XC2V2000-5FG676I

IC FPGA 456 I/O 676FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 456 1032192 676-BGA

Quantity 173 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BGANumber of I/O456Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2688Number of Logic Elements/Cells24192
Number of Gates2000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1032192

Overview of XC2V2000-5FG676I – Virtex®-II FPGA, 676-FBGA, Industrial Grade

The XC2V2000-5FG676I is a Virtex®-II field programmable gate array (FPGA) in a 676-ball fine-pitch BGA package, offered in an industrial-grade operating range. It provides a high I/O count and substantial on-chip memory and logic resources for system designs that require configurable logic, embedded memory, and high-performance I/O.

Built on the Virtex-II platform architecture, the device includes SelectRAM memory resources, dedicated multiplier blocks and clock management features described in the Virtex-II series documentation, delivering a configurable foundation for complex digital designs.

Key Features

  • Logic Capacity  24,192 logic elements enabling sizable programmable logic implementations.
  • Embedded Memory  Approximately 1.03 Mbits of on-chip RAM (1,032,192 total RAM bits) for data buffering, FIFOs and state storage.
  • I/O Density  456 user I/Os supporting high-pin-count interfacing and board-level connectivity.
  • Gate Equivalent  Approximately 2,000,000 system gates for estimating design scale and integration.
  • Dedicated Arithmetic Resources  Series-level support for 18-bit × 18-bit multiplier blocks as described in the Virtex-II documentation for hardware-accelerated arithmetic.
  • Clock Management  Virtex-II series Digital Clock Manager (DCM) and global clock multiplexer capabilities are supported by the platform architecture.
  • Package and Mounting  676-FBGA (27×27) package, 676-BGA package case; surface mount mounting for standard PCB assembly.
  • Power Rail  Core supply voltage range: 1.425 V to 1.575 V, enabling precise power budgeting in system designs.
  • Temperature Range  Industrial operating range from −40 °C to 100 °C for demanding environmental conditions.
  • Environmental Compliance  RoHS compliant for adherence to common environmental requirements.

Typical Applications

  • Memory Interface and Controllers  Use where embedded logic must orchestrate SDR/DDR and other external memory interfaces, leveraging the platform's memory-interface features described in the series documentation.
  • High-Density Logic and Control  Implement complex state machines, protocol processing, and glue logic using the device's 24,192 logic elements and abundant I/O.
  • Data Path Acceleration  Offload arithmetic and DSP-like functions to the device using the platform's dedicated multiplier resources for deterministic, hardware-accelerated processing.
  • High-Performance I/O Systems  Integrate multiple high-pin-count interfaces and custom I/O standards using up to 456 user I/Os in board-level designs.

Unique Advantages

  • Substantial Logic and Memory in One Device:  Combines 24,192 logic elements with approximately 1.03 Mbits of embedded RAM to minimize external components and simplify system architecture.
  • High I/O Count:  456 user I/Os allow dense board-level connectivity and reduce the need for external multiplexing or bridging.
  • Industrial Temperature Support:  Rated for −40 °C to 100 °C operation, suitable for temperature-demanding environments.
  • Platform-Level Capabilities:  Built on the Virtex-II architecture with SelectRAM blocks, dedicated multipliers and clock management features to accelerate design implementation.
  • RoHS Compliance:  Meets common environmental regulations to support modern manufacturing and procurement requirements.
  • Compact, Surface-Mount Package:  676-FBGA (27×27) offers a high pin-count footprint in a compact form factor for space-constrained designs.

Why Choose XC2V2000-5FG676I?

The XC2V2000-5FG676I positions itself as a robust, industrial-grade Virtex-II FPGA option that balances substantial logic capacity, embedded memory and high I/O density in a compact 676-FBGA package. It is suited to engineers who require configurable hardware resources—logic, RAM and dedicated arithmetic blocks—within a single FPGA to implement complex, high-pin-count systems.

With platform-level features from the Virtex-II family and industry-oriented thermal ratings and environmental compliance, this device provides a scalable foundation for designs that need configurable performance, integration and long-term manufacturability.

Request a quote or submit an inquiry to get pricing and availability for the XC2V2000-5FG676I and to discuss how this FPGA can fit into your next design.

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