XC2V2000-4BF957I

The XC2V2000-4BF957I is a Virtex®-II platform FPGA offered in a 957-ball flip-chip BGA (957-FCBGA, 40×40) package. It delivers large programmable logic capacity with 2,688 CLBs and 24,192 logic elements, approximately 1.03 Mbits of on-chip RAM, and 624 user I/O pins—designed for complex, high-density digital designs in industrial temperature environments.

Built on the Virtex-II architecture, this device provides integrated memory resources, dedicated multiplier blocks and clock management features described in the Virtex-II family specification, making it suitable for applications that require significant logic, memory and I/O integration while operating from a 1.425 V to 1.575 V supply.

Key Features

• Logic Capacity — 2,688 CLBs providing 24,192 logic elements and an architecture rated at approximately 2,000,000 system gates for high-density digital implementations.
• Embedded Memory — Total on-chip RAM of 1,032,192 bits (approximately 1.03 Mbits) for implementing frame buffers, FIFOs and embedded data structures.
• High I/O Count — 624 user I/Os to support wide external interfaces and high pin-count system integration.
• Arithmetic and DSP Resources — Virtex-II series includes dedicated 18-bit × 18-bit multiplier blocks and fast carry chains for arithmetic-intensive functions.
• Clock Management — Virtex-II family-level clock management features (including Digital Clock Manager modules and global clock multiplexer buffers) for flexible clocking and low-skew distribution.
• SelectRAM™ Memory Hierarchy — Series-level SelectRAM architecture provides block SelectRAM resources and distributed SelectRAM for dual-port RAM capabilities and flexible memory partitioning.
• Power and Supply — Single-core supply operating range from 1.425 V to 1.575 V (device core).
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C.
• Package and Assembly — 957-ball flip-chip BGA (957-FCBGA, 40×40) surface-mount package for dense board-level integration.
• RoHS Compliant — Meets RoHS requirements as specified in the product data.

Typical Applications

• High‑performance memory interfaces — Use the device's abundant I/O and embedded RAM to implement SDR/DDR or other external memory controllers and high-bandwidth buffering.
• Digital signal processing — Dedicated multiplier blocks and rich logic capacity support DSP tasks such as filtering, transforms and real‑time data processing.
• High‑density I/O systems — 624 user I/Os enable wide parallel buses, multi‑channel data capture, or complex interface aggregation for communication and networking equipment.
• Industrial control and automation — Industrial temperature grade and surface-mount packaging make the device suitable for embedded controllers, motor control front-ends and machine vision preprocessing.

Unique Advantages

• Substantial programmable resources: 2,688 CLBs and 24,192 logic elements provide significant headroom for complex state machines, datapaths and glue logic.
• Large embedded memory footprint: Approximately 1.03 Mbits of on-chip RAM reduces external memory dependence and simplifies board design for mid‑sized buffering and storage needs.
• Extensive I/O connectivity: 624 user I/Os support broad interfacing options without multiple external transceivers or expanders.
• Industrial thermal range: Rated from −40 °C to 100 °C for reliability in demanding environments.
• Package density for compact boards: 957-ball FCBGA (40×40) enables high pin count in a compact surface-mount form factor.
• Series-level system features: Virtex-II family capabilities such as SelectRAM, DCMs and dedicated multipliers provide design flexibility for memory, clocking and arithmetic functions.

Why Choose XC2V2000-4BF957I?

The XC2V2000-4BF957I balances high programmable logic and embedded memory with a large I/O complement in a single, surface-mount FCBGA package designed for industrial operation. Its combination of 24,192 logic elements, approximately 1.03 Mbits of on-chip RAM and 624 I/Os addresses mid- to high-density digital designs that need integrated memory, arithmetic resources and flexible clock management.

This device is appropriate for engineers building systems that require substantial on-chip resources and robust thermal performance, while leveraging the Virtex-II family architecture and development ecosystem referenced in the product specification.

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