XC2V250-4FGG256C
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 172 442368 256-BGA |
|---|---|
| Quantity | 409 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 172 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3456 | ||
| Number of Gates | 250000 | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 442368 |
Overview of XC2V250-4FGG256C – Virtex®-II Field Programmable Gate Array (FPGA) IC 172 442368 256-BGA
The XC2V250-4FGG256C is a Virtex®-II class FPGA offered in a 256-ball fine-pitch BGA package. It delivers a balance of programmable logic, on-chip RAM, and flexible I/O for commercial embedded and communications applications that require system-level integration and configurable hardware acceleration.
Built around the Virtex®-II platform architecture, this device targets designs that need a mix of logic resources, dedicated arithmetic blocks, and high-performance memory interfaces while operating within commercial temperature and supply ranges.
Key Features
- Logic Resources Approximately 3,456 logic elements and 384 CLB units (per device specification), supporting up to 250,000 gates for custom digital logic and control functions.
- Embedded Memory Approximately 0.44 Mbits of on-chip RAM (442,368 total RAM bits) for data buffering, lookup tables, and tightly-coupled memory in custom architectures.
- Dedicated Arithmetic Series-level Virtex®-II features include 18-bit × 18-bit multiplier blocks for arithmetic and DSP tasks (refer to device datasheet for block availability and configuration).
- I/O and Interface Capability 172 user I/Os in a fine-pitch 256-BGA package enable broad connectivity to external memory and peripheral devices; the platform supports high-performance memory interfaces at the series level.
- Clock and Timing Virtex®-II family features include digital clock management and global clock resources to support precise clocking and frequency synthesis (see datasheet for DCM counts and configuration).
- Package & Mounting 256-FBGA (17 × 17) surface-mount package provides a compact footprint suitable for space-constrained boards.
- Power & Thermal Core supply voltage range specified at 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C, aligned with commercial-grade system requirements.
- Compliance RoHS compliant to support lead-free assembly processes.
Typical Applications
- Memory Interface and Bridge Implement SDR/DDR and SRAM interface logic and custom memory controllers using the device's I/O count and the Virtex®-II platform memory features.
- Signal Processing and DSP Acceleration Use dedicated multiplier blocks and embedded RAM to accelerate arithmetic-heavy workloads and streaming data tasks.
- Custom Control and Glue Logic Replace multiple discrete components by implementing board-level control, protocol adaptation, and system glue logic inside the FPGA.
- Communications and Peripheral Interfaces Deploy in commercial communications equipment that requires flexible I/O and the ability to implement high-speed interfaces and protocol engines.
Unique Advantages
- Compact, production-ready package The 256-FBGA (17×17) package delivers a high I/O count in a compact surface-mount form factor that simplifies PCB routing for dense systems.
- Balanced on-chip resources A mix of approximately 3,456 logic elements and ~0.44 Mbits of embedded RAM supports mid-density designs without excessive external memory dependency.
- Dedicated arithmetic support Series-level 18×18 multipliers enable efficient implementation of DSP and compute kernels directly in fabric.
- Commercial temperature and supply compatibility Specified for 0 °C to 85 °C operation and a defined core voltage window (1.425–1.575 V), making it suitable for typical commercial embedded systems.
- Regulatory-friendly material RoHS compliance helps streamline lead-free manufacturing and regulatory considerations.
Why Choose XC2V250-4FGG256C?
The XC2V250-4FGG256C positions itself as a mid-density, commercial-grade Virtex®-II FPGA option for engineers who need a practical mix of logic, on-chip RAM, and arithmetic resources in a compact 256-BGA package. Its 172 I/Os and platform features enable robust memory interfacing, DSP acceleration, and system-level integration for communications and embedded applications.
For projects that require predictable supply-voltage and temperature boundaries, RoHS compliance, and proven Virtex®-II architecture capabilities, this device offers a clear, verifiable foundation for scalable designs backed by documented datasheet resources.
Request a quote or submit a parts inquiry to get pricing, availability, and delivery information for XC2V250-4FGG256C.

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