexible I/O to support complex system designs.

With approximately 1.77 Mbits of on-chip RAM, 32,256 logic elements, and 484 user I/Os, this industrial-grade, surface-mount device targets systems that need integrated memory, intensive logic processing and robust I/O connectivity within a 676-ball BGA package.

Key Features

  • Logic Resources  32,256 logic elements and 3,000,000 equivalent system gates provide substantial programmable logic capacity for large designs.
  • Embedded Memory  Approximately 1.77 Mbits of total on-chip RAM implemented in SelectRAM block resources for efficient local storage and buffering.
  • I/O and Interface Flexibility  484 user I/Os delivered through the 676-ball FBGA (27×27) package, supporting high-pin-count external interfacing and system integration.
  • Arithmetic and DSP Support  Series-level features include dedicated 18-bit × 18-bit multiplier blocks and fast carry logic chains for arithmetic- and DSP-oriented functions.
  • Clock Management  Virtex-II platform digital clock management features including Digital Clock Manager (DCM) modules and global clock multiplexers to support precise clocking strategies.
  • Package and Mounting  676-FBGA (27×27) package, surface-mount mounting type for compact PCB integration in space-constrained designs.
  • Power Supply  Core voltage supply range from 1.425 V to 1.575 V, providing defined power requirements for system power delivery design.
  • Operating Range and Compliance  Industrial-grade operating temperature range from −40 °C to 100 °C and RoHS compliance for environmental safety.
  • Development Ecosystem  Supported by the Virtex-II platform development tools and workflows referenced in the product datasheet for VHDL and Verilog design flows and system compilation.

Typical Applications

  • High-performance memory controllers  Large embedded RAM and extensive I/O make the device suitable for implementing SDR/DDR or other DRAM interface logic and buffering.
  • DSP and signal processing  Dedicated multipliers and abundant logic resources support arithmetic-heavy functions and custom DSP pipelines.
  • High-density system glue logic  Use as a central programmable fabric for integrating multiple subsystems, protocol bridging and custom control logic.
  • Prototyping and complex FPGA-based systems  A platform-level Virtex-II device for validating large HDL designs that require significant logic, memory and I/O resources.

Unique Advantages

  • Substantial on-chip memory:  Approximately 1.77 Mbits of embedded RAM reduces external memory dependence and simplifies board-level buffering.
  • High logic capacity:  32,256 logic elements enable implementation of complex state machines, datapaths and control logic in a single device.
  • Extensive I/O availability:  484 user I/Os in a 676-FBGA package facilitate broad external connectivity without multiple devices.
  • Industrial temperature rating:  −40 °C to 100 °C operating range supports deployment in industrial environments requiring extended temperature tolerance.
  • Platform-level design support:  Virtex-II series development flows and tool support streamline HDL development and system integration efforts.
  • RoHS compliant:  Environmentally compliant manufacturing reduces end-product regulatory risks.

Why Choose XC2V3000-5FGG676I?

The XC2V3000-5FGG676I positions itself as a capable Virtex-II FPGA option for designers who need a balance of high logic density, embedded memory and a large I/O footprint in a single industrial-grade device. Its combination of logic elements, dedicated arithmetic resources and platform clock/memory features makes it suitable for complex digital systems, memory interface designs and DSP-oriented applications.

Backed by Virtex-II series documentation and development tool support, the device offers a clear path for HDL-based development and system integration, delivering scalability and robustness for medium- to high-complexity FPGA designs.

If you would like pricing or availability, request a quote or submit a purchase inquiry and our team will respond with a personalized quote and lead-time information.

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