XC2V250-4FGG456I

The XC2V250-4FGG456I is a Virtex®-II platform FPGA packaged in a 456-ball BGA (456-BBGA / 456-FBGA 23×23) and specified for industrial temperature operation. It delivers a balanced mix of programmable logic, embedded memory, and I/O density for custom digital designs that require on-chip RAM, DSP-friendly arithmetic blocks, and a sizeable user I/O count.

Built on the Virtex-II architecture, the device provides the core resources and clocking features typical of the platform, enabling designs that integrate logic, memory, and interface functionality in a single, surface-mount component.

Key Features

• Core Logic  3,456 logic elements (cells) and approximately 250,000 gates provide the programmable logic substrate for custom digital functions and glue logic.
• Embedded Memory  Total on-chip RAM of 442,368 bits — approximately 0.44 Mbits of embedded memory — for data buffering, FIFOs, and small on-chip storage.
• DSP & Arithmetic Blocks  Series-level support for dedicated 18-bit × 18-bit multiplier blocks to accelerate arithmetic and signal-processing operations.
• I/O Count & SelectIO Features  200 user I/Os in the 456-BBGA package, with the Virtex-II platform offering flexible I/O standards and high-performance I/O capabilities suited to varied interface requirements.
• Clocking & Timing  Virtex-II platform includes Digital Clock Manager (DCM) and global clock resources for precise clock distribution and frequency control across the design.
• Package & Mounting  456-ball BGA (456-FBGA, 23×23), surface-mount package for board-level integration where compact, reliable BGA mounting is required.
• Power & Temperature  Core supply voltage specified at 1.425 V to 1.575 V and an operating temperature range of −40 °C to 100 °C, supporting industrial-environment deployments.
• Compliance  RoHS-compliant construction and designated industrial grade per the product specifications.

Typical Applications

• Data-path acceleration and DSP  Implement arithmetic-intensive blocks using the device’s dedicated multiplier resources and on-chip memory for intermediate storage.
• Memory interface controllers  Bridge and manage external memories using the Virtex-II platform’s high-performance memory-interface capabilities combined with local RAM resources.
• High-density glue logic and control  Integrate peripheral control, protocol adaptation, and custom finite-state machines using the available logic elements and abundant user I/Os.

Unique Advantages

• Compact, integrated solution: 3,456 logic elements, embedded RAM, and dedicated multipliers in a single 456-BBGA package reduce external component count and simplify board design.
• Industrial temperature qualification: Rated from −40 °C to 100 °C for reliable operation in temperature-challenging environments.
• Flexible I/O capacity: 200 user I/Os enable multiple interfaces and bus connections without immediate need for external I/O expanders.
• Platform-level clocking and DSP support: Virtex-II architecture features such as DCMs and 18×18 multipliers allow designers to implement precise timing and efficient arithmetic blocks.
• Standard BGA package: 456-ball FBGA (23×23) provides a routable footprint for high-density PCB layouts and surface-mount assembly.
• Regulatory and manufacturing readiness: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose XC2V250-4FGG456I?

The XC2V250-4FGG456I positions Virtex-II platform capabilities in a mid-density FPGA package suitable for designers who need a mix of programmable logic, embedded memory, and DSP-friendly resources in an industrial-grade device. Its 200 I/Os and 456-ball BGA footprint make it a practical choice for board-level designs that require compact packaging and robust thermal and environmental performance.

For engineering teams building custom controllers, memory interfaces, or data-path accelerators, this device delivers measurable on-chip resources and the platform-level clocking and I/O flexibility that simplify integration and shorten development cycles.

Request a quote or submit an inquiry for availability and pricing to move your design from specification to production-ready hardware.