XC2V2000-5FF896I

IC FPGA 624 I/O 896FCBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 624 1032192 896-BBGA, FCBGA

Quantity 996 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package896-FCBGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case896-BBGA, FCBGANumber of I/O624Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2688Number of Logic Elements/Cells24192
Number of Gates2000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1032192

Overview of XC2V2000-5FF896I – Virtex®-II FPGA, 624 I/O, 896-FCBGA

The XC2V2000-5FF896I is a Virtex®-II Field Programmable Gate Array (FPGA) in an 896-ball FCBGA package. It provides a high-density, reprogrammable logic fabric with 2,688 CLBs delivering 24,192 logic elements and approximately 1.03 Mbits of embedded RAM for mid- to high-complexity digital designs.

Designed for industrial-grade applications, this device combines dense logic, on-chip memory, DSP resources and flexible I/O to support memory interfaces, signal processing and system-level integration where configurable performance and I/O bandwidth are required.

Key Features

  • Logic Capacity — 2,688 CLBs providing 24,192 logic elements/cells for implementation of complex digital functions and state machines.
  • Embedded Memory — Approximately 1.03 Mbits of on-chip RAM to support large FIFOs, buffers and distributed storage without external memory.
  • DSP Resources — Dedicated 18-bit × 18-bit multiplier blocks for arithmetic and signal-processing tasks.
  • Clock Management — Digital Clock Manager (DCM) resources and global clock multiplexer buffers (as described for the Virtex-II platform) to enable precise clocking and phase/frequency control.
  • I/O and Interface Flexibility — 624 user I/Os supporting a variety of single-ended and differential standards and high-speed signaling options for external memory and high-bandwidth links.
  • Routing and Architecture — Active Interconnect Technology and segmented routing structure (Virtex-II platform) for predictable routing delay and scalable interconnect performance.
  • Package and Mounting — 896-FCBGA (31 × 31 mm) package, surface-mount mounting suitable for PCB integration.
  • Power and Temperature — Core supply range 1.425 V to 1.575 V; rated operating temperature −40 °C to 100 °C for industrial environments.
  • Compliance — RoHS compliant.

Typical Applications

  • Memory Interface Controllers — Implement SDR/DDR memory controllers or SRAM/QDR interfaces using the device’s logic density and high I/O count.
  • Signal Processing and DSP — Use the 18×18 multipliers and on-chip RAM for real-time filtering, transforms and fixed-point signal algorithms.
  • High-Speed I/O and Protocol Bridging — Leverage 624 I/Os and Virtex-II SelectIO capabilities for protocol bridging, SERDES front-ends or custom high-bandwidth links.
  • System Integration and Prototyping — Reconfigurable fabric and abundant resources make the device suitable for system prototyping and consolidation of multiple functions onto a single FPGA.

Unique Advantages

  • Substantial Logic Density: 24,192 logic elements enable consolidation of complex control, datapath and glue logic into a single device, reducing BOM count.
  • On-Chip Memory: Approximately 1.03 Mbits of embedded RAM reduces dependence on external memory for buffering and accelerates data-path performance.
  • Dedicated Arithmetic Blocks: 18×18 multipliers accelerate DSP tasks and fixed-point math without consuming general-purpose logic resources.
  • Flexible Clocking: DCMs and global clock resources (Virtex-II platform) support precise clock management and synchronization across large designs.
  • High I/O Count: 624 user I/Os support complex board-level interfacing, parallel buses and multiple memory channels.
  • Industrial Temperature Rating: −40 °C to 100 °C operating range suitable for industrial deployments requiring extended temperature performance.

Why Choose XC2V2000-5FF896I?

The XC2V2000-5FF896I delivers a balanced combination of logic capacity, embedded RAM and DSP resources in an industrial-grade Virtex-II FPGA package. With 2,688 CLBs (24,192 logic elements), approximately 1.03 Mbits of on-chip memory and 624 I/Os, it is well suited to designs that require significant programmable logic, substantial I/O bandwidth and integrated arithmetic acceleration.

Engineers and procurement teams will find this device appropriate for mid- to high-complexity digital systems where long-term availability, industrial operating range and RoHS compliance are priorities. The Virtex-II platform features such as DCMs, dedicated multipliers and segmented routing support scalable, performance-oriented designs.

Request a quote or submit a procurement inquiry today to evaluate the XC2V2000-5FF896I for your next design.

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