XC2V250-4FGG256I

IC FPGA 172 I/O 256FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 172 442368 256-BGA

Quantity 182 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O172Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3456
Number of Gates250000ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of XC2V250-4FGG256I – Virtex®-II Field Programmable Gate Array (FPGA), 172 I/O, approx. 0.442 Mbits RAM, 256-BGA

The XC2V250-4FGG256I is a Virtex®-II family FPGA offered by AMD, built for mid-density programmable logic applications. The device combines a structured array of configurable logic blocks with embedded block RAM, dedicated multipliers and flexible I/O to support high-performance interfaces and arithmetic-intensive functions.

This industrial-grade, surface-mount 256-ball BGA device is suited for designs that require a balanced mix of logic resources, embedded memory and I/O density within a single programmable component.

Key Features

  • Logic Fabric 384 configurable logic blocks (CLBs) delivering 3,456 logic elements for implementing combinational and sequential logic.
  • Embedded Memory Approximately 0.442 Mbits of total on-chip RAM (442,368 bits) organized as block SelectRAM resources for efficient data buffering and local storage.
  • Dedicated DSP Resources Integrated 18-bit × 18-bit multiplier blocks for hardware-accelerated arithmetic and signal-processing tasks.
  • I/O Capacity and Standards 172 user I/O pins providing flexible interfacing options for external memory, peripherals and high-speed links.
  • Clock Management Support for digital clock management (DCM) and global clock routing to enable precise clock control and phase/frequency adjustment.
  • Package and Mounting 256-ball fine-pitch BGA package (supplier package: 256-FBGA, 17 × 17 mm) in a surface-mount configuration for board-level integration.
  • Power and Operating Range Core supply voltage range of 1.425 V to 1.575 V and industrial operating temperature range from −40 °C to 100 °C.
  • Density and Gate Count Approximately 250,000 system gates capacity to support moderate-complexity designs.
  • Environmental RoHS compliant.

Typical Applications

  • Memory Interface Controllers Implement SDR/DDR-style memory interfaces and custom SRAM/DRAM controllers using the device’s I/O density and embedded RAM.
  • Signal Processing and DSP Use dedicated 18×18 multipliers and embedded RAM to accelerate filtering, transforms and other arithmetic-heavy functions.
  • High-Speed I/O Bridging Bridge subsystem interfaces or perform protocol adaptation where a mix of moderate logic capacity and flexible I/O is required.
  • Prototyping and Board-Level Integration Deploy as a reprogrammable platform for validating system architectures, integrating IP blocks and iterating firmware-driven designs.

Unique Advantages

  • Balanced Resource Mix: Combines 3,456 logic elements, block RAM and dedicated multipliers to implement mixed compute and memory workloads without external accelerators.
  • Flexible I/O Count: 172 user I/Os provide the pin budget needed for complex board interfaces and external memory connections.
  • Industrial Temperature Rating: Qualified for −40 °C to 100 °C operation, enabling use in temperature-demanding environments.
  • Compact BGA Package: 256-FBGA (17 × 17 mm) packaging enables dense board layouts while supporting surface-mount assembly.
  • Vendor Toolchain Support: Part of the Virtex-II platform with documented device architecture and development support referenced in the product specification.
  • Regulatory Compliance: RoHS compliant to meet current environmental material requirements.

Why Choose XC2V250-4FGG256I?

The XC2V250-4FGG256I positions itself as a mid-density, industrial-grade Virtex®-II FPGA that brings a practical balance of logic, embedded RAM and DSP capability in a compact BGA package. Its combination of 3,456 logic elements, approximately 0.442 Mbits of on-chip RAM, dedicated multipliers and 172 I/Os make it suitable for system designs that require moderate gate capacity, memory bandwidth and flexible interfacing within industrial temperature ranges.

For teams seeking a programmable, field-upgradeable device backed by the Virtex-II platform documentation and development ecosystem, the XC2V250-4FGG256I offers a reliable building block for controller, interface and signal-processing applications where on-chip resources and I/O flexibility matter.

Request a quote or submit an inquiry to receive pricing and availability information for the XC2V250-4FGG256I and to discuss how it can fit into your next design.

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