XC2V3000-4BG728I

IC FPGA 516 I/O 728MBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 516 1769472 728-BBGA

Quantity 314 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package728-MBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case728-BBGANumber of I/O516Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3584Number of Logic Elements/Cells32256
Number of Gates3000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1769472

Overview of XC2V3000-4BG728I – Virtex®-II Field Programmable Gate Array (FPGA) IC 516 1769472 728-BBGA

The XC2V3000-4BG728I is a Virtex®-II platform FPGA from AMD designed for applications that require substantial logic capacity, extensive I/O and embedded memory. It combines a high logic element count with a large on-chip RAM budget and an industry-standard BGA package for dense system integration.

As a member of the Virtex-II family, this device targets designs needing configurable logic, flexible I/O and platform-level features such as clock management and dedicated arithmetic resources. Its specifications make it suitable for industrial environments that require extended temperature operation and RoHS compliance.

Key Features

  • Core Architecture Virtex®-II platform FPGA architecture with approximately 3,000,000 system gates, delivering substantial programmable logic for complex designs.
  • Logic Resources 3,584 configurable logic blocks (CLBs) and 32,256 logic elements, providing abundant combinational and sequential resources for custom logic implementation.
  • Embedded Memory Approximately 1.77 Mbits of on-chip RAM (total RAM bits: 1,769,472), suitable for buffering, FIFOs and intermediate storage within FPGA-based designs.
  • High-Density I/O 516 user I/O pins to support wide buses and multiple peripheral interfaces in a single device footprint.
  • Arithmetic and Clocking Resources Virtex-II platform-level features include dedicated 18-bit × 18-bit multiplier blocks and Digital Clock Manager (DCM) capability for clock de-skew and flexible frequency synthesis.
  • Package and Mounting 728-ball BBGA package (supplier device package: 728-MBGA, 35 × 35 mm) optimized for surface-mount assembly and high-density PCB integration.
  • Power and Thermal Core supply voltage range of 1.425 V to 1.575 V and operating temperature range of −40 °C to 100 °C, matching industrial operating requirements.
  • Compliance RoHS compliant, supporting environmental and regulatory requirements for lead-free assembly.

Typical Applications

  • Memory interface controllers — Use the device’s abundant I/O and platform memory capabilities to implement SDR/DDR controller logic and custom memory timing.
  • High-throughput data paths — Leverage logic density and embedded RAM for packet buffering, data aggregation and protocol bridging in communications equipment.
  • Compute and DSP blocks — Dedicated multiplier resources and large logic arrays make the device well suited for arithmetic-intensive functions and custom signal processing pipelines.
  • I/O-rich system integration — With 516 I/Os, the FPGA can consolidate multiple peripherals and interfaces onto a single programmable device.

Unique Advantages

  • Substantial programmable capacity: Approximately 32,256 logic elements and ~3,000,000 gates enable complex system integration without partitioning across multiple devices.
  • Large embedded memory: Around 1.77 Mbits of on-chip RAM reduces external memory dependency for many buffering and temporary storage needs.
  • Extensive I/O availability: 516 user I/Os allow wide buses and many peripheral connections, simplifying board-level interconnect.
  • Industrial temperature capability: Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
  • Industry-standard packaging: 728-BBGA (35 × 35 mm) supports surface-mount assembly and high-density PCB layouts.
  • Regulatory readiness: RoHS compliance supports lead-free manufacturing processes.

Why Choose XC2V3000-4BG728I?

The XC2V3000-4BG728I balances high logic density, significant embedded memory and extensive I/O in a single Virtex®-II platform device. Its combination of 32,256 logic elements, roughly 1.77 Mbits of on-chip RAM and 516 user I/Os makes it a strong choice for industrial and performance-oriented FPGA applications that require integrated logic, memory and interface consolidation.

Engineers and procurement teams seeking a programmable, RoHS-compliant FPGA with industrial temperature operation and a compact 728-BBGA package will find this device suitable for designs that demand scalability, robust clocking and dedicated arithmetic resources available within the Virtex-II platform.

Request a quote or submit an RFQ to receive pricing and availability information for the XC2V3000-4BG728I.

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