XC2V1500-6FGG676C
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 392 884736 676-BGA |
|---|---|
| Quantity | 1,077 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 392 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1920 | Number of Logic Elements/Cells | 17280 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 884736 |
Overview of XC2V1500-6FGG676C – Virtex®-II Field Programmable Gate Array (FPGA) IC 392 884736 676-BGA
The XC2V1500-6FGG676C is a Virtex®-II platform field programmable gate array supplied in a 676-ball fine-pitch BGA package. It implements a high-density programmable fabric composed of 1,920 configurable logic blocks (CLBs) and 17,280 logic elements, together with abundant on-chip RAM and dedicated arithmetic resources for complex digital designs.
Targeted at applications requiring significant logic resources, embedded memory and flexible I/O, this commercial-grade FPGA delivers a balanced combination of integration, clock management and memory interface capabilities. The device is supplied RoHS compliant and operates from a 1.425 V to 1.575 V core supply across a 0 °C to 85 °C operating range.
Key Features
- Core Logic 1,920 configurable logic blocks (CLBs) providing 17,280 logic elements to implement medium- to high-complexity logic functions.
- Embedded Memory Approximately 0.885 Mbits of on-chip RAM (884,736 total RAM bits) for distributed and block SelectRAM resources.
- Arithmetic and DSP Dedicated multiplier resources and look-ahead carry structures described in the Virtex‑II series for efficient implementation of arithmetic and DSP functions.
- Clock Management Series-level digital clock manager (DCM) and global clock multiplexer features support precise clock de-skew and flexible frequency/phase control for multi-clock designs.
- I/O and Interface Flexibility 392 user I/Os in the 676-BGA package with series-level SelectIO capabilities including multiple single-ended and differential standards, on-chip termination (DCI) and high-speed LVDS options for robust external memory and protocol interfacing.
- Package and Power 676-ball fine-pitch BGA (27×27 FBGA) package with a documented core voltage supply range of 1.425 V to 1.575 V.
- Commercial Grade and Compliance Operating temperature 0 °C to 85 °C and RoHS compliant for standard commercial applications.
Typical Applications
- Memory interface controllers — Implements high-performance interfaces to external memory such as SDR/DDR SDRAM, network FCRAM and reduced-latency DRAM using the device's on-chip memory and I/O features.
- Digital signal processing and arithmetic accelerators — Dedicated 18-bit×18-bit multiplier resources and logic fabric support DSP pipelines, filtering and arithmetic-intensive blocks.
- High-speed protocol bridging and I/O aggregation — 392 user I/Os with series SelectIO capabilities allow aggregation and protocol bridging between high-bandwidth peripherals and back-end logic.
- Custom logic and system prototyping — Use the programmable fabric and on-chip memory to prototype complex control, data-path and timing-critical functions for embedded systems.
Unique Advantages
- High logic density: 17,280 logic elements and 1,920 CLBs provide ample capacity for complex state machines, control logic and datapaths without excessive external glue logic.
- Substantial embedded memory: Approximately 0.885 Mbits of on-chip RAM reduces external memory dependencies and simplifies buffering and scratchpad architectures.
- Rich I/O capability: 392 user I/Os in a fine-pitch BGA package combined with series SelectIO options enable versatile connectivity to DRAM, SRAM and high-speed signaling standards.
- Flexible clocking: Integrated clock-management features from the Virtex‑II platform support precise clock distribution and phase/frequency control for multi-domain systems.
- Commercial suitability and compliance: RoHS compliance and a 0 °C to 85 °C operating range make the device suitable for a wide range of standard commercial applications.
Why Choose XC2V1500-6FGG676C?
The XC2V1500-6FGG676C positions itself as a balanced, programmable solution for designs that require a combination of substantial logic capacity, on-chip memory and flexible I/O in a compact 676-BGA footprint. Its Virtex‑II platform features—documented clock management, dedicated multipliers and SelectRAM resources—support implementation of memory interfaces, DSP functions and complex control logic within a single device.
This device is well suited for engineering teams and procurement seeking a commercially graded FPGA that provides integration and scalability for medium to high-complexity digital designs, while offering RoHS compliance and standard commercial temperature operation.
Request a quote or submit your purchase inquiry today to evaluate XC2V1500-6FGG676C for your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








