XC2V2000-6FFG896C
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 624 1032192 896-BBGA, FCBGA |
|---|---|
| Quantity | 202 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FCBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BBGA, FCBGA | Number of I/O | 624 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2688 | Number of Logic Elements/Cells | 24192 | ||
| Number of Gates | 2000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1032192 |
Overview of XC2V2000-6FFG896C – Virtex®-II Field Programmable Gate Array (FPGA) IC 624 1032192 896-BBGA, FCBGA
The XC2V2000-6FFG896C is a Virtex®-II FPGA from AMD designed for mid-to-high density programmable logic applications. It provides a combination of programmable logic, embedded memory, and flexible I/O in a 896-ball FCBGA package suited for surface-mount assembly.
Targeted for commercial-grade systems, the device integrates 24,192 logic elements, approximately 1.03 Mbits of on-chip RAM, and 624 user I/O pins, enabling implementations such as memory interfaces, signal processing engines, and complex digital controllers while operating from a 1.425 V–1.575 V core supply and a 0 °C to 85 °C temperature range.
Key Features
- Core Logic 24,192 logic elements (logic cells) and an estimated 2,000,000 system gates provide the programmable fabric for custom digital implementations.
- Embedded Memory Approximately 1.03 Mbits of embedded RAM (Total RAM Bits: 1,032,192) for block and distributed storage within designs.
- I/O Capability 624 user I/O pins delivered from the device package provide flexible external interfacing; package/pinout supports a wide range of signaling standards described in the Virtex-II platform documentation.
- Arithmetic Blocks Virtex-II platform features include dedicated 18-bit × 18-bit multiplier resources for arithmetic and DSP functions (see platform documentation for details).
- Clock Management The Virtex-II family provides advanced clock management, including Digital Clock Manager (DCM) modules described in the platform data, to support frequency synthesis and phase control.
- Package & Mounting 896-FCBGA (31×31) package, surface-mount mounting type; listed package case also includes 896-BBGA, FCBGA variants for board-level integration.
- Electrical & Environmental Core supply voltage range 1.425 V to 1.575 V. Commercial grade device with operating temperature range 0 °C to 85 °C and RoHS compliance.
Typical Applications
- Memory Interface Controllers Implements DRAM/SRAM interface logic and protocol bridging using the device’s ample I/O count and on-chip RAM.
- Signal Processing & DSP Leverages dedicated multiplier resources and embedded RAM for filtering, encoding, and other arithmetic-intensive tasks.
- High-Performance Digital Systems Suitable for custom logic, glue-logic consolidation, and system integration where dense programmable logic and flexible I/O are required.
Unique Advantages
- High Logic Density: 24,192 logic elements deliver significant programmable capacity for complex digital designs without external ASICs.
- Integrated Memory Resources: Approximately 1.03 Mbits of on-chip RAM reduces dependency on external memory for buffering and local storage.
- Flexible External Connectivity: 624 user I/Os in an FCBGA package provide broad options for interfacing with peripherals, memory, and high-speed links.
- Platform-Level Clock and Arithmetic Features: Built-in DCM support and dedicated multipliers (as described in the Virtex-II platform documentation) accelerate timing control and DSP tasks.
- Board-Level Compatibility: 896-FCBGA (31×31) package and surface-mount mounting simplify integration into commercial PCBs and assembly flows.
- Regulatory & Environmental: RoHS compliance supports contemporary environmental requirements for commercial electronics.
Why Choose XC2V2000-6FFG896C?
The XC2V2000-6FFG896C combines substantial programmable logic capacity with embedded memory and a high I/O count in a commercial-grade FCBGA package. It is a practical choice for engineers building memory interfaces, DSP subsystems, and multifunction digital controllers that require a balance of integration and flexibility while operating within a 0 °C to 85 °C range and a 1.425 V–1.575 V core supply.
Backed by the Virtex-II platform architecture, the device benefits from documented clock management and arithmetic resources, making it suitable for designs that leverage platform-level features to reduce board-level complexity and accelerate development.
Request a quote or submit an inquiry to receive pricing and availability information for the XC2V2000-6FFG896C. Our team will assist with lead times and order placement.

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