XC2V2000-5FGG676I

The XC2V2000-5FGG676I is a Virtex®-II platform FPGA in a 676-ball fine-pitch BGA package designed for industrial applications. It combines a dense logic fabric, embedded memory, dedicated arithmetic resources and a substantial I/O count to address demanding programmable-logic tasks.

Built on the Virtex-II architecture, the device is suited for designs that require on-chip RAM, high I/O density and flexible clock management while operating across an industrial temperature range and a defined core supply voltage window.

Key Features

• Logic Resources  2,688 CLBs and 24,192 logic elements provide the programmable fabric needed for medium-to-high density logic designs.
• Embedded Memory  Approximately 1.03 Mbits of on-chip RAM (1,032,192 total bits) for data buffering, FIFOs and local storage.
• Arithmetic Blocks  Dedicated 18-bit × 18-bit multiplier resources (Virtex-II series capability) for fixed-point and DSP-style operations.
• I/O Capacity  456 available I/O pins in the 676-FBGA (27×27) package to support wide parallel interfaces and mixed signaling.
• Performance-Oriented Clocking  Virtex-II platform clock management features such as Digital Clock Manager (DCM) functionality for deskew and frequency synthesis (series capability).
• Package & Mounting  676-FBGA (27×27) package, surface-mount mounting type for compact board implementation.
• Power & Temperature  Core supply: 1.425 V to 1.575 V; Operating temperature range: −40 °C to 100 °C (industrial grade).
• Standards & Compliance  RoHS compliant.

Typical Applications

• Memory Interface and Controllers  Used for designs that require robust DRAM/SRAM interfacing—Virtex-II platform features include high-performance external memory interfaces and selectable memory topologies.
• DSP and Signal Processing  On-chip 18-bit×18-bit multipliers and plentiful logic elements enable implementation of arithmetic- and pipeline-heavy signal-processing functions.
• High-Density I/O Systems  With 456 I/Os in a 676-BGA package, the device is suitable for applications needing wide parallel buses or multiple serial/parallel interfaces.

Unique Advantages

• Balanced Integration:  Combines thousands of logic elements with over 1 Mbit of embedded RAM to reduce external memory needs and simplify board-level design.
• Dedicated Arithmetic Resources:  Built-in 18×18 multipliers accelerate DSP kernels and offload fixed-point math from soft logic.
• Robust Clock Management:  Virtex-II clocking features such as DCMs support precise clock de-skew and flexible frequency synthesis for timing-critical designs.
• Industrial Temperature Range:  Specified operation from −40 °C to 100 °C addresses deployments in demanding environmental conditions.
• Compact, High-I/O Package:  676-FBGA (27×27) package delivers high I/O count in a small footprint for dense board layouts.
• Regulatory Compliance:  RoHS compliance supports environmentally-restricted designs and supply chains.

Why Choose XC2V2000-5FGG676I?

The XC2V2000-5FGG676I offers a practical combination of programmable logic, embedded memory and arithmetic blocks within an industrial-grade Virtex-II FPGA. Its mix of CLBs, memory and dedicated multipliers makes it well suited for mid-density FPGA roles where on-chip RAM and significant I/O are required.

Engineers looking for a field-programmable platform with defined voltage and temperature specifications, a high pin-count BGA package and series-proven clocking and memory architecture will find this device appropriate for applications ranging from memory interfacing and DSP to high-density I/O subsystems. The long-established Virtex-II architecture provides a stable foundation for deployable designs.

Request a quote or submit an inquiry to receive pricing, lead-time and availability information for the XC2V2000-5FGG676I. Our team can help confirm fit to your design and provide ordering details.