XC2V3000-4FGG676C

The XC2V3000-4FGG676C is a Virtex®-II field programmable gate array (FPGA) supplied in a 676-ball fine-pitch BGA. The device integrates a high-count logic fabric with embedded memory and extensive I/O to support complex, high-density digital designs.

With approximately 3,000,000 system gates, about 1.77 Mbits of embedded RAM and 484 user I/Os, this commercial-grade, RoHS-compliant FPGA is aimed at applications that require significant logic resources, on‑chip memory, and broad interfacing capability within a surface-mount 676-FBGA (27×27) package.

Key Features

• Logic Capacity — 3,584 configurable logic blocks (CLBs) delivering 32,256 logic elements (logic cells), enabling complex combinational and sequential logic implementations.
• Embedded Memory — Approximately 1.77 Mbits of on-chip RAM (total RAM bits: 1,769,472) for data buffering, state storage and memory-intensive functions.
• Arithmetic Resources — Dedicated multiplier and arithmetic resources described in the Virtex-II platform allow implementation of high-throughput numeric and DSP functions.
• High I/O Count — 484 user I/Os to support broad interfacing requirements and complex board-level connectivity.
• Package and Mounting — 676-ball fine-pitch BGA (supplier package: 676-FBGA, 27×27) designed for surface-mount PCB assembly.
• Power Supply — Core voltage range specified at 1.425 V to 1.575 V to match system power rails.
• Operating Conditions — Commercial grade operation from 0 °C to 85 °C for typical commercial environments.
• Regulatory — RoHS compliant, supporting lead‑free assembly and regulatory requirements.

Typical Applications

• Memory Interface Controllers — Implement SDR/DDR and other external memory interfaces using the device’s on-chip RAM and high logic density for timing-critical buffering and control.
• Signal Processing and DSP — Use dedicated arithmetic resources and abundant logic elements for filtering, transforms and other numeric-intensive algorithms.
• High‑I/O System Glue and Protocol Bridging — 484 I/Os enable complex protocol conversion, board-level bridging and multi-channel interfacing roles.
• Custom Logic and Control — Deploy in applications requiring configurable state machines, control logic and embedded buffering inside a compact 676-FBGA package.

Unique Advantages

• High logic density: Approximately 3,000,000 system gates and 32,256 logic elements provide headroom for large, integrated designs without external glue logic.
• Substantial embedded memory: Approximately 1.77 Mbits of on‑chip RAM reduces external memory dependency and simplifies timing-critical data paths.
• Extensive I/O availability: 484 user I/Os support broad connectivity, reducing the need for additional interface components.
• Compact BGA packaging: 676-FBGA (27×27) delivers high I/O density in a space-efficient surface-mount form factor for modern PCB layouts.
• Commercial temperature range: Rated 0 °C to 85 °C to meet the needs of mainstream electronic products and systems.
• RoHS compliant: Supports lead-free manufacturing processes and regulatory compliance for global markets.

Why Choose XC2V3000-4FGG676C?

The XC2V3000-4FGG676C balances high logic capacity, meaningful on-chip memory and a large I/O complement in a single commercial-grade FPGA package. It is well suited for engineers and system designers who need a programmable device capable of handling complex logic, embedded buffering and extensive external interfacing while maintaining a compact board footprint.

This device offers a clear platform for migrating or consolidating multiple discrete functions into a single FPGA-based solution, delivering scalability and long-term utility in production designs that require significant programmable resources and flexible I/O.

If you would like pricing, availability or a custom quote for the XC2V3000-4FGG676C, request a quote or submit your requirements and our team will respond with detailed purchasing information.