XC2V2000-6FFG896C

IC FPGA 624 I/O 896FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 624 1032192 896-BBGA, FCBGA

Quantity 202 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package896-FCBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BBGA, FCBGANumber of I/O624Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2688Number of Logic Elements/Cells24192
Number of Gates2000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1032192

Overview of XC2V2000-6FFG896C – Virtex®-II Field Programmable Gate Array (FPGA) IC 624 1032192 896-BBGA, FCBGA

The XC2V2000-6FFG896C is a Virtex®-II FPGA from AMD designed for mid-to-high density programmable logic applications. It provides a combination of programmable logic, embedded memory, and flexible I/O in a 896-ball FCBGA package suited for surface-mount assembly.

Targeted for commercial-grade systems, the device integrates 24,192 logic elements, approximately 1.03 Mbits of on-chip RAM, and 624 user I/O pins, enabling implementations such as memory interfaces, signal processing engines, and complex digital controllers while operating from a 1.425 V–1.575 V core supply and a 0 °C to 85 °C temperature range.

Key Features

  • Core Logic  24,192 logic elements (logic cells) and an estimated 2,000,000 system gates provide the programmable fabric for custom digital implementations.
  • Embedded Memory  Approximately 1.03 Mbits of embedded RAM (Total RAM Bits: 1,032,192) for block and distributed storage within designs.
  • I/O Capability  624 user I/O pins delivered from the device package provide flexible external interfacing; package/pinout supports a wide range of signaling standards described in the Virtex-II platform documentation.
  • Arithmetic Blocks  Virtex-II platform features include dedicated 18-bit × 18-bit multiplier resources for arithmetic and DSP functions (see platform documentation for details).
  • Clock Management  The Virtex-II family provides advanced clock management, including Digital Clock Manager (DCM) modules described in the platform data, to support frequency synthesis and phase control.
  • Package & Mounting  896-FCBGA (31×31) package, surface-mount mounting type; listed package case also includes 896-BBGA, FCBGA variants for board-level integration.
  • Electrical & Environmental  Core supply voltage range 1.425 V to 1.575 V. Commercial grade device with operating temperature range 0 °C to 85 °C and RoHS compliance.

Typical Applications

  • Memory Interface Controllers  Implements DRAM/SRAM interface logic and protocol bridging using the device’s ample I/O count and on-chip RAM.
  • Signal Processing & DSP  Leverages dedicated multiplier resources and embedded RAM for filtering, encoding, and other arithmetic-intensive tasks.
  • High-Performance Digital Systems  Suitable for custom logic, glue-logic consolidation, and system integration where dense programmable logic and flexible I/O are required.

Unique Advantages

  • High Logic Density:  24,192 logic elements deliver significant programmable capacity for complex digital designs without external ASICs.
  • Integrated Memory Resources:  Approximately 1.03 Mbits of on-chip RAM reduces dependency on external memory for buffering and local storage.
  • Flexible External Connectivity:  624 user I/Os in an FCBGA package provide broad options for interfacing with peripherals, memory, and high-speed links.
  • Platform-Level Clock and Arithmetic Features:  Built-in DCM support and dedicated multipliers (as described in the Virtex-II platform documentation) accelerate timing control and DSP tasks.
  • Board-Level Compatibility:  896-FCBGA (31×31) package and surface-mount mounting simplify integration into commercial PCBs and assembly flows.
  • Regulatory & Environmental:  RoHS compliance supports contemporary environmental requirements for commercial electronics.

Why Choose XC2V2000-6FFG896C?

The XC2V2000-6FFG896C combines substantial programmable logic capacity with embedded memory and a high I/O count in a commercial-grade FCBGA package. It is a practical choice for engineers building memory interfaces, DSP subsystems, and multifunction digital controllers that require a balance of integration and flexibility while operating within a 0 °C to 85 °C range and a 1.425 V–1.575 V core supply.

Backed by the Virtex-II platform architecture, the device benefits from documented clock management and arithmetic resources, making it suitable for designs that leverage platform-level features to reduce board-level complexity and accelerate development.

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