XC2V2000-4BG575I

IC FPGA 408 I/O 575BGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 408 1032192 575-BBGA

Quantity 102 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package575-BGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case575-BBGANumber of I/O408Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2688Number of Logic Elements/Cells24192
Number of Gates2000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1032192

Overview of XC2V2000-4BG575I – Virtex®-II FPGA, 575-BBGA, Industrial

The XC2V2000-4BG575I is a Virtex®-II field programmable gate array (FPGA) in a 575-ball BBGA package, offered for industrial-grade designs. It combines a high logic capacity with substantial embedded memory and a broad I/O count to address demanding digital processing, memory-interface and high-density connectivity applications.

Built on the Virtex-II platform architecture, the device provides a feature set focused on flexible logic resources, embedded SelectRAM memory blocks and advanced clock management to support complex system designs that require scalability and robust interfacing.

Key Features

  • Core Capacity  Approximately 2,000,000 system gates with 24,192 logic elements for implementing complex digital functions and state machines.
  • Embedded Memory  Approximately 1.03 Mbits of on-chip RAM (1,032,192 total RAM bits), including 18-Kb block SelectRAM resources for dual-port memory requirements and distributed RAM usage.
  • High I/O Count  408 user I/O pins to support wide parallel interfaces and board-level connectivity in dense systems.
  • Arithmetic Resources  Dedicated 18-bit × 18-bit multiplier blocks (platform feature) for high-performance DSP and arithmetic acceleration.
  • Clock and Timing  Virtex-II platform digital clock management features such as Digital Clock Manager (DCM) modules and multiple global clock buffers to enable precise clock de-skew and frequency synthesis.
  • Package and Mounting  575-BBGA (575-BGA, 31 × 31) surface-mount package suitable for high-density board designs.
  • Power and Supply  Core voltage supply range specified at 1.425 V to 1.575 V.
  • Industrial Temperature Range  Operating temperature range from −40 °C to 100 °C, specified for industrial applications.
  • Standards and Compliance  RoHS compliant.

Typical Applications

  • High-density logic and control boards  Use the XC2V2000-4BG575I to implement complex control logic, state machines and protocol handling where large logic capacity and embedded memory are required.
  • Memory interface and buffering  Leverage the device’s SelectRAM resources and abundant I/O to build SDR/DDR or SRAM interface logic and high-throughput buffering between system components.
  • Signal processing and arithmetic acceleration  Dedicated multiplier blocks and dense logic fabric enable fixed-point DSP functions, filtering and data path acceleration.
  • Industrial automation and control  Industrial-grade temperature rating and a broad I/O complement make this FPGA suitable for motor control, machine vision pre-processing and programmable logic controllers.

Unique Advantages

  • Substantial logic density: 24,192 logic elements and ~2,000,000 system gates provide headroom for complex designs without immediate platform migration.
  • Significant on-chip memory: Approximately 1.03 Mbits of embedded RAM in block and distributed forms reduces external memory dependence and simplifies timing-critical buffers.
  • Robust I/O capability: 408 user I/Os enable wide parallel interfaces and multiple peripheral connections from a single device.
  • Industrial thermal range: Rated from −40 °C to 100 °C for deployment in industrial environments that require extended temperature tolerance.
  • Package density: 575-BBGA (31 × 31) ball grid array provides a compact, high-pin-count footprint for space-constrained PCBs.
  • Standards-aware design: RoHS compliance supports environmentally constrained manufacturing and supply requirements.

Why Choose XC2V2000-4BG575I?

The XC2V2000-4BG575I positions itself as a capable Virtex®-II FPGA offering a balance of logic capacity, embedded RAM and a large I/O complement in an industrial-rated package. It is well suited for engineers designing complex digital systems that need on-chip memory, arithmetic resources and flexible clock management within a high-density footprint.

For projects that require scalable logic resources and reliable operation across a wide temperature range, this device provides a solid platform with the Virtex-II architecture’s selectable memory hierarchy and clocking features, helping reduce external component count and streamline system integration.

Request a quote or submit an inquiry to receive pricing, availability and additional technical support for the XC2V2000-4BG575I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up