XC2V3000-5FGG676I
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 484 1769472 676-BGA |
|---|---|
| Quantity | 303 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 484 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3584 | Number of Logic Elements/Cells | 32256 | ||
| Number of Gates | 3000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1769472 |
Overview of XC2V3000-5FGG676I – Virtex®-II Field Programmable Gate Array (FPGA) IC 484 1769472 676-BGA
The XC2V3000-5FGG676I is a Virtex®-II platform Field Programmable Gate Array designed for applications requiring high logic density, significant embedded memory, and a large I/O count. Built on the Virtex-II architecture, it combines programmable logic, dedicated arithmetic resources and flexible I/O to support complex system designs.
With approximately 1.77 Mbits of on-chip RAM, 32,256 logic elements, and 484 user I/Os, this industrial-grade, surface-mount device targets systems that need integrated memory, intensive logic processing and robust I/O connectivity within a 676-ball BGA package.
Key Features
- Logic Resources 32,256 logic elements and 3,000,000 equivalent system gates provide substantial programmable logic capacity for large designs.
- Embedded Memory Approximately 1.77 Mbits of total on-chip RAM implemented in SelectRAM block resources for efficient local storage and buffering.
- I/O and Interface Flexibility 484 user I/Os delivered through the 676-ball FBGA (27×27) package, supporting high-pin-count external interfacing and system integration.
- Arithmetic and DSP Support Series-level features include dedicated 18-bit × 18-bit multiplier blocks and fast carry logic chains for arithmetic- and DSP-oriented functions.
- Clock Management Virtex-II platform digital clock management features including Digital Clock Manager (DCM) modules and global clock multiplexers to support precise clocking strategies.
- Package and Mounting 676-FBGA (27×27) package, surface-mount mounting type for compact PCB integration in space-constrained designs.
- Power Supply Core voltage supply range from 1.425 V to 1.575 V, providing defined power requirements for system power delivery design.
- Operating Range and Compliance Industrial-grade operating temperature range from −40 °C to 100 °C and RoHS compliance for environmental safety.
- Development Ecosystem Supported by the Virtex-II platform development tools and workflows referenced in the product datasheet for VHDL and Verilog design flows and system compilation.
Typical Applications
- High-performance memory controllers Large embedded RAM and extensive I/O make the device suitable for implementing SDR/DDR or other DRAM interface logic and buffering.
- DSP and signal processing Dedicated multipliers and abundant logic resources support arithmetic-heavy functions and custom DSP pipelines.
- High-density system glue logic Use as a central programmable fabric for integrating multiple subsystems, protocol bridging and custom control logic.
- Prototyping and complex FPGA-based systems A platform-level Virtex-II device for validating large HDL designs that require significant logic, memory and I/O resources.
Unique Advantages
- Substantial on-chip memory: Approximately 1.77 Mbits of embedded RAM reduces external memory dependence and simplifies board-level buffering.
- High logic capacity: 32,256 logic elements enable implementation of complex state machines, datapaths and control logic in a single device.
- Extensive I/O availability: 484 user I/Os in a 676-FBGA package facilitate broad external connectivity without multiple devices.
- Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in industrial environments requiring extended temperature tolerance.
- Platform-level design support: Virtex-II series development flows and tool support streamline HDL development and system integration efforts.
- RoHS compliant: Environmentally compliant manufacturing reduces end-product regulatory risks.
Why Choose XC2V3000-5FGG676I?
The XC2V3000-5FGG676I positions itself as a capable Virtex-II FPGA option for designers who need a balance of high logic density, embedded memory and a large I/O footprint in a single industrial-grade device. Its combination of logic elements, dedicated arithmetic resources and platform clock/memory features makes it suitable for complex digital systems, memory interface designs and DSP-oriented applications.
Backed by Virtex-II series documentation and development tool support, the device offers a clear path for HDL-based development and system integration, delivering scalability and robustness for medium- to high-complexity FPGA designs.
If you would like pricing or availability, request a quote or submit a purchase inquiry and our team will respond with a personalized quote and lead-time information.

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