XC2V250-4FGG256I
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 172 442368 256-BGA |
|---|---|
| Quantity | 182 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 172 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3456 | ||
| Number of Gates | 250000 | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 442368 |
Overview of XC2V250-4FGG256I – Virtex®-II Field Programmable Gate Array (FPGA), 172 I/O, approx. 0.442 Mbits RAM, 256-BGA
The XC2V250-4FGG256I is a Virtex®-II family FPGA offered by AMD, built for mid-density programmable logic applications. The device combines a structured array of configurable logic blocks with embedded block RAM, dedicated multipliers and flexible I/O to support high-performance interfaces and arithmetic-intensive functions.
This industrial-grade, surface-mount 256-ball BGA device is suited for designs that require a balanced mix of logic resources, embedded memory and I/O density within a single programmable component.
Key Features
- Logic Fabric 384 configurable logic blocks (CLBs) delivering 3,456 logic elements for implementing combinational and sequential logic.
- Embedded Memory Approximately 0.442 Mbits of total on-chip RAM (442,368 bits) organized as block SelectRAM resources for efficient data buffering and local storage.
- Dedicated DSP Resources Integrated 18-bit × 18-bit multiplier blocks for hardware-accelerated arithmetic and signal-processing tasks.
- I/O Capacity and Standards 172 user I/O pins providing flexible interfacing options for external memory, peripherals and high-speed links.
- Clock Management Support for digital clock management (DCM) and global clock routing to enable precise clock control and phase/frequency adjustment.
- Package and Mounting 256-ball fine-pitch BGA package (supplier package: 256-FBGA, 17 × 17 mm) in a surface-mount configuration for board-level integration.
- Power and Operating Range Core supply voltage range of 1.425 V to 1.575 V and industrial operating temperature range from −40 °C to 100 °C.
- Density and Gate Count Approximately 250,000 system gates capacity to support moderate-complexity designs.
- Environmental RoHS compliant.
Typical Applications
- Memory Interface Controllers Implement SDR/DDR-style memory interfaces and custom SRAM/DRAM controllers using the device’s I/O density and embedded RAM.
- Signal Processing and DSP Use dedicated 18×18 multipliers and embedded RAM to accelerate filtering, transforms and other arithmetic-heavy functions.
- High-Speed I/O Bridging Bridge subsystem interfaces or perform protocol adaptation where a mix of moderate logic capacity and flexible I/O is required.
- Prototyping and Board-Level Integration Deploy as a reprogrammable platform for validating system architectures, integrating IP blocks and iterating firmware-driven designs.
Unique Advantages
- Balanced Resource Mix: Combines 3,456 logic elements, block RAM and dedicated multipliers to implement mixed compute and memory workloads without external accelerators.
- Flexible I/O Count: 172 user I/Os provide the pin budget needed for complex board interfaces and external memory connections.
- Industrial Temperature Rating: Qualified for −40 °C to 100 °C operation, enabling use in temperature-demanding environments.
- Compact BGA Package: 256-FBGA (17 × 17 mm) packaging enables dense board layouts while supporting surface-mount assembly.
- Vendor Toolchain Support: Part of the Virtex-II platform with documented device architecture and development support referenced in the product specification.
- Regulatory Compliance: RoHS compliant to meet current environmental material requirements.
Why Choose XC2V250-4FGG256I?
The XC2V250-4FGG256I positions itself as a mid-density, industrial-grade Virtex®-II FPGA that brings a practical balance of logic, embedded RAM and DSP capability in a compact BGA package. Its combination of 3,456 logic elements, approximately 0.442 Mbits of on-chip RAM, dedicated multipliers and 172 I/Os make it suitable for system designs that require moderate gate capacity, memory bandwidth and flexible interfacing within industrial temperature ranges.
For teams seeking a programmable, field-upgradeable device backed by the Virtex-II platform documentation and development ecosystem, the XC2V250-4FGG256I offers a reliable building block for controller, interface and signal-processing applications where on-chip resources and I/O flexibility matter.
Request a quote or submit an inquiry to receive pricing and availability information for the XC2V250-4FGG256I and to discuss how it can fit into your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








