XC2V1500-6FGG676C

IC FPGA 392 I/O 676FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 392 884736 676-BGA

Quantity 1,077 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BGANumber of I/O392Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1920Number of Logic Elements/Cells17280
Number of Gates1500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits884736

Overview of XC2V1500-6FGG676C – Virtex®-II Field Programmable Gate Array (FPGA) IC 392 884736 676-BGA

The XC2V1500-6FGG676C is a Virtex®-II platform field programmable gate array supplied in a 676-ball fine-pitch BGA package. It implements a high-density programmable fabric composed of 1,920 configurable logic blocks (CLBs) and 17,280 logic elements, together with abundant on-chip RAM and dedicated arithmetic resources for complex digital designs.

Targeted at applications requiring significant logic resources, embedded memory and flexible I/O, this commercial-grade FPGA delivers a balanced combination of integration, clock management and memory interface capabilities. The device is supplied RoHS compliant and operates from a 1.425 V to 1.575 V core supply across a 0 °C to 85 °C operating range.

Key Features

  • Core Logic 1,920 configurable logic blocks (CLBs) providing 17,280 logic elements to implement medium- to high-complexity logic functions.
  • Embedded Memory Approximately 0.885 Mbits of on-chip RAM (884,736 total RAM bits) for distributed and block SelectRAM resources.
  • Arithmetic and DSP Dedicated multiplier resources and look-ahead carry structures described in the Virtex‑II series for efficient implementation of arithmetic and DSP functions.
  • Clock Management Series-level digital clock manager (DCM) and global clock multiplexer features support precise clock de-skew and flexible frequency/phase control for multi-clock designs.
  • I/O and Interface Flexibility 392 user I/Os in the 676-BGA package with series-level SelectIO capabilities including multiple single-ended and differential standards, on-chip termination (DCI) and high-speed LVDS options for robust external memory and protocol interfacing.
  • Package and Power 676-ball fine-pitch BGA (27×27 FBGA) package with a documented core voltage supply range of 1.425 V to 1.575 V.
  • Commercial Grade and Compliance Operating temperature 0 °C to 85 °C and RoHS compliant for standard commercial applications.

Typical Applications

  • Memory interface controllers — Implements high-performance interfaces to external memory such as SDR/DDR SDRAM, network FCRAM and reduced-latency DRAM using the device's on-chip memory and I/O features.
  • Digital signal processing and arithmetic accelerators — Dedicated 18-bit×18-bit multiplier resources and logic fabric support DSP pipelines, filtering and arithmetic-intensive blocks.
  • High-speed protocol bridging and I/O aggregation — 392 user I/Os with series SelectIO capabilities allow aggregation and protocol bridging between high-bandwidth peripherals and back-end logic.
  • Custom logic and system prototyping — Use the programmable fabric and on-chip memory to prototype complex control, data-path and timing-critical functions for embedded systems.

Unique Advantages

  • High logic density: 17,280 logic elements and 1,920 CLBs provide ample capacity for complex state machines, control logic and datapaths without excessive external glue logic.
  • Substantial embedded memory: Approximately 0.885 Mbits of on-chip RAM reduces external memory dependencies and simplifies buffering and scratchpad architectures.
  • Rich I/O capability: 392 user I/Os in a fine-pitch BGA package combined with series SelectIO options enable versatile connectivity to DRAM, SRAM and high-speed signaling standards.
  • Flexible clocking: Integrated clock-management features from the Virtex‑II platform support precise clock distribution and phase/frequency control for multi-domain systems.
  • Commercial suitability and compliance: RoHS compliance and a 0 °C to 85 °C operating range make the device suitable for a wide range of standard commercial applications.

Why Choose XC2V1500-6FGG676C?

The XC2V1500-6FGG676C positions itself as a balanced, programmable solution for designs that require a combination of substantial logic capacity, on-chip memory and flexible I/O in a compact 676-BGA footprint. Its Virtex‑II platform features—documented clock management, dedicated multipliers and SelectRAM resources—support implementation of memory interfaces, DSP functions and complex control logic within a single device.

This device is well suited for engineering teams and procurement seeking a commercially graded FPGA that provides integration and scalability for medium to high-complexity digital designs, while offering RoHS compliance and standard commercial temperature operation.

Request a quote or submit your purchase inquiry today to evaluate XC2V1500-6FGG676C for your next design.

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