XC2V2000-4FG676I

IC FPGA 456 I/O 676FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 456 1032192 676-BGA

Quantity 1,085 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BGANumber of I/O456Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2688Number of Logic Elements/Cells24192
Number of Gates2000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1032192

Overview of XC2V2000-4FG676I – Virtex®-II Field Programmable Gate Array, 676-BGA

The XC2V2000-4FG676I is a Virtex®-II FPGA in a 676-ball fine-pitch BGA package designed for industrial applications. It integrates high-density programmable logic, substantial embedded memory, and a broad set of on-chip resources to support memory interfaces, arithmetic acceleration and flexible I/O in industrial temperature environments.

This device combines roughly 24,192 logic elements and approximately 1.03 Mbits of embedded RAM with 456 user I/Os, offering a balanced platform for mid-range FPGA designs that require deterministic clock management, on-chip DSP resources, and robust packaging.

Key Features

  • Programmable Logic — Approximately 24,192 logic elements enabling complex digital designs and control logic integration.
  • Embedded Memory — Approximately 1.03 Mbits of on-chip RAM for buffering, FIFOs and local storage to support data-path and control functions.
  • On-Chip Arithmetic — Dedicated 18-bit × 18-bit multiplier resources described in the Virtex®-II family to accelerate multiply-intensive operations.
  • Clock Management — Digital Clock Manager (DCM) capabilities available in the Virtex®-II platform for precise clock deskew and phase control, supporting synchronous system designs.
  • I/O Capacity and Flexibility — 456 user I/Os in a fine-pitch 676-BGA package, suitable for a wide range of external interfaces and signaling requirements.
  • Package and Mounting — 676-FBGA (27 × 27) package with surface-mount mounting type for board-level integration.
  • Power and Operating Range — Core supply range of 1.425 V to 1.575 V and industrial operating temperature from −40 °C to 100 °C.
  • Design Ecosystem — Part of the Virtex®-II family, which includes platform-level features such as SelectRAM memory hierarchy and high-performance routing and I/O architectures documented in the product datasheet.
  • Compliance — RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

  • Memory Interface Controllers — Use the device's on-chip RAM and high-performance I/O to implement SDR/DDR and other external memory interfaces as described in the Virtex®-II platform documentation.
  • Digital Signal Processing — Leverage dedicated multiplier blocks and embedded RAM to accelerate filtering, transforms and other multiply-accumulate workloads.
  • High-Speed Data Path Logic — Implement packet processing, protocol bridging and custom data-path logic using the device’s programmable routing and I/O capacity.
  • Industrial Control and Automation — Deploy in temperature-demanding systems requiring industrial-grade operation and flexible I/O for sensor, actuator and bus interfacing.

Unique Advantages

  • Balanced Logic and Memory Mix: Approximately 24,192 logic elements paired with ~1.03 Mbits of embedded RAM enables combined control and data-path implementations on a single device.
  • Fixed Industrial Temperature Rating: Rated for −40 °C to 100 °C operation to support deployment in industrial environments.
  • Deterministic Clocking Support: Virtex®-II DCM features provide clock deskew and phase control that ease timing closure for synchronous systems.
  • Significant I/O Count in Compact Package: 456 user I/Os in a 676-FBGA (27×27) package for dense board-level integration without sacrificing connectivity.
  • RoHS Compliance: Conforms to lead-free manufacturing requirements to simplify regulatory adherence for production assemblies.

Why Choose XC2V2000-4FG676I?

The XC2V2000-4FG676I delivers a practical combination of programmable logic capacity, embedded memory and I/O density in a 676-BGA footprint, targeted at industrial applications that require reliable operation across a wide temperature range. Its placement within the Virtex®-II family provides access to platform-level features such as SelectRAM, dedicated multipliers and clock management resources documented in the product specification.

This device is well suited for design teams needing a mid-range FPGA with strong memory interfacing and DSP-oriented capabilities while maintaining industrial-grade temperature tolerance and RoHS compliance. It offers a clear upgrade path within the Virtex®-II platform for projects that may scale in complexity.

Request a quote or submit a purchase inquiry for XC2V2000-4FG676I to begin procurement and integrate this FPGA into your next industrial design.

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