XC2V2000-4FGG676I

IC FPGA 456 I/O 676FBGA
Part Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 456 1032192 676-BGA

Quantity 658 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BGANumber of I/O456Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2688Number of Logic Elements/Cells24192
Number of Gates2000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1032192

Overview of XC2V2000-4FGG676I – Virtex®-II Field Programmable Gate Array (676-BGA)

The XC2V2000-4FGG676I is a Virtex®-II FPGA packaged in a 676-ball fine-pitch BGA designed for industrial applications. It combines a substantial logic fabric with embedded memory and flexible I/O to address logic- and memory-intensive designs.

Built on the Virtex-II platform architecture, this device targets applications requiring on-chip RAM, dedicated multiplier resources and robust clock management while operating across an extended industrial temperature range.

Key Features

  • Logic Capacity — 24,192 logic elements providing approximately 2,000,000 system gates for mid- to high-density FPGA implementations.
  • Embedded Memory — Approximately 1.03 Mbits of on-chip RAM (1,032,192 bits) for local buffering, FIFOs and distributed storage.
  • Dedicated Arithmetic — Virtex-II architecture includes 18-bit × 18-bit multiplier blocks useful for DSP and signal-processing functions.
  • Clock Management — Architecture-level Digital Clock Manager (DCM) resources and global clock multiplexing for flexible clock deskew and frequency control as provided by the Virtex-II family.
  • I/O — 456 user I/Os supporting high-density external interfacing; supported by the family’s SelectIO technology for multiple signaling standards.
  • Packaging & Mounting — 676-BGA surface-mount package; supplier device package listed as 676-FBGA (27×27) for compact board integration.
  • Power Supply — Core supply voltage range from 1.425 V to 1.575 V for supply planning and power sequencing.
  • Industrial Temperature Range — Specified operation from −40 °C to 100 °C for deployment in industrial environments.
  • RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

  • Industrial Control & Automation — Use for programmable logic, high-speed I/O handling and embedded control within industrial systems operating across an extended temperature range.
  • Signal Processing / DSP — Dedicated 18×18 multipliers and sizable on-chip RAM enable filtering, transforms and other DSP functions.
  • Memory Interface & Buffering — On-chip RAM and flexible I/O provide local buffering and interface logic for DRAM/SRAM controller front-ends and memory subsystems.
  • Networking & Communications — High I/O count and Virtex-II SelectIO features support protocol bridging, packet processing and interface logic for communication equipment.

Unique Advantages

  • Balanced Logic and Memory: A combination of 24,192 logic elements and approximately 1.03 Mbits of embedded RAM reduces reliance on external memory for many designs.
  • Built-in DSP Primitives: Integrated 18×18 multipliers accelerate arithmetic-heavy tasks and simplify implementation of signal-processing pipelines.
  • Flexible I/O Count: 456 user I/Os accommodate dense peripheral and bus connections, minimizing need for external translators or expanders.
  • Industrial Reliability: Specified operation from −40 °C to 100 °C and RoHS compliance make the device suitable for industrial deployment and environmental compliance planning.
  • Compact BGA Packaging: 676-FBGA (27×27) offers a high-pin-count solution in a surface-mount form factor for space-constrained PCBs.

Why Choose XC2V2000-4FGG676I?

The XC2V2000-4FGG676I delivers a practical balance of logic capacity, embedded memory and arithmetic resources within the Virtex-II platform, making it well suited for industrial and communications designs that require on-chip memory and flexible I/O. Its 676-BGA package and defined core-voltage range enable straightforward board-level integration while supporting industry-standard environmental requirements.

This device is appropriate for design teams seeking a stable, architecture-backed FPGA with integrated DSP and clock-management capabilities for mid-density systems where on-chip RAM and a high I/O count reduce external component count and system complexity.

Request a quote or submit an inquiry to receive availability and pricing information for the XC2V2000-4FGG676I. Our team can provide lead-time details and support for procurement and design planning.

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