XC2V2000-4FF896I

The XC2V2000-4FF896I is a Virtex®-II family Field Programmable Gate Array (FPGA) IC manufactured by AMD, offered in a 896-ball flip-chip FCBGA (31 × 31) package. It delivers a high-density programmable fabric with 24,192 logic elements, approximately 1.032 Mbits of embedded RAM, and 624 user I/Os, targeting industrial applications that require extensive I/O, on-chip memory and flexible logic resources.

Designed for surface-mount assembly and rated for industrial temperature operation from −40 °C to 100 °C, this device supports designs that demand robust operating range, high pin count and a compact BGA footprint. The device operates from a core supply window of 1.425 V to 1.575 V and is RoHS compliant.

Key Features

• Programmable Logic Capacity 24,192 logic elements (cells) providing high-density programmable logic suitable for complex custom logic and control functions.
• Embedded Memory Total on-chip RAM of 1,032,192 bits (approximately 1.032 Mbits) to support buffering, packet processing, and data-intensive logic tasks.
• I/O Resources 624 user I/Os for broad external interfacing and high pin-count connectivity in constrained board footprints.
• Functional Gates Equivalent to 2,000,000 system gates for mapping large designs and integrating multiple functions on a single device.
• Package & Mounting 896-ball flip-chip BGA (FCBGA) package, 31 × 31 mm, designed for surface-mount PCB assembly and compact system integration.
• Power and Temperature Core supply range 1.425 V – 1.575 V and operating temperature −40 °C to 100 °C, meeting industrial environmental requirements.
• Industry and Series-Level Capabilities Series-level Virtex®-II architecture features (as documented in the Virtex-II data) include SelectRAM memory hierarchy, dedicated 18×18 multiplier blocks, Digital Clock Manager (DCM) circuitry and flexible I/O technologies for complex timing, arithmetic and I/O requirements.
• Compliance RoHS compliant for environmental and manufacturing process compatibility.

Typical Applications

• Industrial Control Systems — High logic density and broad I/O count enable custom motor control, sequencing and machine automation functions within industrial temperature ranges.
• Communications and Networking — On-chip RAM and sizable logic resources support packet buffering, protocol processing and interface bridging in network equipment.
• High‑I/O Interface Hubs — 624 user I/Os allow consolidation of multiple interfaces or dense connector arrays in compact board designs.
• Custom Embedded Processing — Programmable fabric and embedded memory provide a platform for application-specific accelerators, data manipulation and control logic.

Unique Advantages

• High-density programmable fabric: 24,192 logic elements facilitate complex logic integration and reduce the need for multiple discrete components.
• Substantial on-chip memory: Approximately 1.032 Mbits of embedded RAM supports data buffering and intermediate storage without relying solely on external memory.
• Extensive I/O capability: 624 user I/Os enable flexible interfacing and system consolidation, simplifying PCB routing and connector management.
• Industrial-grade operation: Rated for −40 °C to 100 °C, suitable for industrial environments requiring extended temperature range operation.
• Compact BGA package: 896-FCBGA (31 × 31 mm) balances high pin count with a compact footprint for space-constrained applications.
• Standards-conscious manufacturing: RoHS compliance supports environmentally conscious production and assembly processes.

Why Choose XC2V2000-4FF896I?

The XC2V2000-4FF896I combines substantial programmable logic capacity, significant embedded memory and a high I/O count in an industrial-temperature rated FCBGA package. It is positioned for engineers who need to consolidate multiple functions into a single programmable device while maintaining robust operation across a wide temperature range.

This part is well suited for designers seeking a proven Virtex®-II platform device with the flexibility to implement custom logic, interface-rich designs and memory-dependent processing while maintaining compact board-level integration and RoHS-compliant manufacturing.

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