XC2V2000-4FG676I
| Part Description |
Virtex®-II Field Programmable Gate Array (FPGA) IC 456 1032192 676-BGA |
|---|---|
| Quantity | 1,085 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 456 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2688 | Number of Logic Elements/Cells | 24192 | ||
| Number of Gates | 2000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1032192 |
Overview of XC2V2000-4FG676I – Virtex®-II Field Programmable Gate Array, 676-BGA
The XC2V2000-4FG676I is a Virtex®-II FPGA in a 676-ball fine-pitch BGA package designed for industrial applications. It integrates high-density programmable logic, substantial embedded memory, and a broad set of on-chip resources to support memory interfaces, arithmetic acceleration and flexible I/O in industrial temperature environments.
This device combines roughly 24,192 logic elements and approximately 1.03 Mbits of embedded RAM with 456 user I/Os, offering a balanced platform for mid-range FPGA designs that require deterministic clock management, on-chip DSP resources, and robust packaging.
Key Features
- Programmable Logic — Approximately 24,192 logic elements enabling complex digital designs and control logic integration.
- Embedded Memory — Approximately 1.03 Mbits of on-chip RAM for buffering, FIFOs and local storage to support data-path and control functions.
- On-Chip Arithmetic — Dedicated 18-bit × 18-bit multiplier resources described in the Virtex®-II family to accelerate multiply-intensive operations.
- Clock Management — Digital Clock Manager (DCM) capabilities available in the Virtex®-II platform for precise clock deskew and phase control, supporting synchronous system designs.
- I/O Capacity and Flexibility — 456 user I/Os in a fine-pitch 676-BGA package, suitable for a wide range of external interfaces and signaling requirements.
- Package and Mounting — 676-FBGA (27 × 27) package with surface-mount mounting type for board-level integration.
- Power and Operating Range — Core supply range of 1.425 V to 1.575 V and industrial operating temperature from −40 °C to 100 °C.
- Design Ecosystem — Part of the Virtex®-II family, which includes platform-level features such as SelectRAM memory hierarchy and high-performance routing and I/O architectures documented in the product datasheet.
- Compliance — RoHS compliant, supporting regulatory requirements for lead-free assembly.
Typical Applications
- Memory Interface Controllers — Use the device's on-chip RAM and high-performance I/O to implement SDR/DDR and other external memory interfaces as described in the Virtex®-II platform documentation.
- Digital Signal Processing — Leverage dedicated multiplier blocks and embedded RAM to accelerate filtering, transforms and other multiply-accumulate workloads.
- High-Speed Data Path Logic — Implement packet processing, protocol bridging and custom data-path logic using the device’s programmable routing and I/O capacity.
- Industrial Control and Automation — Deploy in temperature-demanding systems requiring industrial-grade operation and flexible I/O for sensor, actuator and bus interfacing.
Unique Advantages
- Balanced Logic and Memory Mix: Approximately 24,192 logic elements paired with ~1.03 Mbits of embedded RAM enables combined control and data-path implementations on a single device.
- Fixed Industrial Temperature Rating: Rated for −40 °C to 100 °C operation to support deployment in industrial environments.
- Deterministic Clocking Support: Virtex®-II DCM features provide clock deskew and phase control that ease timing closure for synchronous systems.
- Significant I/O Count in Compact Package: 456 user I/Os in a 676-FBGA (27×27) package for dense board-level integration without sacrificing connectivity.
- RoHS Compliance: Conforms to lead-free manufacturing requirements to simplify regulatory adherence for production assemblies.
Why Choose XC2V2000-4FG676I?
The XC2V2000-4FG676I delivers a practical combination of programmable logic capacity, embedded memory and I/O density in a 676-BGA footprint, targeted at industrial applications that require reliable operation across a wide temperature range. Its placement within the Virtex®-II family provides access to platform-level features such as SelectRAM, dedicated multipliers and clock management resources documented in the product specification.
This device is well suited for design teams needing a mid-range FPGA with strong memory interfacing and DSP-oriented capabilities while maintaining industrial-grade temperature tolerance and RoHS compliance. It offers a clear upgrade path within the Virtex®-II platform for projects that may scale in complexity.
Request a quote or submit a purchase inquiry for XC2V2000-4FG676I to begin procurement and integrate this FPGA into your next industrial design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








