XC2V250-4FGG456C
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 200 442368 456-BBGA |
|---|---|
| Quantity | 1,648 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 456-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 456-BBGA | Number of I/O | 200 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3456 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 442368 |
Overview of XC2V250-4FGG456C – Virtex®-II Field Programmable Gate Array (FPGA) IC 200 442368 456-BBGA
The XC2V250-4FGG456C is a commercial-grade Virtex®-II platform FPGA in a 456-ball BGA package. It provides programmable logic, embedded memory, and a flexible I/O complement for system integration and programmable hardware acceleration.
Built around the Virtex-II architecture, this device targets commercial embedded and board-level designs that require on-chip RAM, dedicated arithmetic resources, and a high-density I/O footprint while operating within a 1.425 V–1.575 V supply range and a 0 °C–85 °C temperature window.
Key Features
- Logic Capacity Approximately 3,456 logic elements supporting up to 250,000 system gates for mid-range programmable logic implementations.
- Embedded Memory Approximately 0.42 Mbits (442,368 bits) of on-chip RAM for data buffering and local storage, compatible with series SelectRAM block architectures.
- Dedicated Arithmetic Resources Built to leverage Virtex-II series arithmetic features including 18-bit × 18-bit multiplier support for DSP and signal-processing functions.
- I/O Resources 200 user I/Os available for board interfaces and peripheral connectivity in a high-density footprint.
- Clocking and Timing Series-level clock management features such as Digital Clock Manager (DCM) modules and global clock multiplexer buffers are supported for precise clock control.
- Power and Supply Low-voltage core operation with a specified supply range of 1.425 V to 1.575 V, suitable for compatible commercial power domains.
- Package and Mounting 456-ball BGA (listed as 456-BBGA) with supplier device package 456-FBGA (23×23); surface-mount package for dense board layouts.
- Commercial Grade Temperature Rated for 0 °C to 85 °C operation for standard commercial applications.
- Standards and Ecosystem Part of the Virtex-II family, which includes SelectIO, SelectRAM, and platform tools support documented in the series product specification.
- RoHS Compliance RoHS-compliant device suitable for environmentally restricted assemblies.
Typical Applications
- Memory interface controllers Use the device’s embedded RAM and series memory-interface features to implement SDR/DDR and SRAM bridge logic and controllers.
- Signal processing and DSP blocks Leverage 18×18 multipliers and on-chip RAM to implement filtering, FFTs, and other arithmetic- intensive tasks.
- Protocol bridging and custom I/O Deploy the 200 I/Os and Virtex-II SelectIO capabilities for board-level protocol translation and high-speed peripheral interfaces.
- Embedded system integration Integrate control, glue logic, and moderate-density programmable functions into commercial embedded products.
Unique Advantages
- Balanced logic and memory mix: Approximately 3,456 logic elements combined with ~0.42 Mbits of embedded RAM supports both control logic and local data buffering without external memory for many mid-range designs.
- Dedicated DSP support: 18-bit × 18-bit multiplier capability enables efficient implementation of arithmetic-heavy functions while conserving general logic fabric.
- High-density I/O in a compact package: 200 user I/Os in a 456-ball BGA (23×23 supplier package) provide a dense interface solution for systems with multiple peripherals.
- Commercial temperature and RoHS compliance: Rated for 0 °C–85 °C operation and RoHS-compliant for mainstream commercial product lines and supply-chain requirements.
- Platform-level clocking features: Virtex-II series clock management primitives such as DCMs and global clock buffers enable precise timing control for synchronous designs.
Why Choose XC2V250-4FGG456C?
The XC2V250-4FGG456C offers a practical combination of logic density, embedded memory, and arithmetic resources within a commercial-rated BGA package. It is well suited for designers needing a mid-range Virtex-II FPGA that balances programmable logic, on-chip RAM, and I/O for board-level integration and embedded applications.
As part of the Virtex-II family, this device benefits from documented series-level architecture and development support, making it a viable option for projects that require scalable programmable logic with established toolchain support and design references.
Request a quote or submit an inquiry to check availability, lead times, and pricing for the XC2V250-4FGG456C.

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