XC2V2000-4BG575I
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 408 1032192 575-BBGA |
|---|---|
| Quantity | 102 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 575-BGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 575-BBGA | Number of I/O | 408 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2688 | Number of Logic Elements/Cells | 24192 | ||
| Number of Gates | 2000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1032192 |
Overview of XC2V2000-4BG575I – Virtex®-II FPGA, 575-BBGA, Industrial
The XC2V2000-4BG575I is a Virtex®-II field programmable gate array (FPGA) in a 575-ball BBGA package, offered for industrial-grade designs. It combines a high logic capacity with substantial embedded memory and a broad I/O count to address demanding digital processing, memory-interface and high-density connectivity applications.
Built on the Virtex-II platform architecture, the device provides a feature set focused on flexible logic resources, embedded SelectRAM memory blocks and advanced clock management to support complex system designs that require scalability and robust interfacing.
Key Features
- Core Capacity Approximately 2,000,000 system gates with 24,192 logic elements for implementing complex digital functions and state machines.
- Embedded Memory Approximately 1.03 Mbits of on-chip RAM (1,032,192 total RAM bits), including 18-Kb block SelectRAM resources for dual-port memory requirements and distributed RAM usage.
- High I/O Count 408 user I/O pins to support wide parallel interfaces and board-level connectivity in dense systems.
- Arithmetic Resources Dedicated 18-bit × 18-bit multiplier blocks (platform feature) for high-performance DSP and arithmetic acceleration.
- Clock and Timing Virtex-II platform digital clock management features such as Digital Clock Manager (DCM) modules and multiple global clock buffers to enable precise clock de-skew and frequency synthesis.
- Package and Mounting 575-BBGA (575-BGA, 31 × 31) surface-mount package suitable for high-density board designs.
- Power and Supply Core voltage supply range specified at 1.425 V to 1.575 V.
- Industrial Temperature Range Operating temperature range from −40 °C to 100 °C, specified for industrial applications.
- Standards and Compliance RoHS compliant.
Typical Applications
- High-density logic and control boards Use the XC2V2000-4BG575I to implement complex control logic, state machines and protocol handling where large logic capacity and embedded memory are required.
- Memory interface and buffering Leverage the device’s SelectRAM resources and abundant I/O to build SDR/DDR or SRAM interface logic and high-throughput buffering between system components.
- Signal processing and arithmetic acceleration Dedicated multiplier blocks and dense logic fabric enable fixed-point DSP functions, filtering and data path acceleration.
- Industrial automation and control Industrial-grade temperature rating and a broad I/O complement make this FPGA suitable for motor control, machine vision pre-processing and programmable logic controllers.
Unique Advantages
- Substantial logic density: 24,192 logic elements and ~2,000,000 system gates provide headroom for complex designs without immediate platform migration.
- Significant on-chip memory: Approximately 1.03 Mbits of embedded RAM in block and distributed forms reduces external memory dependence and simplifies timing-critical buffers.
- Robust I/O capability: 408 user I/Os enable wide parallel interfaces and multiple peripheral connections from a single device.
- Industrial thermal range: Rated from −40 °C to 100 °C for deployment in industrial environments that require extended temperature tolerance.
- Package density: 575-BBGA (31 × 31) ball grid array provides a compact, high-pin-count footprint for space-constrained PCBs.
- Standards-aware design: RoHS compliance supports environmentally constrained manufacturing and supply requirements.
Why Choose XC2V2000-4BG575I?
The XC2V2000-4BG575I positions itself as a capable Virtex®-II FPGA offering a balance of logic capacity, embedded RAM and a large I/O complement in an industrial-rated package. It is well suited for engineers designing complex digital systems that need on-chip memory, arithmetic resources and flexible clock management within a high-density footprint.
For projects that require scalable logic resources and reliable operation across a wide temperature range, this device provides a solid platform with the Virtex-II architecture’s selectable memory hierarchy and clocking features, helping reduce external component count and streamline system integration.
Request a quote or submit an inquiry to receive pricing, availability and additional technical support for the XC2V2000-4BG575I.

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