XC2V2000-4FFG896C

IC FPGA 624 I/O 896FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 624 1032192 896-BBGA, FCBGA

Quantity 1,624 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package896-FCBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BBGA, FCBGANumber of I/O624Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2688Number of Logic Elements/Cells24192
Number of Gates2000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1032192

Overview of XC2V2000-4FFG896C – Virtex®-II FPGA IC, 896-FCBGA, 624 I/O

The XC2V2000-4FFG896C from AMD is a Virtex®-II field programmable gate array supplied in a 896-FCBGA (31×31) package. This commercial-grade FPGA delivers high integration for logic-intensive designs, offering 24,192 logic elements, approximately 1.03 Mbits of embedded memory, and 624 user I/Os.

Built on the Virtex-II platform architecture, the device supports SelectRAM memory hierarchy, dedicated multiplier blocks and advanced clock-management features suitable for designs requiring flexible memory interfaces, arithmetic acceleration and complex I/O routing.

Key Features

  • Core Logic 24,192 logic elements and an estimated 2,000,000 system gates provide programmable fabric for complex digital designs.
  • Embedded Memory Approximately 1.03 Mbits of on-chip RAM (1,032,192 total RAM bits) combined with the series SelectRAM block architecture for local and block RAM usage.
  • Arithmetic Resources Series-level support for dedicated 18‑bit × 18‑bit multipliers enables high-throughput arithmetic and DSP functions.
  • Clock Management Virtex‑II platform features include Digital Clock Manager (DCM) modules and global clock multiplexer buffers to support precise clock de‑skew and flexible frequency handling.
  • High-Density I/O 624 user I/O pins with SelectIO capabilities; series features include multiple I/O standards, Digitally Controlled Impedance (DCI) and programmable sink current options.
  • Package & Mounting 896‑BBGA (FCBGA) surface-mount package, supplier device package listed as 896‑FCBGA (31×31), suitable for compact board-level integration.
  • Power & Temperature Core supply range 1.425 V to 1.575 V; commercial operating temperature 0 °C to 85 °C.
  • Compliance RoHS compliant.

Typical Applications

  • Memory Interface Controllers Use the device’s SelectRAM architecture and series DRAM/SRAM interface support to implement custom memory controllers and high-performance bridging logic.
  • Signal Processing / DSP Dedicated 18×18 multipliers and substantial logic capacity enable arithmetic acceleration, filtering and medium-scale DSP pipelines.
  • High‑Density I/O Systems With 624 I/Os and SelectIO features, deploy the device for multi-protocol I/O aggregation, protocol bridging and complex board I/O functions.
  • Prototyping and Embedded Systems The combination of logic density, embedded RAM and clock management makes it suitable for prototype platforms and embedded digital controllers.

Unique Advantages

  • High logic capacity: 24,192 logic elements enable consolidation of multiple functions into a single device, reducing system BOM.
  • On‑chip memory availability: Approximately 1.03 Mbits of embedded RAM supports local buffering and state storage without immediate external memory.
  • Rich I/O resources: 624 user I/Os provide extensive interfacing options for dense connector and board-level designs.
  • Targeted arithmetic support: Dedicated 18×18 multipliers accelerate compute-heavy tasks and simplify DSP implementation.
  • Compact package: 896‑FCBGA (31×31) surface-mount package balances high pin count with a small PCB footprint for space-constrained boards.
  • Regulated supply and commercial grade: Defined core voltage range (1.425 V–1.575 V) and 0 °C–85 °C rating simplify power and thermal planning for commercial applications.

Why Choose XC2V2000-4FFG896C?

The XC2V2000-4FFG896C positions itself as a versatile, high‑integration Virtex‑II FPGA suitable for designers needing substantial logic, embedded memory and extensive I/O in a compact FCBGA package. Its platform-level features—such as SelectRAM memory hierarchy, multiplier blocks and clock management—deliver the building blocks required for custom memory interfaces, DSP acceleration and complex I/O tasks.

This device is appropriate for development and production in commercial temperature environments where on-chip resources and flexible I/O reduce board complexity and accelerate time-to-market. RoHS compliance and defined electrical/thermal parameters support predictable integration into commercial systems.

Request a quote or submit an inquiry to receive pricing and availability information for the XC2V2000-4FFG896C.

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