XC2V3000-6FFG1152C

The XC2V3000-6FFG1152C is a Virtex®-II Field Programmable Gate Array (FPGA) optimized for high-density logic and flexible high‑I/O system designs. This device integrates 3,584 CLBs (providing 32,256 logic elements), approximately 1.77 Mbits of embedded RAM, and 720 user I/Os in a 1152‑ball FCBGA package.

Built around the Virtex‑II platform architecture, the part targets applications that require a combination of large logic capacity, embedded memory, dedicated multiplier resources and versatile I/O capabilities while operating within a commercial temperature range and a 1.425–1.575 V core supply.

Key Features

• Core Capacity 3,584 configurable logic blocks (CLBs) delivering 32,256 logic elements and an estimated 3,000,000 system gates for complex digital designs.
• Embedded Memory Approximately 1.77 Mbits of on‑chip RAM in block SelectRAM resources to support buffering, state machines and local storage.
• I/O and Package 720 user I/Os in a 1152‑BBGA (1152‑FCBGA, 35×35 mm) package, enabling dense routing to external devices and high‑pin‑count board designs.
• Voltage and Thermal Core supply range of 1.425 V to 1.575 V and commercial operating temperature from 0 °C to 85 °C for standard embedded and enterprise applications.
• DSP and Arithmetic Dedicated 18‑bit × 18‑bit multiplier blocks and fast carry chains for arithmetic and signal processing functions.
• Clock Management and Performance Virtex‑II platform features include Digital Clock Manager modules and global clock buffering options to support precise clocking and frequency synthesis (series documentation cites up to 420 MHz internal clock speed in advance data).
• Memory and External Interface Support Platform-level support for high-performance interfaces to external memory types such as SDR/DDR SDRAM and SRAM, useful for designs requiring wide external memory bandwidth.
• Compliance RoHS compliant for environmental regulatory needs.

Typical Applications

• High‑bandwidth memory interfaces Use the device’s embedded RAM and interface resources to implement SDR/DDR memory controllers and buffering for data‑intensive systems.
• Signal processing and DSP Leverage dedicated 18×18 multiplier blocks and abundant logic resources for filtering, transforms and other real‑time processing tasks.
• Prototyping and system integration Implement complex FPGA prototypes or system‑level integration where high logic density and large I/O counts are required.
• Custom high‑I/O controllers Build protocol bridges, bus controllers or custom I/O subsystems that need many user I/Os and flexible I/O standards.

Unique Advantages

• Highly integrated logic and memory: Combines 3,584 CLBs and approximately 1.77 Mbits of embedded RAM to reduce external memory dependence and simplify board design.
• Wide I/O capacity: 720 user I/Os in a compact FCBGA package enable complex connectivity and support for multiple external interfaces without extensive routing compromises.
• Dedicated arithmetic resources: On‑chip 18×18 multipliers accelerate DSP and arithmetic workloads, lowering the need for external accelerators.
• Platform clocking options: Built‑in clock management features allow precise clock distribution and frequency synthesis suitable for multi‑clock systems.
• RoHS compliant: Meets environmental compliance requirements for lead‑free assemblies.

Why Choose XC2V3000-6FFG1152C?

The XC2V3000-6FFG1152C positions itself as a robust Virtex‑II platform device offering a blend of high logic density, substantial embedded memory and extensive I/O in an FCBGA package. Its combination of CLBs, dedicated multipliers and platform clocking features makes it well suited for designers implementing memory interfaces, real‑time signal processing, and complex system integration tasks within commercial temperature ranges.

For development teams and procurement groups seeking a proven FPGA building block with flexible on‑chip resources and high I/O capacity, this device provides a balanced, verifiable specification set and RoHS compliance for mainstream applications.

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