XC2V2000-5FFG896I
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 624 1032192 896-BBGA, FCBGA |
|---|---|
| Quantity | 1,720 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FCBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BBGA, FCBGA | Number of I/O | 624 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2688 | Number of Logic Elements/Cells | 24192 | ||
| Number of Gates | 2000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1032192 |
Overview of XC2V2000-5FFG896I – Virtex®-II FPGA, 896-FCBGA, Industrial
The XC2V2000-5FFG896I is a Virtex®-II field programmable gate array (FPGA) IC manufactured by AMD. It combines substantial logic capacity, embedded memory, and a broad I/O complement to support complex, memory- and interface-intensive designs in industrial applications.
Key on-device specifications include 24,192 logic elements, approximately 1.03 Mbits of embedded memory, 624 user I/Os, and a 896-FCBGA (31×31) surface-mount package. The device is rated for industrial operation from -40 °C to 100 °C and is RoHS compliant, operating from a core supply of 1.425 V to 1.575 V.
Key Features
- Core logic: 24,192 logic elements and 2,000,000 equivalent gates provide capacity for medium-to-large custom logic implementations.
- Embedded memory (SelectRAM): Approximately 1.03 Mbits of on-chip RAM with the Virtex‑II SelectRAM memory hierarchy and 18-Kb block SelectRAM resources for dual-port and distributed memory architectures.
- I/O and interface flexibility: 624 user I/Os in the 896-FCBGA package; series-level SelectIO and Digitally Controlled Impedance (DCI) capabilities support a wide range of single-ended and differential signaling standards.
- Arithmetic and DSP support: Dedicated 18-bit × 18-bit multiplier blocks enable efficient implementation of DSP and arithmetic functions.
- Clock management: On-chip Digital Clock Manager (DCM) circuitry and global clock multiplexer buffers provide precise clock de-skew, flexible frequency synthesis, and phase control.
- Package and power: 896-FCBGA (31×31) surface-mount package; core voltage 1.425 V–1.575 V.
- Operating range and compliance: Industrial grade operation from -40 °C to 100 °C and RoHS compliant for lead-free assemblies.
Typical Applications
- Industrial control and automation: Implement complex control logic, sensor aggregation, and I/O-heavy interfaces while meeting industrial temperature requirements.
- Signal processing and DSP: Use dedicated multiplier blocks and on-chip memory to build filtering, transformation, and real-time processing pipelines.
- Memory interface controllers: Implement high-performance interfaces to external DRAM/SRAM using the device’s memory hierarchy and I/O flexibility.
- Custom logic and prototyping: Deploy medium-to-high density logic designs that require a balance of logic elements, embedded RAM, and I/O connectivity.
Unique Advantages
- High logic density: 24,192 logic elements and 2,000,000 gates enable substantial functionality integration on a single device, reducing BOM complexity.
- Significant on-chip memory: Approximately 1.03 Mbits of embedded RAM in a SelectRAM architecture supports data buffering and dual-port memory needs without external components.
- Extensive I/O capability: 624 user I/Os plus SelectIO/DCI features give designers flexibility to support mixed signaling and high-pin-count interfaces.
- Built-in DSP primitives: Dedicated 18×18 multipliers accelerate arithmetic-intensive tasks and simplify implementation of signal-processing algorithms.
- Industrial-ready operation: Rated -40 °C to 100 °C and RoHS compliant for deployment in rugged environments.
- Compact, board-ready package: 896-FCBGA (31×31) surface-mount package enables dense board layouts while preserving high I/O count.
Why Choose XC2V2000-5FFG896I?
The XC2V2000-5FFG896I is positioned for designers needing a balance of logic capacity, embedded memory, and extensive I/O in an industrial-grade FPGA. Its combination of 24,192 logic elements, roughly 1.03 Mbits of on-chip RAM, dedicated multiplier blocks, and comprehensive clock-management features make it suitable for industrial control, signal processing, memory-interface controllers, and other mid-to-high complexity designs.
Designed for robustness and long-term deployment, the device’s industrial temperature rating and RoHS compliance help ensure reliable operation in demanding environments while the 896-FCBGA package provides a compact, board-ready footprint.
Request a quote or submit a pricing inquiry for XC2V2000-5FFG896I to receive availability, lead-time, and ordering information.

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Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








