XC2V250-4CSG144I

The XC2V250-4CSG144I is a Virtex®-II field programmable gate array (FPGA) manufactured by AMD, supplied in a 144-TFBGA/CSPBGA package. It delivers a balance of programmable logic, on-chip memory and I/O capability suited to industrial applications that require reconfigurable logic and robust operating conditions.

Built on the Virtex-II platform, the device targets designs needing moderate logic density, embedded memory and flexible interfacing while supporting industrial temperature ranges and controlled supply voltage for reliable operation.

Key Features

• Logic Capacity — 3,456 logic elements (reported as 3,456 logic cells) and approximately 250,000 gates provide the programmable fabric for combinational and sequential logic.
• Embedded Memory — Approximately 0.44 Mbits (442,368 bits) of on-chip RAM to support buffers, FIFOs and small embedded storage needs.
• I/O Count and Flexibility — 92 user I/O pins available for interface to peripherals, memory and custom I/O networks.
• Arithmetic Resources — Series-level Virtex-II features include dedicated 18-bit × 18-bit multiplier blocks for hardware acceleration of DSP and arithmetic functions.
• Clock Management — Virtex-II platform supports Digital Clock Manager (DCM) modules for clock de-skew and frequency synthesis (series-level capability).
• Package and Mounting — Surface-mount 144-TFBGA (supplier package: 144-LCSBGA, 12×12) for high-density board integration.
• Power Supply — Specified core voltage range of 1.425 V to 1.575 V for regulated, predictable power design.
• Industrial Temperature Grade — Qualified for operation from −40 °C to 100 °C to meet demanding environmental conditions.
• Compliance — RoHS compliant, supporting regulatory and manufacturing requirements.

Typical Applications

• Industrial Automation — Implement motor control, logic sequencing and custom protocol handling using the device’s logic and I/O resources within industrial temperature limits.
• Memory Interface and Buffering — Use embedded RAM and series-level high-performance memory interfaces to implement DRAM/SDRAM buffering, caching or interface glue logic.
• Signal Processing Acceleration — Leverage on-chip multipliers and logic fabric for finite impulse response (FIR) filters, fixed-point arithmetic and other DSP blocks.
• Custom I/O and Protocol Bridging — 92 I/Os enable implementation of custom peripheral interfaces, bus bridging and board-level glue logic.

Unique Advantages

• Balanced Logic and Memory: Combines ~3,456 logic elements with approximately 0.44 Mbits of embedded RAM to support control, buffering and moderate DSP tasks without external devices.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable deployment in harsh operating environments.
• Compact, High-Density Package: 144-TFBGA (12×12) BGA footprint minimizes board area while offering robust soldered connections for production assemblies.
• Deterministic Power Envelope: Defined core supply range (1.425 V–1.575 V) simplifies power rail design and margining for stable operation.
• Series-Proven Platform Features: Access to Virtex-II platform capabilities such as 18×18 multipliers and Digital Clock Manager modules for clocking and arithmetic acceleration.

Why Choose XC2V250-4CSG144I?

The XC2V250-4CSG144I brings Virtex®-II platform capabilities into a compact, industrial-grade package, delivering a useful combination of logic density, embedded memory and configurable I/O for mid-range FPGA applications. Its defined electrical and thermal specifications support predictable integration into industrial and embedded systems.

This part is appropriate for designers who need moderate gate count and on-chip RAM with the flexibility of reprogrammable logic, placed within a robust package and temperature envelope that aligns with industrial system requirements.

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