XC2V2000-5BGG575I

IC FPGA 408 I/O 575BGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 408 1032192 575-BBGA

Quantity 520 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package575-BGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case575-BBGANumber of I/O408Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2688Number of Logic Elements/Cells24192
Number of Gates2000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1032192

Overview of XC2V2000-5BGG575I – Virtex®-II FPGA, 2,000,000 gates, 575‑BBGA (Industrial)

The XC2V2000-5BGG575I is a Virtex®-II Field Programmable Gate Array (FPGA) in a 575-BBGA (31 × 31 mm) package designed for industrial applications. It integrates high-density programmable logic, embedded memory, and a versatile I/O fabric to support complex system designs.

Built on the Virtex‑II platform architecture, this device combines 24,192 logic elements with approximately 1.03 Mbits of on-chip RAM and 408 user I/Os, providing a balance of compute, memory and connectivity for designs that require dense logic integration, deterministic clocking and advanced interfacing.

Key Features

  • Core logic  24,192 logic elements and approximately 2,000,000 system gates for high-density custom digital logic implementation.
  • Configurable logic blocks  Architecture includes the Virtex‑II CLB structure (series-level architecture described in the device datasheet) for flexible LUT/register resources.
  • Embedded memory  Total on-chip RAM of 1,032,192 bits (approximately 1.03 Mbits) for data buffering, FIFOs and on-chip storage.
  • DSP and arithmetic support  Series architecture provides dedicated 18‑bit × 18‑bit multiplier resources for arithmetic-intensive functions.
  • I/O and interface capability  408 user I/Os in a SelectIO-style architecture (series feature), supporting a wide range of single-ended and differential standards, enabling flexible external memory and peripheral interfaces.
  • Clock management  Virtex‑II platform clock-management features (including Digital Clock Manager modules as described in the series datasheet) provide precise clock control for synchronous designs.
  • Package and mounting  575‑BBGA (31 × 31 mm) BGA package, surface-mount mounting type for board-level integration.
  • Power and operating range  Core supply voltage range 1.425 V to 1.575 V; industrial operating temperature from -40 °C to 100 °C.
  • Compliance  RoHS‑compliant device suitable for environmentally regulated assemblies.

Typical Applications

  • Memory interface controllers  Use the device’s abundant I/O and SelectRAM-style memory architecture to implement SDR/DDR or SRAM interface logic and custom memory controllers.
  • Signal processing and DSP  Leverage the dedicated 18×18 multipliers and embedded RAM for arithmetic-heavy datapaths, filtering and custom DSP blocks.
  • High-density logic integration  Consolidate multiple discrete functions into a single FPGA using the 24,192 logic elements to reduce BOM and improve system integration.
  • Custom I/O bridging  Implement protocol bridging, bus interfacing or custom IO timing requirements across the device’s 408 user I/Os.

Unique Advantages

  • Highly integrated logic and memory: 24,192 logic elements combined with approximately 1.03 Mbits of on-chip RAM reduce external component count and simplify board design.
  • Flexible I/O capability: 408 user I/Os and the Virtex‑II I/O architecture enable broad interfacing options for memory, peripherals and high-speed links.
  • Industrial temperature range: Rated for -40 °C to 100 °C operation to meet demanding temperature requirements in industrial environments.
  • Deterministic clocking and DSP support: Clock-management features and dedicated multiplier blocks support precise timing and arithmetic workloads.
  • Robust package and mounting: 575‑BBGA surface-mount package provides a compact, board-ready solution for high-density system designs.
  • Regulatory readiness: RoHS compliance supports use in environmentally regulated product lines.

Why Choose XC2V2000-5BGG575I?

The XC2V2000-5BGG575I delivers a balanced combination of logic density, on-chip memory and versatile I/O in an industrial-grade Virtex‑II FPGA. It is well suited for engineers and system designers implementing memory interfaces, DSP functions and complex control logic where on-chip resources and robust operating range matter.

With explicit voltage and temperature specifications, a compact 575‑BBGA package and architecture-level features drawn from the Virtex‑II family, this device offers a stable platform for scalable designs backed by an established FPGA architecture.

Request a quote or submit an inquiry to receive pricing and lead-time information for the XC2V2000-5BGG575I.

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