XC2V2000-4FGG676C

The XC2V2000-4FGG676C is a Virtex®-II field programmable gate array supplied in a 676-ball fine-pitch BGA package. It combines a large logic fabric with substantial on-chip RAM and a high pin-count I/O complement, making it suitable for demanding digital designs that require flexible, reprogrammable logic integration.

Built on the Virtex-II platform, this device targets applications that benefit from abundant logic resources, embedded memory, and a rich I/O set while operating within a commercial temperature range and a 1.425 V–1.575 V core supply window.

Key Features

• Logic Capacity: 24,192 logic elements (cells) provide substantial programmable logic for complex designs; the part lists approximately 2,000,000 system gates.
• Configurable Logic Blocks (CLBs): 2,688 CLBs (platform-defined resource) for implementing combinational and sequential logic structures.
• Embedded Memory: Approximately 1.03 Mbits of on-chip RAM (1,032,192 bits) via 18-Kb block SelectRAM resources for data buffering and state storage.
• High I/O Count: 456 user I/O pins for broad external connectivity in a wide range of system interfaces.
• Arithmetic Resources: Dedicated 18-bit × 18-bit multiplier blocks (Virtex®-II platform feature) for efficient fixed-point and DSP-style arithmetic.
• Clock Management: Digital Clock Manager (DCM) functionality (platform feature) including multiple DCM modules for deskewing, frequency synthesis, and phase shifting.
• Package and Mounting: 676-ball fine-pitch BGA (676-FBGA, 27 × 27 mm) in a surface-mount configuration for PCB integration.
• Power and Temperature: Core supply range of 1.425 V to 1.575 V and commercial operating temperature from 0 °C to 85 °C.
• Standards and Platform Capabilities: Virtex-II platform features include SelectRAM memory hierarchy, SelectIO™ options, and high-performance routing and interconnect (as described in the Virtex-II series specification).
• RoHS Compliance: Device is RoHS compliant.

Typical Applications

• Communications and Networking: Use the device’s large logic capacity, embedded RAM, and multiple I/Os for protocol processing, packet buffering, and custom interface bridging.
• Signal Processing and DSP: Leverage the dedicated 18-bit × 18-bit multipliers and on-chip RAM for fixed-point filtering, transforms, and acceleration of compute-heavy kernels.
• High-Density Digital Systems: Ideal for control logic, glue-logic consolidation, and custom datapaths where many I/Os and substantial programmable logic are required.
• Memory Interface and Controller Prototyping: Use the embedded RAM and platform memory hierarchy to implement DRAM/SRAM interface logic and buffering functions during development.

Unique Advantages

• Large, Flexible Logic Fabric: 24,192 logic elements and 2,688 CLBs allow complex finite-state machines, custom datapaths, and wide combinational logic to be implemented on-chip.
• Integrated On-Chip Memory: Approximately 1.03 Mbits of embedded RAM reduce external memory dependence and simplify board-level design for many buffering and storage tasks.
• Rich I/O Resources: 456 user I/Os provide design flexibility for interfacing multiple peripherals, external memories, and high-pin-count connectors without additional bridge components.
• Dedicated Arithmetic Blocks: On-chip 18 × 18 multipliers accelerate arithmetic operations and reduce the need for external DSP ASICs.
• Platform-Level Clock Management: Digital Clock Manager resources support precise clocking and phase control for synchronized, high-performance systems.
• Commercial Temperature and RoHS Compliance: Designed for commercial environments (0 °C to 85 °C) and RoHS-compliant manufacturing requirements.

Why Choose XC2V2000-4FGG676C?

The XC2V2000-4FGG676C delivers a balance of substantial programmable logic, embedded RAM, arithmetic resources, and a high I/O count in a 676-ball FBGA package. It is well suited to engineers building complex digital systems that require reprogrammability, on-chip memory, and extensive interfacing capabilities within commercial temperature ranges.

As part of the Virtex®-II platform, it aligns with platform-level features such as SelectRAM and DCM support, providing design scalability and a familiar development flow for FPGA-based system implementations.

Request a quote or submit an RFQ to get pricing and availability for the XC2V2000-4FGG676C and discuss quantity-based options or lead times.