XC2V250-4FGG256C

IC FPGA 172 I/O 256FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 172 442368 256-BGA

Quantity 409 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O172Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3456
Number of Gates250000ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of XC2V250-4FGG256C – Virtex®-II Field Programmable Gate Array (FPGA) IC 172 442368 256-BGA

The XC2V250-4FGG256C is a Virtex®-II class FPGA offered in a 256-ball fine-pitch BGA package. It delivers a balance of programmable logic, on-chip RAM, and flexible I/O for commercial embedded and communications applications that require system-level integration and configurable hardware acceleration.

Built around the Virtex®-II platform architecture, this device targets designs that need a mix of logic resources, dedicated arithmetic blocks, and high-performance memory interfaces while operating within commercial temperature and supply ranges.

Key Features

  • Logic Resources  Approximately 3,456 logic elements and 384 CLB units (per device specification), supporting up to 250,000 gates for custom digital logic and control functions.
  • Embedded Memory  Approximately 0.44 Mbits of on-chip RAM (442,368 total RAM bits) for data buffering, lookup tables, and tightly-coupled memory in custom architectures.
  • Dedicated Arithmetic  Series-level Virtex®-II features include 18-bit × 18-bit multiplier blocks for arithmetic and DSP tasks (refer to device datasheet for block availability and configuration).
  • I/O and Interface Capability  172 user I/Os in a fine-pitch 256-BGA package enable broad connectivity to external memory and peripheral devices; the platform supports high-performance memory interfaces at the series level.
  • Clock and Timing  Virtex®-II family features include digital clock management and global clock resources to support precise clocking and frequency synthesis (see datasheet for DCM counts and configuration).
  • Package & Mounting  256-FBGA (17 × 17) surface-mount package provides a compact footprint suitable for space-constrained boards.
  • Power & Thermal  Core supply voltage range specified at 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C, aligned with commercial-grade system requirements.
  • Compliance  RoHS compliant to support lead-free assembly processes.

Typical Applications

  • Memory Interface and Bridge  Implement SDR/DDR and SRAM interface logic and custom memory controllers using the device's I/O count and the Virtex®-II platform memory features.
  • Signal Processing and DSP Acceleration  Use dedicated multiplier blocks and embedded RAM to accelerate arithmetic-heavy workloads and streaming data tasks.
  • Custom Control and Glue Logic  Replace multiple discrete components by implementing board-level control, protocol adaptation, and system glue logic inside the FPGA.
  • Communications and Peripheral Interfaces  Deploy in commercial communications equipment that requires flexible I/O and the ability to implement high-speed interfaces and protocol engines.

Unique Advantages

  • Compact, production-ready package  The 256-FBGA (17×17) package delivers a high I/O count in a compact surface-mount form factor that simplifies PCB routing for dense systems.
  • Balanced on-chip resources  A mix of approximately 3,456 logic elements and ~0.44 Mbits of embedded RAM supports mid-density designs without excessive external memory dependency.
  • Dedicated arithmetic support  Series-level 18×18 multipliers enable efficient implementation of DSP and compute kernels directly in fabric.
  • Commercial temperature and supply compatibility  Specified for 0 °C to 85 °C operation and a defined core voltage window (1.425–1.575 V), making it suitable for typical commercial embedded systems.
  • Regulatory-friendly material  RoHS compliance helps streamline lead-free manufacturing and regulatory considerations.

Why Choose XC2V250-4FGG256C?

The XC2V250-4FGG256C positions itself as a mid-density, commercial-grade Virtex®-II FPGA option for engineers who need a practical mix of logic, on-chip RAM, and arithmetic resources in a compact 256-BGA package. Its 172 I/Os and platform features enable robust memory interfacing, DSP acceleration, and system-level integration for communications and embedded applications.

For projects that require predictable supply-voltage and temperature boundaries, RoHS compliance, and proven Virtex®-II architecture capabilities, this device offers a clear, verifiable foundation for scalable designs backed by documented datasheet resources.

Request a quote or submit a parts inquiry to get pricing, availability, and delivery information for XC2V250-4FGG256C.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up