XC2V2000-4BGG575I

The XC2V2000-4BGG575I is a Virtex®-II Field Programmable Gate Array (FPGA) offered in a 575-BBGA (31×31) surface-mount package and specified for industrial-grade applications. It provides a high-density programmable fabric with 24,192 logic elements, approximately 1.03 Mbits of embedded memory, and 408 user I/Os for designs that require substantial logic, on-chip RAM and I/O connectivity within a single IC.

Key Features

• Programmable Logic Resources 24,192 logic elements (cells) and 2,000,000 system gates provide the core capacity for complex combinational and sequential logic implementations.
• Embedded Memory Approximately 1.03 Mbits of on-chip RAM (1,032,192 total bits) suitable for buffering, FIFOs and local data storage within the FPGA fabric.
• I/O Density & Package 408 user I/Os in a 575-BBGA (31×31) package, delivered as a surface-mount device to support high-pin-count, board-level designs.
• Dedicated Arithmetic & Clock Resources The Virtex‑II platform includes dedicated 18‑bit × 18‑bit multiplier blocks and Digital Clock Manager (DCM) resources to support arithmetic acceleration and flexible clock control (features provided by the Virtex‑II architecture).
• Voltage and Environmental Range Core supply specified from 1.425 V to 1.575 V and operating temperature range from −40 °C to 100 °C, meeting industrial operating requirements.
• Memory & Interface Architecture (Platform Features) Virtex‑II SelectRAM memory hierarchy and high-performance I/O signaling options (as defined by the Virtex‑II family) support common memory interface and high-throughput I/O requirements.

Typical Applications

• Industrial Control — Implement complex control logic, state machines and I/O aggregation for factory automation and process control systems using the device’s logic density and industrial temperature rating.
• High-Density I/O Systems — Support devices that require many parallel interfaces or multi-channel I/O with 408 available user I/Os in a compact BGA package.
• Embedded Processing & Data Buffering — Use the on-chip RAM and multiplier resources for local buffering, preprocessing, and DSP-like arithmetic acceleration inside embedded systems.

Unique Advantages

• High Integration: Combines 24,192 logic elements, ~1.03 Mbits of embedded memory and 408 I/Os in a single 575-BBGA package to reduce external components and BOM complexity.
• Industrial Reliability: Specified for an operating range of −40 °C to 100 °C and supplied as an industrial-grade device for deployments in demanding environments.
• Balanced Power Envelope: Narrow core supply window (1.425 V to 1.575 V) enables predictable power management and integration into tightly controlled power systems.
• Platform Capabilities: Built on the Virtex‑II architecture, offering SelectRAM memory hierarchy and dedicated multiplier and clock-management features for common high-performance FPGA tasks.
• Board-Level Density: 575-BBGA (31×31) package delivers high pin count in a compact surface-mount footprint for space-constrained, high-density PCBs.

Why Choose XC2V2000-4BGG575I?

The XC2V2000-4BGG575I positions itself as a robust Virtex‑II FPGA choice for designs requiring a balance of logic capacity, embedded memory and I/O count in an industrial-grade device. Its combination of 24,192 logic elements, roughly 1.03 Mbits of on-chip RAM and 408 I/Os in a 575‑BBGA package makes it well suited to industrial control, high-density I/O aggregation and embedded processing tasks where integration and temperature performance matter.

Engineers benefit from the Virtex‑II platform features—such as dedicated multipliers, clock management and SelectRAM architecture—alongside the part’s verified electrical and thermal specifications, enabling scalable designs with predictable system behavior.

Request a quote for the XC2V2000-4BGG575I to evaluate availability and pricing for your next design project.