XC2V2000-5BG575I

IC FPGA 408 I/O 575BGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 408 1032192 575-BBGA

Quantity 613 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package575-BGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case575-BBGANumber of I/O408Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2688Number of Logic Elements/Cells24192
Number of Gates2000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1032192

Overview of XC2V2000-5BG575I – Virtex®-II Field Programmable Gate Array, 408 I/O, 575-BBGA

The XC2V2000-5BG575I is a Virtex®-II family FPGA in a 575-ball BGA (31×31) package designed for industrial applications that require substantial logic capacity, embedded memory and a high I/O count. This surface-mount, industrial-grade device provides a balance of logic resources, on-chip RAM and I/O suitable for complex embedded and system-level designs.

Targeted applications include systems that need up to 2,000,000 gates of programmable logic, approximately 1.03 Mbits of embedded memory, and 408 user I/Os while operating across an industrial temperature range and a narrow core voltage window for consistent power delivery.

Key Features

  • Core Logic 2,688 configurable logic blocks (CLBs) and 24,192 logic elements delivering approximately 2,000,000 system gates for complex logic integration.
  • On‑Chip Memory Approximately 1.03 Mbits of embedded RAM (total on-chip), implemented using the Virtex‑II SelectRAM block architecture described in the family datasheet.
  • Dedicated Arithmetic Family-level support for dedicated 18‑bit × 18‑bit multiplier blocks for efficient fixed-point and DSP-style operations.
  • I/O and Signaling 408 user I/Os in a 575‑ball BGA footprint. The Virtex‑II family SelectIO technology and digitally controlled impedance (DCI) are described in the datasheet for a wide range of signaling options and on-chip termination.
  • Clocking and Timing Includes Virtex‑II platform clock-management features such as Digital Clock Manager (DCM) modules and global clock multiplexer buffers as outlined in the family documentation.
  • Package & Mounting 575‑BBGA (575‑BGA, 31×31) surface‑mount package suitable for compact board layouts and high‑density applications.
  • Power Core supply range of 1.425 V to 1.575 V to match precise system power rails.
  • Environmental & Reliability Industrial-grade device with an operating temperature range of −40 °C to 100 °C and RoHS compliance for regulatory and environmental considerations.

Typical Applications

  • Embedded Systems Use the device for system control, protocol handling and glue-logic where large programmable logic capacity and embedded RAM are required.
  • Memory Interface and Bridge Devices Leverage the device’s memory architecture and I/O resources for DRAM/SRAM interface logic, buffering, and protocol translation as described by the Virtex‑II family features.
  • Industrial Control Industrial automation and control applications benefit from the device’s industrial temperature rating, deterministic programmable logic and abundant I/O.
  • High‑Performance DSP and Acceleration Dedicated multiplier blocks and sizable logic resources make the device suitable for fixed-point DSP kernels and hardware acceleration tasks.

Unique Advantages

  • High Logic Density: 24,192 logic elements and 2,688 CLBs enable consolidation of complex functions onto a single FPGA, reducing BOM and board-level complexity.
  • Substantial Embedded Memory: Approximately 1.03 Mbits of on‑chip RAM provides local storage for buffering, lookup tables and state machines without external memory for many designs.
  • Robust I/O Count: 408 user I/Os in a compact 575‑BGA package support wide parallel buses and multiple peripheral interfaces on a single device.
  • Industrial Operating Range: −40 °C to 100 °C rating and RoHS compliance support deployment in industrial environments with regulated environmental requirements.
  • Compact, Surface‑Mount Package: 575‑BBGA (31×31) delivers a dense footprint for space-constrained PCBs while maintaining strong thermal and electrical characteristics.

Why Choose XC2V2000-5BG575I?

The XC2V2000-5BG575I positions itself as a versatile Virtex‑II FPGA option for engineers needing a mix of significant logic capacity, embedded memory and a high number of user I/Os in an industrial-grade package. Its precise core voltage range and broad temperature tolerance make it suitable for controlled-power systems deployed in demanding environments.

Designs that require consolidated logic, on‑chip RAM and flexible I/O routing can benefit from the device’s resources and the detailed feature set provided in the Virtex‑II platform documentation, enabling scalable and maintainable implementations.

Request a quote or submit a request for pricing and availability to evaluate the XC2V2000-5BG575I for your next design.

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