XC2V2000-6BGG575C

IC FPGA 408 I/O 575BGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 408 1032192 575-BBGA

Quantity 389 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package575-BGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case575-BBGANumber of I/O408Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2688Number of Logic Elements/Cells24192
Number of Gates2000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1032192

Overview of XC2V2000-6BGG575C – Virtex®-II FPGA, 408 I/O, 575-BBGA

The XC2V2000-6BGG575C is a Virtex®-II Field Programmable Gate Array (FPGA) in a 575-ball BGA (31 × 31) package, designed for commercial-grade applications. Built on the Virtex-II platform architecture, it delivers a balance of logic capacity, embedded memory, and flexible I/O suitable for complex digital designs that require on-chip RAM, dedicated arithmetic blocks and a high I/O count.

This device targets designs requiring substantial programmable logic and memory integration — including memory interface controllers, DSP building blocks, and high-density I/O subsystems — while operating within a commercial temperature range.

Key Features

  • Logic Capacity  2,688 CLBs providing 24,192 logic elements, enabling medium-to-high complexity logic implementation.
  • Embedded Memory  Approximately 1.03 Mbits of total on-chip RAM (1,032,192 bits) across block SelectRAM resources for data buffering and state storage.
  • Arithmetic and DSP Resources  Virtex-II platform includes dedicated 18-bit × 18-bit multipliers and fast carry logic chains for efficient arithmetic and DSP functions.
  • I/O Density and Flexibility  408 user I/Os in the 575-BBGA package to support wide parallel buses, memory interfaces, and multi-channel I/O configurations.
  • Clocking and Timing  Virtex-II architecture provides Digital Clock Manager (DCM) and global clock resources for flexible clocking and deskewing across the design.
  • Package and Mounting  575-BBGA (31 × 31) supplier device package; surface-mount mounting facilitates PCB integration in compact, high-density boards.
  • Power and Supply  Core voltage supply range specified at 1.425 V to 1.575 V.
  • Operating Conditions  Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

  • Memory Interface and Controllers  Leverage the Virtex-II platform’s high-performance external memory interface support (SDR/DDR, SRAM, QDR, and CAM interfaces) for DRAM/SRAM controller implementations and memory bridge designs.
  • Digital Signal Processing  Use dedicated 18×18 multipliers and abundant logic elements to implement filters, transforms, and other DSP pipelines.
  • High-Density I/O Systems  With 408 I/Os and the 575-BBGA package, integrate wide parallel buses, multi-channel interfaces, or complex board-level I/O subsystems.
  • Embedded System Glue and Bussing  Combine CLBs and block SelectRAM to implement custom protocol adapters, packet buffers, and custom peripheral logic.

Unique Advantages

  • Balanced Logic and Memory Integration: 2,688 CLBs paired with approximately 1.03 Mbits of embedded RAM lets you implement both control logic and substantial on-chip data storage in a single device.
  • Dedicated Arithmetic Resources: On-chip 18×18 multipliers reduce external component needs for DSP workloads, simplifying BOM and improving performance density.
  • High I/O Count in Compact Package: 408 user I/Os in a 575-BBGA (31 × 31) provide a dense I/O solution for complex board-level interconnect without increasing board footprint.
  • Commercial Temperature and RoHS Compliance: Commercial-grade operation (0 °C to 85 °C) with RoHS-compliant materials supports standard electronics manufacturing and deployment environments.
  • Virtex-II Platform Capabilities: Architectural features such as SelectRAM memory hierarchy, Digital Clock Manager, and global clock buffers provide established FPGA building blocks for reliable system design.

Why Choose XC2V2000-6BGG575C?

The XC2V2000-6BGG575C brings Virtex-II platform architecture into a mid-range FPGA offering a strong combination of logic density, embedded RAM, dedicated arithmetic resources and a high I/O count in a compact 575-BBGA package. It is well suited for commercial designs that require integrated memory, DSP capability and broad interfacing without stepping up to larger device families.

Designers and procurement teams seeking a commercially graded, RoHS-compliant FPGA with clearly defined supply and thermal ranges will find the XC2V2000-6BGG575C a practical choice for applications spanning memory interfaces, DSP functions, and board-level I/O aggregation.

Request a quote or submit your project requirements to receive pricing and availability for the XC2V2000-6BGG575C. Our team will respond with a formal quote to support your sourcing and design timelines.

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