XC2V2000-5FGG676C

IC FPGA 456 I/O 676FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 456 1032192 676-BGA

Quantity 1,560 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BGANumber of I/O456Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2688Number of Logic Elements/Cells24192
Number of Gates2000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1032192

Overview of XC2V2000-5FGG676C – Virtex®-II FPGA IC 456 I/O 676-BGA

The XC2V2000-5FGG676C is a Virtex®-II platform Field Programmable Gate Array (FPGA) supplied in a 676-ball fine-pitch BGA package. It delivers a programmable logic fabric with 24,192 logic elements and approximately 1.03 Mbits of embedded memory, suited for designs that require dense logic, on-chip RAM and flexible I/O resources.

Built on the Virtex-II architecture, this commercial-grade device targets applications requiring abundant logic resources, dedicated arithmetic blocks and configurable I/O while operating within a 0 °C to 85 °C temperature range and a core voltage of 1.425 V to 1.575 V.

Key Features

  • Logic Capacity — 24,192 logic elements providing substantial programmable fabric for complex control, glue logic and datapath implementations.
  • Embedded Memory — Approximately 1.03 Mbits of on-chip RAM (total RAM bits: 1,032,192) to support buffering, FIFOs and local data storage without external memory in many use cases.
  • Arithmetic Resources — Series-level support for dedicated 18-bit × 18-bit multipliers and fast carry logic to accelerate multiply-accumulate and other arithmetic operations.
  • I/O Density — 456 user I/Os providing broad connectivity for external devices, memory interfaces and board-level signals.
  • Device Scale — Represents roughly 2,000,000 system gates of logic capacity, enabling mid-to-high density designs.
  • Clock Management (Series) — Virtex-II platform features include Digital Clock Manager (DCM) modules for precise clock de-skew and flexible frequency synthesis.
  • Package & Mounting — 676-ball fine-pitch BGA (676-FBGA, 27 × 27) in a surface-mount package for high pin-count board designs.
  • Power & Thermal — Core voltage specified at 1.425 V to 1.575 V; commercial operating temperature range 0 °C to 85 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • Memory Interface and Buffering — Use the device’s abundant I/O and embedded RAM to implement DDR/SDR interface logic, buffering and protocol bridges.
  • Data Path and Processing — Leverage dedicated multiplier blocks and logic capacity for arithmetic-heavy datapaths and realtime data processing functions.
  • High-Density Glue Logic — Consolidate multiple interface and control functions into a single FPGA to reduce board complexity and component count.
  • Custom I/O and Prototyping — 456 user I/Os enable flexible signal interfacing for prototyping and custom peripheral integration.

Unique Advantages

  • Substantial Logic and Memory in One Device: 24,192 logic elements and approximately 1.03 Mbits of embedded RAM reduce the need for external logic and memory components.
  • Rich I/O Count: 456 user I/Os provide the pin density required for complex board-level integration and multiple peripheral interfaces.
  • Dedicated Arithmetic Blocks: On-chip 18-bit × 18-bit multipliers speed implementation of DSP-style functions without discrete accelerators.
  • Proven Platform Features: Virtex-II platform capabilities such as digital clock management and SelectRAM memory hierarchy support advanced clocking and memory architectures.
  • RoHS Compliant: Meets RoHS requirements for lead-free assemblies and environmentally conscious production.
  • Commercial Temperature Range: Rated 0 °C to 85 °C for general-purpose and commercial applications.

Why Choose XC2V2000-5FGG676C?

The XC2V2000-5FGG676C combines a proven Virtex-II architecture with substantial logic capacity, embedded memory and a high I/O count, making it a solid choice for designers who need to implement complex logic, memory interfaces and arithmetic functions on a single device. Its commercial-grade operating range and RoHS compliance align with standard production workflows and board-level integration requirements.

This device is well suited to customers designing mid-to-high density FPGA solutions that benefit from the Virtex-II platform’s clock management and memory hierarchy while maintaining predictable power and thermal constraints driven by the specified core voltage and package.

Request a quote or submit your requirements to receive pricing and availability for the XC2V2000-5FGG676C. Our team will respond with delivery options and support for your design needs.

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