XC2V3000-4BG728I
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 516 1769472 728-BBGA |
|---|---|
| Quantity | 314 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 728-MBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 728-BBGA | Number of I/O | 516 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3584 | Number of Logic Elements/Cells | 32256 | ||
| Number of Gates | 3000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1769472 |
Overview of XC2V3000-4BG728I – Virtex®-II Field Programmable Gate Array (FPGA) IC 516 1769472 728-BBGA
The XC2V3000-4BG728I is a Virtex®-II platform FPGA from AMD designed for applications that require substantial logic capacity, extensive I/O and embedded memory. It combines a high logic element count with a large on-chip RAM budget and an industry-standard BGA package for dense system integration.
As a member of the Virtex-II family, this device targets designs needing configurable logic, flexible I/O and platform-level features such as clock management and dedicated arithmetic resources. Its specifications make it suitable for industrial environments that require extended temperature operation and RoHS compliance.
Key Features
- Core Architecture Virtex®-II platform FPGA architecture with approximately 3,000,000 system gates, delivering substantial programmable logic for complex designs.
- Logic Resources 3,584 configurable logic blocks (CLBs) and 32,256 logic elements, providing abundant combinational and sequential resources for custom logic implementation.
- Embedded Memory Approximately 1.77 Mbits of on-chip RAM (total RAM bits: 1,769,472), suitable for buffering, FIFOs and intermediate storage within FPGA-based designs.
- High-Density I/O 516 user I/O pins to support wide buses and multiple peripheral interfaces in a single device footprint.
- Arithmetic and Clocking Resources Virtex-II platform-level features include dedicated 18-bit × 18-bit multiplier blocks and Digital Clock Manager (DCM) capability for clock de-skew and flexible frequency synthesis.
- Package and Mounting 728-ball BBGA package (supplier device package: 728-MBGA, 35 × 35 mm) optimized for surface-mount assembly and high-density PCB integration.
- Power and Thermal Core supply voltage range of 1.425 V to 1.575 V and operating temperature range of −40 °C to 100 °C, matching industrial operating requirements.
- Compliance RoHS compliant, supporting environmental and regulatory requirements for lead-free assembly.
Typical Applications
- Memory interface controllers — Use the device’s abundant I/O and platform memory capabilities to implement SDR/DDR controller logic and custom memory timing.
- High-throughput data paths — Leverage logic density and embedded RAM for packet buffering, data aggregation and protocol bridging in communications equipment.
- Compute and DSP blocks — Dedicated multiplier resources and large logic arrays make the device well suited for arithmetic-intensive functions and custom signal processing pipelines.
- I/O-rich system integration — With 516 I/Os, the FPGA can consolidate multiple peripherals and interfaces onto a single programmable device.
Unique Advantages
- Substantial programmable capacity: Approximately 32,256 logic elements and ~3,000,000 gates enable complex system integration without partitioning across multiple devices.
- Large embedded memory: Around 1.77 Mbits of on-chip RAM reduces external memory dependency for many buffering and temporary storage needs.
- Extensive I/O availability: 516 user I/Os allow wide buses and many peripheral connections, simplifying board-level interconnect.
- Industrial temperature capability: Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
- Industry-standard packaging: 728-BBGA (35 × 35 mm) supports surface-mount assembly and high-density PCB layouts.
- Regulatory readiness: RoHS compliance supports lead-free manufacturing processes.
Why Choose XC2V3000-4BG728I?
The XC2V3000-4BG728I balances high logic density, significant embedded memory and extensive I/O in a single Virtex®-II platform device. Its combination of 32,256 logic elements, roughly 1.77 Mbits of on-chip RAM and 516 user I/Os makes it a strong choice for industrial and performance-oriented FPGA applications that require integrated logic, memory and interface consolidation.
Engineers and procurement teams seeking a programmable, RoHS-compliant FPGA with industrial temperature operation and a compact 728-BBGA package will find this device suitable for designs that demand scalability, robust clocking and dedicated arithmetic resources available within the Virtex-II platform.
Request a quote or submit an RFQ to receive pricing and availability information for the XC2V3000-4BG728I.

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Certifications and Memberships: ISO9001:2015, RoHS, REACH








